公开(公告)号：JP2007052393A

公开(公告)日：2007-03-01

申请号：JP2005377502

申请日：2005-12-28

Applicant: Korea Electronics Technology Inst ,  コリア エレクトロニクス テクノロジ インスティチュート

Inventor： KIM WOO KYUNG ,  YANG WOO SEOK ,  LEE HAN YOUNG ,  LEE HYUNG MAN

IPC: G02F1/035

CPC classification number: G02F1/3558 ,  G02F1/2255

Abstract: PROBLEM TO BE SOLVED: To provide an integrated optical modulator which can minimize an influence of chromatic dispersion and has a more simplified configuration by connecting a carrier wave band modulator using a double sideband modulation method and an intermediate frequency band modulator using a single sideband modulation method in series, and to provide a method for manufacturing the integrated optical modulator. SOLUTION: The integrated optical modulator comprises the carrier wave band modulator using the double sideband modulation method and the intermediate frequency band modulator using the single sideband modulation method. The carrier wave band modulator and the intermediate frequency band modulator are connected in series. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 解决的问题：提供一种能够最小化色散影响的集成光调制器，并且通过使用双边带调制方法连接载波频带调制器和使用单个频带调制器的中频带调制器，具有更简化的配置 边带调制方法，并提供一种用于制造集成光调制器的方法。 解决方案：集成光调制器包括使用双边带调制方法的载波调制器和使用单边带调制方法的中频调制器。 载波调制器和中频带调制器串联连接。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：KR20100131793A

公开(公告)日：2010-12-16

申请号：KR20090050564

申请日：2009-06-08

Applicant: KOREA ELECTRONICS TECHNOLOGY

Inventor： LEE HYUNG MAN ,  LEE HAN YOUNG ,  YANG WOO SEOK ,  KIM WOO KYUNG

IPC: H01S5/20 ,  H01S5/00

CPC classification number: H01S5/2205 ,  G02B6/3838 ,  H01S3/10053 ,  H01S5/1237

Abstract: PURPOSE: A flexible fiber module, a variable device package thereof, and a manufacturing method thereof are provided to maximize a wavelength variable conversion efficiency by restricting the passing path of light in a micro region. CONSTITUTION: A light oscillation module of a wavelength conversion device package comprises a laser diode temperature control part(110), a laser diode heat emitting block(120), a laser diode mounting block(130), and a laser diode temperature measurement sensor(140). The light oscillation module comprises a laser diode chip and a laser diode power monitoring photo diode. A flexible fiber module(200) irradiates light which is emitted from the light oscillation module to a wavelength modulated light. A polarization inversion waveguide chip module comprises a polarization inversion waveguide chip(310), a polarization inversion waveguide chip mounting block(320), a temperature measurement sensor(330), and a polarization inversion chip temperature control part(350).

Abstract translation: 目的：提供柔性光纤模块及其可变装置封装及其制造方法，以通过限制微区域中的光通过路径来最大化波长可变转换效率。 构成：波长转换器件封装的光振荡模块包括激光二极管温度控制部分（110），激光二极管散热块（120），激光二极管安装块（130）和激光二极管温度测量传感器 140）。 光振荡模块包括激光二极管芯片和激光二极管功率监控光电二极管。 柔性纤维模块（200）将从光振动模块发射的光照射到波长调制光。 偏振反转波导芯片模块包括极化反转波导芯片（310），偏振反转波导芯片安装块（320），温度测量传感器（330）和极化反转芯片温度控制部分（350）。

公开(公告)号：KR20120073388A

公开(公告)日：2012-07-05

申请号：KR20100135135

申请日：2010-12-27

Applicant: KOREA ELECTRONICS TECHNOLOGY

Inventor： LEE HYUNG MAN

IPC: G02B5/20

CPC classification number: G02B5/26 ,  B29C33/3842 ,  B29D11/00634 ,  B81C2201/0132 ,  B81C2201/0152 ,  G02B5/207 ,  G02B26/0841

Abstract: PURPOSE: An electrostatic wavelength varying filter is provided to uniformly and widely control the thickness of the electrostatic wavelength varying filter by forming a spacer layer with UV imprinting or thermal imprinting mold process. CONSTITUTION: A membrane layer(120) is formed on a first substrate(110). A first high reflection filter layer(130) and a first electrode(140) are formed on the membrane layer. A part except for the first high reflection filter layer and the first electrode is eliminated. A spacer layer(170) is formed on a second substrate(150) with an imprinting mold process. A part of the spacer layer is depressed in order to be corresponded to the first high reflection filter layer. A second electrode is formed on a projected portion of the spacer layer. A device is formed by bonding the first substrate and the second substrate.

Abstract translation: 目的：提供静电波长变化滤光片，通过用UV印迹或热压印模具工艺形成间隔层，均匀且广泛地控制静电波长变化滤光片的厚度。 构成：在第一基板（110）上形成膜层（120）。 第一高反射滤光层（130）和第一电极（140）形成在膜层上。 消除了第一高反射滤光层和第一电极之外的部分。 间隔层（170）用压印模制法形成在第二基底（150）上。 为了与第一高反射滤光层对应，间隔层的一部分被压下。 第二电极形成在间隔层的突出部分上。 通过将第一基板和第二基板接合而形成器件。

公开(公告)号：KR20120073387A

公开(公告)日：2012-07-05

申请号：KR20100135128

申请日：2010-12-27

Applicant: KOREA ELECTRONICS TECHNOLOGY

Inventor： LEE HYUNG MAN

IPC: G02B5/20

CPC classification number: G02B5/26 ,  B29D11/00634 ,  G02B5/0841 ,  G02B5/285 ,  G03F7/0007

Abstract: PURPOSE: A method for manufacturing a wavelength varying filter is provided to uniformly and widely control the thickness of the wavelength varying filter by applying a wafer bonding process to a first substrate and a second substrate. CONSTITUTION: A membrane layer(121) is formed on a first substrate(110) in order to manufacture a heater membrane layer(120). A first high reflective filter layer(122) and a heater electrode(123) are formed on the membrane layer. A filter spacer layer(130) is formed on the first high reflective filter layer with an imprinting mold process. A second high reflective filter layer(150) is formed on a second substrate. A wafer bonding layer(160) is formed on the second high reflective filter layer. A device is formed by bonding the first substrate and the second substrate.

Abstract translation: 目的：提供一种用于制造波长变化滤波器的方法，以通过对第一基板和第二基板施加晶片接合工艺来均匀且广泛地控制波长可变滤波器的厚度。 构成：为了制造加热膜层（120），在第一基板（110）上形成膜层（121）。 第一高反射滤光层（122）和加热电极（123）形成在膜层上。 在第一高反射滤光层上用压印模制法形成滤光器隔离层（130）。 在第二基板上形成第二高反射滤光层（150）。 晶片接合层（160）形成在第二高反射滤光层上。 通过将第一基板和第二基板接合而形成器件。