公开(公告)号：WO2008027386A3

公开(公告)日：2008-08-21

申请号：PCT/US2007018924

申请日：2007-08-28

Applicant: LAM RES CORP ,  BOYD JOHN ,  DORDI YEZDI ,  ARUNAGIRI TIRUCHIRAPALLI ,  MOORING BENJAMIN W ,  PARKS JOHN ,  THIE WILLIAM ,  REDEKER FRITZ C ,  HOWALD ARTHUR M ,  SCHOEPP ALAN ,  HEMKER DAVID

Inventor： BOYD JOHN ,  DORDI YEZDI ,  ARUNAGIRI TIRUCHIRAPALLI ,  MOORING BENJAMIN W ,  PARKS JOHN ,  THIE WILLIAM ,  REDEKER FRITZ C ,  HOWALD ARTHUR M ,  SCHOEPP ALAN ,  HEMKER DAVID

IPC: H01L21/00 ,  H01L21/20

CPC classification number: H01L21/67184 ,  H01L21/67017 ,  H01L21/67207 ,  H01L21/67745

Abstract: A cluster architecture including a lab-ambient controlled transfer module that is coupled to one or more wet substrate processing modules The lab-ambient controlled transfer module and the one or more wet substrate processing modules manage a first ambient environment having a vacuum transfer module coupled to the lab-ambient controlled transfer module and one or more plasma processing modules The vacuum transfer module and the one or more plasma processing modules manage a second ambient environment A controlled ambient transfer module coupled to the vacuum transfer module and one or more ambient processing modules manage a third ambient environment The cluster architecture therefore enables controlled processing of the substrate in eith the first, second or third ambient environments, as well as dupng associated transitions The embodiments also provide for efficient methods for filling a trench of a substrate

Abstract translation: 一种集群架构，包括耦合到一个或多个湿式衬底处理模块的实验室环境受控传输模块。实验室环境受控传输模块和一个或多个湿衬底处理模块管理第一环境环境，其具有耦合到 实验室环境控制转移模块和一个或多个等离子体处理模块真空转移模块和一个或多个等离子体处理模块管理第二周围环境。耦合到真空转移模块的受控环境转移模块和一个或多个环境处理模块管理 第三环境环境因此，集群体系结构能够在第一，第二或第三环境环境中进行衬底的受控处理，以及重复相关的过渡。实施例还提供用于填充衬底的沟槽的有效方法

公开(公告)号：WO2004084266A3

公开(公告)日：2005-05-06

申请号：PCT/US2004007527

申请日：2004-03-10

Applicant: LAM RES CORP ,  LOHOKARE SHRIKANT P ,  BAILEY ANDREW D III ,  HEMKER DAVID ,  COOK JOEL M

Inventor： LOHOKARE SHRIKANT P ,  BAILEY ANDREW D III ,  HEMKER DAVID ,  COOK JOEL M

IPC: B44C1/22 ,  H01L20060101 ,  H01L21/302 ,  H01L21/304 ,  H01L21/311 ,  H01L21/321 ,  H01L21/3213 ,  H01L21/4763 ,  H01L21/768 ,  H01L33/00 ,  H01L21/4768

CPC classification number: H01L21/7684 ,  H01L21/31116 ,  H01L21/32115 ,  H01L21/32135 ,  H01L21/32136

Abstract: A system and method for planarizing a patterned semiconductor substrate (100) includes receiving a patterned semiconductor substrate. The patterned semiconductor substrate (100) having a conductive interconnect material (120) filling multiple of features in the pattern. The conductive interconnect material has an overburden portion (112). The overburden portion has a localized non-uniformity. A bulk portion of the overburden portion is removed to planarize the overburden portion (120). The substantially locally planarized overburden portion is mapped to determine a global non-uniformity. The substantially locally planarized overburden portion is etched to substantially remove the global non-uniformity.

