公开(公告)号：JPH0778900A

公开(公告)日：1995-03-20

申请号：JP15989494

申请日：1994-07-12

Applicant: KOREA ELECTRONICS TELECOMM

Inventor： KIN TOUKIYUU ,  SOU MINKEI ,  BOKU SEISHIYU ,  KIYOU SHIYOUKIYUU ,  IN KIYOUCHIN ,  BOKU KIYOUMO

IPC: H01L21/52 ,  H01L23/02 ,  H01L23/04 ,  H01L23/28 ,  H01L23/433 ,  H01L23/48 ,  H01L23/495 ,  H01L23/60 ,  H01L23/66

Abstract: PURPOSE: To provide a package structure for improving the high-frequency characteristics of an element, at the same time standardizing the assembly process for mass-production, and reducing the assembly cost of the element, and an element assembly method. CONSTITUTION: An assembly method includes a process for adhering a heat sink 7 to a lead frame 1, a process for eliminating a thermal stress that is generated from a power element chip 9 and the difference in a thermal coefficient of expansion, a process for manufacturing a lead for impedance matching to improve high-frequency characteristics and for shielding noises, and a process for performing plastic molding utilizing epoxy.