SOFT AND/OR FLEXIBLE EMI SHIELDS AND RELATED METHODS
    1.
    发明申请
    SOFT AND/OR FLEXIBLE EMI SHIELDS AND RELATED METHODS 审中-公开
    软和/或柔性EMI屏蔽和相关方法

    公开(公告)号:WO2017019738A1

    公开(公告)日:2017-02-02

    申请号:PCT/US2016/044203

    申请日:2016-07-27

    CPC classification number: H05K9/003 H05K9/0026 H05K9/0043

    Abstract: According to various aspects, exemplary embodiments are disclosed of soft and/or flexible electromagnetic interference (EMI) shields. In an exemplary embodiment, a shield is suitable for use in providing EMI shielding for one or more components on a substrate. The shield generally includes one or more contacts configured for installation on the substrate and an electrically-conductive cover configured for installation on the contact(s).

    Abstract translation: 根据各个方面,公开了软和/或柔性电磁干扰(EMI)屏蔽的示例性实施例。 在示例性实施例中,屏蔽适用于为衬底上的一个或多个部件提供EMI屏蔽。 屏蔽件通常包括被配置为安装在基板上的一个或多个触点和被配置为安装在触点上的导电盖。

    FREQUENCY SELECTIVE STRUCTURES FOR SHIELDING OR MITIGATING EMI WITHIN OPEN OR CLOSED STRUCTURES
    4.
    发明申请
    FREQUENCY SELECTIVE STRUCTURES FOR SHIELDING OR MITIGATING EMI WITHIN OPEN OR CLOSED STRUCTURES 审中-公开
    在开放或封闭结构中屏蔽或减轻EMI的频率选择结构

    公开(公告)号:WO2014116703A1

    公开(公告)日:2014-07-31

    申请号:PCT/US2014/012551

    申请日:2014-01-22

    Abstract: According to various aspects, exemplary embodiments include one or more frequency selective structures (e.g., two-dimensional or three-dimensional frequency selective structure or surface, etc.), which may be used for shielding or mitigating EMI within open or closed structures. Also disclosed are methods of using one or more frequency selective structures for shielding or mitigating electromagnetic interface (EMI) within open or closed structures.

    Abstract translation: 根据各个方面,示例性实施例包括一个或多个频率选择结构(例如,二维或三维频率选择结构或表面等),其可用于屏蔽或减轻开放或闭合结构内的EMI。 还公开了使用一个或多个频率选择结构来屏蔽或减轻开放或封闭结构内的电磁接口(EMI)的方法。

    THERMALLY-CONDUCTIVE ELECTROMAGNETIC INTERFERENCE (EMI) ABSORBERS POSITIONED OR POSITIONABLE BETWEEN BOARD LEVEL SHIELDS AND HEAT SINKS
    8.
    发明申请
    THERMALLY-CONDUCTIVE ELECTROMAGNETIC INTERFERENCE (EMI) ABSORBERS POSITIONED OR POSITIONABLE BETWEEN BOARD LEVEL SHIELDS AND HEAT SINKS 审中-公开
    导热电磁干扰(EMI)吸收体定位或可定位在板级屏蔽和散热片之间

    公开(公告)号:WO2017065922A1

    公开(公告)日:2017-04-20

    申请号:PCT/US2016/052059

    申请日:2016-09-16

    CPC classification number: H05K9/0032 H01L23/36 H01L23/552 H05K7/20445

    Abstract: According to various aspects, exemplary embodiments are disclosed that include thermally-conductive EMI absorbers. In an exemplary embodiment, a thermally-conductive EMI absorber includes one or more portions disposed between a board level shield and a heat dissipation/removal structure. The thermally-conductive EMI absorber may be operable for attenuating EMI that propagates within the portions of the thermally-conductive EMI absorber between the board level shield and a heat dissipation/removal structure.

    Abstract translation: 根据各个方面,公开了包括导热EMI吸收器的示例性实施例。 在示例性实施例中,导热EMI吸收器包括设置在板级屏蔽和散热/去除结构之间的一个或多个部分。 导热EMI吸收器可操作用于衰减在板级屏蔽和散热/去除结构之间的导热EMI吸收器的部分内传播的EMI。

    FREQUENCY SELECTIVE STRUCTURES FOR EMI MITIGATION
    9.
    发明申请
    FREQUENCY SELECTIVE STRUCTURES FOR EMI MITIGATION 审中-公开
    用于EMI抑制的频率选择结构

    公开(公告)号:WO2017019948A1

    公开(公告)日:2017-02-02

    申请号:PCT/US2016/044672

    申请日:2016-07-29

    Abstract: According to various aspects, exemplary embodiments include one or more frequency selective structures ( e.g ., two-dimensional or three-dimensional frequency selective structure or surface, etc .), which may be used for shielding or mitigating EMI within open or closed structures. Also disclosed are methods of using one or more frequency selective structures for shielding or mitigating electromagnetic interface (EMI) within open or closed structures.

    Abstract translation: 根据各个方面,示例性实施例包括一个或多个频率选择结构(例如,二维或三维频率选择结构或表面等),其可用于屏蔽或减轻开放或闭合结构内的EMI。 还公开了使用一个或多个频率选择结构来屏蔽或减轻开放或封闭结构内的电磁接口(EMI)的方法。

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