Abstract translation: 用于平坦化图案化半导体衬底（100）的系统和方法包括接收图案化的半导体衬底。 图案化半导体衬底（100）具有填充图案中的多个特征的导电互连材料（120）。 导电互连材料具有覆盖层部分（112）。 覆盖层部分具有局部不均匀性。 去除覆盖层部分的主体部分以平坦化上覆层部分（120）。 映射基本上局部平坦化的覆盖层部分以确定全局不均匀性。 基本上局部平坦化的覆盖层部分被蚀刻以基本上去除全局不均匀性。

公开(公告)号：WO2004027411A8

公开(公告)日：2004-07-29

申请号：PCT/US0328433

申请日：2003-09-10

Applicant: LAM RES CORP

Inventor： GOTKIS YEHIEL ,  OWCZARZ ALEKSANDER ,  HEMKER DAVID ,  BRIGHT NICOLAS ,  KISTLER RODNEY

IPC: B24B37/04 ,  B24B49/02 ,  B24B49/10 ,  H01L21/321 ,  H01L21/66 ,  G01N27/72

CPC classification number: B24B37/042 ,  B24B49/02 ,  B24B49/10 ,  H01L21/3212 ,  H01L22/00

Abstract: A system and method of measuring a metallic layer on a substrate within a multi-step substrate process includes modifying a metallic layer on the substrate such as forming a metallic layer or removing at least a portion of the metallic layer. At least one sensor is positioned a predetermined distance from the surface of the substrate. The surface of the substrate is mapped to determine a uniformity of the metallic layer on the surface of the substrate.

Abstract translation: 在多步骤衬底工艺中测量衬底上的金属层的系统和方法包括改变衬底上的金属层，例如形成金属层或去除金属层的至少一部分。 至少一个传感器被定位在离基板表面预定距离处。 映射衬底的表面以确定衬底表面上的金属层的均匀性。

公开(公告)号：EP1604393A4

公开(公告)日：2009-11-11

申请号：EP04719313

申请日：2004-03-10

Applicant: LAM RES CORP

Inventor： LOHOKARE SHRIKANT P ,  BAILEY ANDREW D III ,  HEMKER DAVID ,  COOK JOEL M

IPC: B44C1/22 ,  H01L20060101 ,  H01L21/302 ,  H01L21/304 ,  H01L21/311 ,  H01L21/321 ,  H01L21/3213 ,  H01L21/4763 ,  H01L21/768 ,  H01L33/00

CPC classification number: H01L21/7684 ,  H01L21/31116 ,  H01L21/32115 ,  H01L21/32135 ,  H01L21/32136

公开(公告)号：EP1550152A4

公开(公告)日：2005-08-31

申请号：EP03761990

申请日：2003-06-23

Applicant: LAM RES CORP

Inventor： GOTKIS YEHIEL ,  KISTLER RODNEY ,  OWCZARZ ALEKSANDER ,  HEMKER DAVID ,  BRIGHT NICOLAS J

IPC: B24B1/00 ,  B24B37/013 ,  B24B57/02 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306 ,  H01L21/66 ,  H01L21/302 ,  B24B37/04

CPC classification number: B24B1/005 ,  B24B37/013 ,  B24B49/105 ,  B24B57/02 ,  H01L21/67253

Abstract: A semiconductor processing system is provided. The system includes a sensor configured to detect a signal representing a thickness of a film disposed on a surface of a substrate. A first nozzle configured to apply a first fluid to a surface of a polishing pad is included. A fluid restraining device located upstream from the first nozzle is provide. The fluid restraining device is configured to evenly distribute the slurry over the surface of the polishing pad. A second nozzle located upstream from the fluid restraining device is included. The second nozzle is configured to apply a second fluid to the evenly distributed slurry. A CMP system and a method for applying differential removal rates to a surface of a substrate are also provided.

公开(公告)号：WO2004084267A3

公开(公告)日：2006-02-23

申请号：PCT/US2004007530

申请日：2004-03-10

Applicant: LAM RES CORP ,  LOHOKARE SHRIKANT P ,  BAILEY ANDREW D III ,  HEMKER DAVID ,  COOK JOEL M

Inventor： LOHOKARE SHRIKANT P ,  BAILEY ANDREW D III ,  HEMKER DAVID ,  COOK JOEL M

IPC: H01L21/3105 ,  H01L21/321 ,  H01L21/3213 ,  H01L21/768 ,  H01L21/311

CPC classification number: H01L21/32135 ,  H01L21/32115 ,  H01L21/32136 ,  H01L21/7684

Abstract: A system and method for planarizing a patterned semiconductor substrate includes receiving a patterned semiconductor substrate (100). The patterned semiconductor substrate includes a conductive interconnect material (120) filling multiple of features (102, 104,106) in the pattern. The conductive interconnect material having an overburden portion (112). The overburden portion (112) includes a localized non-uniformity (indicated in variations 114, 116, 118). An additional layer (202) is formed an the overburden portion. The additional layer and the overburden portion are planarized. The planarizing process substantially entirely removes the additional layer.

