公开(公告)号：JPH05210577A

公开(公告)日：1993-08-20

申请号：JP23865192

申请日：1992-09-07

Applicant: KOREA ELECTRONICS TELECOMM

Inventor： KIN KIOU ,  RI MASASUZU ,  BOKU KIYOUMO ,  IN KIYOUCHIN ,  BOKU SHINSHIYU

IPC: G06F12/06 ,  G11C8/12

Abstract: PURPOSE: To provide a semiconductor device in which AN additional outside chip selection controlling circuit is not necessary in order to improve a chip selection terminal and to constitute a simple decoding circuit inside the semiconductor device. CONSTITUTION: A decoding logic circuit 40 equipped with plural chip selection terminal pairs or the like for selecting a single semiconductor element chip corresponding to the logical combination of an extended address is constituted inside the semiconductor element chip or the like. The decoding logic circuit 40 includes inside logic circuits 30 or the like in the same number as that of the selected semiconductor element chips or the like. Also, the decoding logic circuit 40 includes a module selection terminal (cs) for selecting the overall modules. The inside logic circuit 30 includes a first logic designating circuit 10a which maintains a prescribed logical state and a second logical state circuit 10b which maintains the logical state opposite to that of the first logic designating circuit 10a.

公开(公告)号：JPH06222290A

公开(公告)日：1994-08-12

申请号：JP28152693

申请日：1993-11-10

Applicant: KOREA ELECTRONICS TELECOMM

Inventor： BOKU GIYONRIYUU ,  BOKU SHINSHIYOU ,  KIN TOUKIYUU ,  IN KIYOUCHIN ,  BOKU TETSUJIYUN ,  SOU BINKEI

IPC: G02F3/00 ,  B81B3/00 ,  C03C17/36 ,  G02B26/02 ,  G02B27/00 ,  G09F9/37 ,  G09G3/20

Abstract: PURPOSE: To provide a fine pixel plane display which can represent static or dynamic video by using an optical switch, utilizing an electrostatic microactuator manufactured only by a semiconductor process. CONSTITUTION: A shutter-moving element 14 at an arbitrary position in a frame 15 is electrostatically charged in a belt-like shape by applying a select electrode 3 and a signal electrode 2 with voltages which are respectively higher and lower than the voltage of a common electrode 4. When an equilibrium state is reached, the voltage applied to the select line is inverted in polarity, in order and then the electric charges of the select electrode 3 change momentarily, but electric charges which accumulated on the side of the moving element 14 are unable to migrate immediately because of disturbance by the resistance. Consequently, a driving for which moves the moving element 14 to the right is generated, together with a repulsive force between the moving element 14 and select electrode 3, so that the shutter-moving element 14 moves to the right side.

公开(公告)号：JPH0778900A

公开(公告)日：1995-03-20

申请号：JP15989494

申请日：1994-07-12

Applicant: KOREA ELECTRONICS TELECOMM

Inventor： KIN TOUKIYUU ,  SOU MINKEI ,  BOKU SEISHIYU ,  KIYOU SHIYOUKIYUU ,  IN KIYOUCHIN ,  BOKU KIYOUMO

IPC: H01L21/52 ,  H01L23/02 ,  H01L23/04 ,  H01L23/28 ,  H01L23/433 ,  H01L23/48 ,  H01L23/495 ,  H01L23/60 ,  H01L23/66

Abstract: PURPOSE: To provide a package structure for improving the high-frequency characteristics of an element, at the same time standardizing the assembly process for mass-production, and reducing the assembly cost of the element, and an element assembly method. CONSTITUTION: An assembly method includes a process for adhering a heat sink 7 to a lead frame 1, a process for eliminating a thermal stress that is generated from a power element chip 9 and the difference in a thermal coefficient of expansion, a process for manufacturing a lead for impedance matching to improve high-frequency characteristics and for shielding noises, and a process for performing plastic molding utilizing epoxy.