SOFT AND/OR FLEXIBLE EMI SHIELDS AND RELATED METHODS
    1.
    发明申请
    SOFT AND/OR FLEXIBLE EMI SHIELDS AND RELATED METHODS 审中-公开
    软和/或柔性EMI屏蔽和相关方法

    公开(公告)号:WO2017019738A1

    公开(公告)日:2017-02-02

    申请号:PCT/US2016/044203

    申请日:2016-07-27

    CPC classification number: H05K9/003 H05K9/0026 H05K9/0043

    Abstract: According to various aspects, exemplary embodiments are disclosed of soft and/or flexible electromagnetic interference (EMI) shields. In an exemplary embodiment, a shield is suitable for use in providing EMI shielding for one or more components on a substrate. The shield generally includes one or more contacts configured for installation on the substrate and an electrically-conductive cover configured for installation on the contact(s).

    Abstract translation: 根据各个方面,公开了软和/或柔性电磁干扰(EMI)屏蔽的示例性实施例。 在示例性实施例中,屏蔽适用于为衬底上的一个或多个部件提供EMI屏蔽。 屏蔽件通常包括被配置为安装在基板上的一个或多个触点和被配置为安装在触点上的导电盖。

    FREQUENCY SELECTIVE STRUCTURES FOR SHIELDING OR MITIGATING EMI WITHIN OPEN OR CLOSED STRUCTURES
    2.
    发明申请
    FREQUENCY SELECTIVE STRUCTURES FOR SHIELDING OR MITIGATING EMI WITHIN OPEN OR CLOSED STRUCTURES 审中-公开
    在开放或封闭结构中屏蔽或减轻EMI的频率选择结构

    公开(公告)号:WO2014116703A1

    公开(公告)日:2014-07-31

    申请号:PCT/US2014/012551

    申请日:2014-01-22

    Abstract: According to various aspects, exemplary embodiments include one or more frequency selective structures (e.g., two-dimensional or three-dimensional frequency selective structure or surface, etc.), which may be used for shielding or mitigating EMI within open or closed structures. Also disclosed are methods of using one or more frequency selective structures for shielding or mitigating electromagnetic interface (EMI) within open or closed structures.

    Abstract translation: 根据各个方面,示例性实施例包括一个或多个频率选择结构(例如,二维或三维频率选择结构或表面等),其可用于屏蔽或减轻开放或闭合结构内的EMI。 还公开了使用一个或多个频率选择结构来屏蔽或减轻开放或封闭结构内的电磁接口(EMI)的方法。

    FREQUENCY SELECTIVE STRUCTURES FOR EMI MITIGATION
    5.
    发明申请
    FREQUENCY SELECTIVE STRUCTURES FOR EMI MITIGATION 审中-公开
    用于EMI抑制的频率选择结构

    公开(公告)号:WO2017019948A1

    公开(公告)日:2017-02-02

    申请号:PCT/US2016/044672

    申请日:2016-07-29

    Abstract: According to various aspects, exemplary embodiments include one or more frequency selective structures ( e.g ., two-dimensional or three-dimensional frequency selective structure or surface, etc .), which may be used for shielding or mitigating EMI within open or closed structures. Also disclosed are methods of using one or more frequency selective structures for shielding or mitigating electromagnetic interface (EMI) within open or closed structures.

    Abstract translation: 根据各个方面,示例性实施例包括一个或多个频率选择结构(例如,二维或三维频率选择结构或表面等),其可用于屏蔽或减轻开放或闭合结构内的EMI。 还公开了使用一个或多个频率选择结构来屏蔽或减轻开放或封闭结构内的电磁接口(EMI)的方法。

    CIRCUIT ASSEMBLIES AND RELATED METHODS
    6.
    发明申请
    CIRCUIT ASSEMBLIES AND RELATED METHODS 审中-公开
    电路组件及相关方法

    公开(公告)号:WO2016167854A1

    公开(公告)日:2016-10-20

    申请号:PCT/US2016/014739

    申请日:2016-01-25

    Abstract: In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.

    Abstract translation: 在示例性实施例中,电路组件可以设置在诸如板级屏蔽,中板,支架,精密金属部件等的导电结构上和/或由其支撑。例如,可以提供电路组件 在板级屏蔽的外顶表面上和/或支撑。 在示例性实施例中,组件通常包括被配置用于电子设备中的第一功能的导电结构。 导电层至少部分在导电结构上。 第一电气部件至少部分地在非导电层上并且被配置为限定用于与电子设备的一个或多个第二电气部件电连接的电路组件的至少一部分。 因此,导电结构可以被配置用于电子设备中的第二功能。

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