Abstract translation: 用于平坦化图案化半导体衬底的系统和方法包括接收图案化的半导体衬底（100）。 图案化的半导体衬底包括以图案填充多个特征（102,104,106）的导电互连材料（120）。 所述导电互连材料具有覆盖层部分（112）。 覆盖层部分（112）包括局部不均匀性（在变化形式114,116,118中指示）。 附加层（202）形成为上覆层部分。 附加层和覆盖层部分被平坦化。 平坦化工艺基本上完全除去附加层。

公开(公告)号：WO2005003864A3

公开(公告)日：2005-04-14

申请号：PCT/US2004020332

申请日：2004-06-23

Applicant: LAM RES CORP ,  HEMKER DAVID ,  REDEKER FRED C ,  BOYD JOHN ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL

Inventor： HEMKER DAVID ,  REDEKER FRED C ,  BOYD JOHN ,  DE LARIOS JOHN M ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL

IPC: G03F7/20

CPC classification number: G03F7/70341 ,  Y10S134/902

Abstract: A method for processing a substrate is provided which includes generating a meniscus on the surface of the substrate and applying photolithography light through the meniscus to enable photolithography processing of a surface of the substrate.

Abstract translation: 提供一种用于处理基板的方法，其包括在基板的表面上产生弯月面并且通过弯月面施加光刻光以使得能够对基板的表面进行光刻处理。

公开(公告)号：EP1611599A4

公开(公告)日：2007-06-13

申请号：EP04719319

申请日：2004-03-10

Applicant: LAM RES CORP

Inventor： LOHOKARE SHRIKANT P ,  BAILEY ANDREW D III ,  HEMKER DAVID ,  COOK JOEL M

IPC: H01L21/321 ,  H01L21/3105 ,  H01L21/3213 ,  H01L21/768

CPC classification number: H01L21/32135 ,  H01L21/32115 ,  H01L21/32136 ,  H01L21/7684

Abstract: A system and method for planarizing a patterned semiconductor substrate includes receiving a patterned semiconductor substrate. The patterned semiconductor substrate having a conductive interconnect material filling multiple of features in the pattern. The conductive interconnect material having an overburden portion. The overburden portion includes a localized non-uniformity. An additional layer is formed an the overburden portion. The additional layer and the overburden portion are planarized. The planarizing process substantially entirely removes the additional layer.

公开(公告)号：EP1570363A4

公开(公告)日：2006-04-12

申请号：EP03808456

申请日：2003-12-11

Applicant: LAM RES CORP

Inventor： GOTKIS YEHIEL ,  KATZ VLADIMIR ,  HEMKER DAVID ,  KISTLER RODNEY ,  BRIGHT NICOLAS J

IPC: G05B23/02 ,  H01L21/66 ,  G06F15/00

CPC classification number: G05B23/0254 ,  H01L22/26

Abstract: A method for converting a slope based detection task to a threshold based detection task is provided. The method initiates with defining an approximation equation for a set of points corresponding to values of a process being monitored (140). Then, an expected value at a current point of the process being monitored is predicted (142). Next, a difference between a measured value at the current point of the process being monitored and the corresponding expected value is calculated (144). Then, the difference is monitored for successive points to detect a deviation value between the measured value and the expected value (146). Next, a transition point for the process being monitored is identified based on the detection of the deviation value (148). A processing system configured to provide real time data for a slope based transition and a computer readable media are also provided.

公开(公告)号：MY139592A

公开(公告)日：2009-10-30

申请号：MYPI20042487

申请日：2004-06-24

Applicant: LAM RES CORP

Inventor： HEMKER DAVID ,  REDEKER FRED C ,  BOYD JOHN ,  LARIOS JOHN M DE ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL

IPC: B08B3/10 ,  G03F7/20

Abstract: A METHOD FOR PROCESSING A SUBSTRATE IS PROVIDED WHICH INCLUDES GENERATING A MENISCUS (112) ON THE SURFACE OF THE SUBSTRATE (108) AND APPLYING PHOTOLITHOGRAPHY LIGHT THROUGH THE MENISCUS (112) TO ENABLE PHOTOLITHOGRAPHY PROCESSING OF A SURFACE OF THE SUBSTRATE (108).