Abstract:
An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.
Abstract:
An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the electrode.
Abstract:
PROBLEM TO BE SOLVED: To provide an electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. SOLUTION: The assembly includes an upper side showerhead electrode 110 attached mechanically to a receiving plate by a series of cam locks separated from one another. In a position 3 to 4 inches apart from the center of the showerhead electrode 110, a gasket comprising a projecting part thereon and having thermal conductivity and electrical conductivity is compressed between the showerhead electrode 110 and a receiving plate 140. The receiving plate is surrounded by a guard ring 170 and the guard ring 170 can be moved to a position where an opening in the guard ring 170 is aligned with an opening in the receiving plate, and in this position, it is possible to rotate the cam lock by equipment in order to release a lock pin extending from the top surface of the electrode. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
A HOT EDGE RING WITH EXTENDED LIFETIME COMPRISES AN ANNULAR BODY HAVING A SLOPED UPPER SURFACE.THE HOT EDGE RING INCLUDES A STEP UNDERLYING AN OUTER EDGE OF A SEMICONDUCTOR SUBSTRATE SUPPORTED IN A PLASMA PROCESSING CHAMBER WHEREIN PLASMA IS USED TO PROCESS THE SUBSTRATE. THE STEP INCLUDES A VERTICAL SURFACE WHICH SURROUNDS THE OUTER EDGE OF THE SUBSTRATE AND THE SLOPED UPPER SURFACE EXTENDS UPWARDLY AND OUTWARDLY FROM THE UPPER PERIPHERY OF THE VERTICAL SURFACE.
Abstract:
Anneau de bord chaud avec une durée de vie prolongée comprenant un corps annulaire ayant une surface supérieure en pente. L'anneau de bord chaud comprend un gradin sous-jacent d'un bord extérieur d'un substrat semi-conducteur supporté dans une chambre de traitement au plasma dans laquelle on utilise du plasma pour traiter le substrat. Le gradin comprend une surface verticale qui entoure le bord extérieur du substrat et la surface supérieure en pente s'étend vers le haut et vers l'extérieur à partir de la périphérie supérieure de la surface verticale. (Voir Figure 4).
Abstract:
A hot edge ring with extended lifetime comprises an annular body having a sloped upper surface. The hot edge ring includes a step underlying an outer edge of a semiconductor substrate supported in a plasma processing chamber wherein plasma is used to process the substrate. The step includes a vertical surface which surrounds the outer edge of the substrate and the sloped upper surface extends upwardly and outwardly from the upper periphery of the vertical surface.
Abstract:
AN ELECTRODE ASSEMBLY FOR A PLASMA REACTION CHAMBER USED IN SEMICONDUCTOR SUBSTRATE PROCESSING.THE ASSEMBLY INCLUDES AN UPPER SHOWERHEAD ELECTRODE WHICH IS MECHANICALLY ATTACHED TO A BACKING PLATE (140) BY A SERIES OF SPACED APART CAM LOCKS.A GUARD RING (170) SURROUNDS THE BACKING PLATE (140) AND IS MOVABLE TO POSITIONS AT WHICH OPENINGS IN THE GUARD RING (170) ALIGN WITH OPENINGS IN THE BACKING PLATE (140) SO THAT THE CAM LOCKS CAN BE ROTATED WITH A TOOL TO RELEASE LOCKING PINS EXTENDING FROM THE UPPER FACE OF THE ELECTRODE.
Abstract:
An electrode assembly for a plasma reaction chamber used in semiconductor substrate processing. The assembly includes an upper showerhead electrode which is mechanically attached to a backing plate by a series of spaced apart cam locks. A guard ring surrounds the backing plate and is movable to positions at which openings in the guard ring align with openings in the backing plate so that the cam locks can be rotated with a tool to release locking pins extending from the upper face of the showerhead electrode.