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公开(公告)号:JPH0864907A
公开(公告)日:1996-03-08
申请号:JP19998995
申请日:1995-08-04
Applicant: KOREA ELECTRONICS TELECOMM
Inventor: RI SHIGEKI , CHIYOU TOUKUN , KIN TEISHIYU , BOKU KEIGEN
Abstract: PROBLEM TO BE SOLVED: To reduce leakage currents from the joint surface between a semiconductor substrate and the first current blocking layer and that due to thyristor structure. SOLUTION: Through a mask 29, a second clad layer 27, an active layer 25, a first clad layer 23, and a semiconductor substrate 21 are etched with a non-selective etching liquid so as to form a truncated cone. Then the layers 27, 23, and 21, except for the active layer 25 are selectively etched so as to accurately expose a crystal plane, in order that a first current blocking layer and a second current blocking layer are formed to cover the entire structure from the upper side surface of the second clad layer 27 to the upper surface of the semiconductor substrate 21.
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公开(公告)号:JPH06237046A
公开(公告)日:1994-08-23
申请号:JP31815993
申请日:1993-12-17
Applicant: KOREA ELECTRONICS TELECOMM
Inventor: BOKU SANYUU , RIYUU SHIHAN , BOKU KEIGEN , KIN KOUBAN , CHIYOU TOUKUN , RI SHIGEKI
Abstract: PURPOSE: To improve the performance characteristic of a semiconductor laser by bringing p-electrode metal stripes into contact with an ohmic contact layer in wide areas, making the ohmic contact resistance smaller, narrowing the width of a ridge, reducing heat generation and reducing an oscillation critical current. CONSTITUTION: A ridge is formed in a semiconductor epitaxial layer composed by forming an active layer 32, an optical waveguide layer 33, a clad layer 34, and an ohmic contact layer 35 successively on an n-InP substrate 31, and p-electrode metal stripes 38 having the same width with the width r of the upper layer of this ridge, a dielectric substance 38 having ohmic contact stripes of a width w (w
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