SYSTEMS AND METHODS FOR IN-SITU WAFER EDGE AND BACKSIDE PLASMA CLEANING

    公开(公告)号:SG10201800418RA

    公开(公告)日:2018-02-27

    申请号:SG10201800418R

    申请日:2014-07-18

    Applicant: LAM RES CORP

    Abstract: A lower electrode plate receives radiofrequency power. A first upper plate is positioned parallel to and spaced apart from the lower electrode plate. A grounded second upper plate is positioned next to the first upper plate. A dielectric support provides support of a workpiece within a region between the lower electrode plate and the first upper plate. A purge gas is supplied at a central location of the first upper plate. A process gas is supplied to a periphery of the first upper plate. The dielectric support positions the workpiece proximate and parallel to the first upper plate, such that the purge gas flows over a top surface of the workpiece so as to prevent the process gas from flowing over the top surface of the workpiece, and so as to cause the process gas to flow around a peripheral edge of the workpiece and below the workpiece.

    SYSTEMS AND METHODS FOR IN-SITU WAFER EDGE AND BACKSIDE PLASMA CLEANING

    公开(公告)号:SG10201404208SA

    公开(公告)日:2015-02-27

    申请号:SG10201404208S

    申请日:2014-07-18

    Applicant: LAM RES CORP

    Abstract: A lower electrode plate receives radiofrequency power. A first upper plate is positioned parallel to and spaced apart from the lower electrode plate. A grounded second upper plate is positioned next to the first upper plate. A dielectric support provides support of a workpiece within a region between the lower electrode plate and the first upper plate. A purge gas is supplied at a central location of the first upper plate. A process gas is supplied to a periphery of the first upper plate. The dielectric support positions the workpiece proximate and parallel to the first upper plate, such that the purge gas flows over a top surface of the workpiece so as to prevent the process gas from flowing over the top surface of the workpiece, and so as to cause the process gas to flow around a peripheral edge of the workpiece and below the workpiece.

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