Abstract:
According to various aspects, exemplary embodiments are disclosed of soft and/or flexible electromagnetic interference (EMI) shields. In an exemplary embodiment, a shield is suitable for use in providing EMI shielding for one or more components on a substrate. The shield generally includes one or more contacts configured for installation on the substrate and an electrically-conductive cover configured for installation on the contact(s).
Abstract:
According to various aspects, exemplary embodiments include one or more frequency selective structures (e.g., two-dimensional or three-dimensional frequency selective structure or surface, etc.), which may be used for shielding or mitigating EMI within open or closed structures. Also disclosed are methods of using one or more frequency selective structures for shielding or mitigating electromagnetic interface (EMI) within open or closed structures.
Abstract:
The present invention discloses a thermal management and/or electromagnetic interference (EMI) mitigation material comprising a multilayer film structure defined by a plurality of layers having different filler densities per layer such that the multilayer film structure has differential filler loading within the layers and/or a filler density gradient that increases or decreases from a top layer to a bottom layer.
Abstract:
According to various aspects, exemplary embodiments include one or more frequency selective structures (e.g., two-dimensional or three-dimensional frequency selective structure or surface, etc.), which may be used for shielding or mitigating EMI within open or closed structures. Also disclosed are methods of using one or more frequency selective structures for shielding or mitigating electromagnetic interface (EMI) within open or closed structures.
Abstract:
According to various aspects, exemplary embodiments include one or more frequency selective structures ( e.g ., two-dimensional or three-dimensional frequency selective structure or surface, etc .), which may be used for shielding or mitigating EMI within open or closed structures. Also disclosed are methods of using one or more frequency selective structures for shielding or mitigating electromagnetic interface (EMI) within open or closed structures.
Abstract:
In exemplary embodiments, a circuit assembly may be provided on and/or supported by an electrically conductive structure, such as a board level shield, a midplate, a bracket, a precision metal part, etc. For example, a circuit assembly may be provided on and/or supported by an outer top surface of a board level shield. In an exemplary embodiment, an assembly generally includes an electrically conductive structure configured for a first functionality in the electronic device. An electrically nonconductive layer is on at least part of the electrically conductive structure. First electrical component(s) are at least partly on the electrically nonconductive layer and configured to define at least a portion of a circuit assembly for electrical connection with one or more second electrical components of the electronic device. The electrically conductive structure may thus be configured for a second functionality in the electronic device.
Abstract:
The present invention discloses a thermal management and/or electromagnetic interference (EMI) mitigation material comprising a multilayer film structure defined by a plurality of layers having different filler densities per layer such that the multilayer film structure has differential filler loading within the layers and/or a filler density gradient that increases or decreases from a top layer to a bottom layer.