CLUSTER TOOL PROCESS CHAMBER HAVING INTEGRATED HIGH PRESSURE AND VACUUM CHAMBERS
    1.
    发明申请
    CLUSTER TOOL PROCESS CHAMBER HAVING INTEGRATED HIGH PRESSURE AND VACUUM CHAMBERS 审中-公开
    集成高压和真空箱的工具车间

    公开(公告)号:WO2006039133A8

    公开(公告)日:2006-06-29

    申请号:PCT/US2005033508

    申请日:2005-09-21

    Applicant: LAM RES CORP

    Inventor: KROEKER TONY R

    CPC classification number: H01L21/67126 Y10S134/902

    Abstract: A cluster tool includes a transfer chamber connected to a plurality of vacuum chambers. An additional process chamber connected to the transfer chamber includes a high pressure chamber assembly seated on a housing. The high pressure chamber assembly, which is adjustable between an open position and a closed position, includes an upper chamber portion and a lower chamber portion. Hydraulic cylinders mounted on the upper chamber portion and having chamber rods that attach to the lower chamber portion are configured to move the lower chamber relative to the upper chamber portion between the two positions. When the two portions are brought together into the closed, the high pressure chamber assembly forms a high pressure chamber suitable for processing wafers with supercritical CO 2 . Once the high pressure chamber is formed, a region between lower chamber portion and a housing may be evacuated to form a vacuum chamber outside a portion of the high pressure chamber.

    Abstract translation: 集群工具包括连接到多个真空室的传送室。 连接到传送室的附加处理室包括坐在壳体上的高压室组件。 可在打开位置和关闭位置之间调节的高压室组件包括上室部分和下室部分。 安装在上室部分上并且具有连接到下腔室部分的腔室杆的液压缸构造成在两个位置之间相对于上腔室部分移动下腔室。 当两个部分合在一起进入关闭时,高压室组件形成适于处理具有超临界CO 2 2的晶片的高压室。 一旦形成高压室,可以将下室部分和壳体之间的区域抽真空,以在高压室的一部分外部形成真空室。

    METHODS AND SYSTEMS FOR PREVENTING FEATURE COLLAPSE DURING MICROELECTRONIC TOPOGRAPHY FABRICATION
    2.
    发明申请
    METHODS AND SYSTEMS FOR PREVENTING FEATURE COLLAPSE DURING MICROELECTRONIC TOPOGRAPHY FABRICATION 审中-公开
    用于防止微电子地形制造过程中的特征塌陷的方法和系统

    公开(公告)号:WO2010036575A3

    公开(公告)日:2010-06-03

    申请号:PCT/US2009057490

    申请日:2009-09-18

    CPC classification number: H01L21/31111 H01L21/02068 H01L21/31116

    Abstract: Methods and systems for preventing feature collapse subsequent to etching include adding a rinse liquid to a microelectronic topography having remnants of another rinse liquid arranged upon its surface and subsequently exposing the topography to a pressurized chamber including a fluid at or greater than critical pressure. The methods include flushing from the pressurized chamber liquid arranged upon the topography and, thereafter, venting the chamber in a manner sufficient to prevent liquid formation therein.

    Abstract translation: 用于防止蚀刻之后特征坍塌的方法和系统包括将冲洗液添加到具有布置在其表面上的另一冲洗液的残余物的微电子拓扑中,并且随后将该拓扑结构暴露于包括处于或高于临界压力的流体的加压室。 该方法包括从设置在形貌上的加压室液体中冲洗,然后以足以防止其中形成液体的方式排出室。

    CLUSTER TOOL PROCESS CHAMBER HAVING INTEGRATED HIGH PRESSURE AND VACUUM CHAMBERS
    3.
    发明申请
    CLUSTER TOOL PROCESS CHAMBER HAVING INTEGRATED HIGH PRESSURE AND VACUUM CHAMBERS 审中-公开
    集成高压和真空箱的工具车间

    公开(公告)号:WO2006039133A3

    公开(公告)日:2007-11-29

    申请号:PCT/US2005033508

    申请日:2005-09-21

    Applicant: LAM RES CORP

    Inventor: KROEKER TONY R

    CPC classification number: H01L21/67126 Y10S134/902

    Abstract: A cluster tool includes a transfer chamber connected to a plurality of vacuum chambers. An additional process chamber connected to the transfer chamber includes a high pressure chamber assembly seated on a housing. The high pressure chamber assembly, which is adjustable between an open position and a closed position, includes an upper and lower chamber portion. Hydraulic cylinders mounted on the upper chamber portion and having chamber rods that attach to the lower chamber portion are configured to move the lower chamber relative to the upper chamber portion between the two positions. When the two portions are in the closed position, the high pressure chamber assembly forms a high pressur chamber suitable for processing wafers with supercritical CO2. Once the high pressure chamber is formed, a region between lower chamber portion and a housing may be evacuated to form a vacuum chamber outside a portion of the high pressure chamber.

    Abstract translation: 集群工具包括连接到多个真空室的传送室。 连接到传送室的附加处理室包括坐在壳体上的高压室组件。 可在打开位置和关闭位置之间调节的高压室组件包括上部和下部腔室部分。 安装在上室部分上并且具有连接到下腔室部分的腔室杆的液压缸构造成在两个位置之间相对于上腔室部分移动下腔室。 当两个部分处于关闭位置时,高压室组件形成适于用超临界CO 2处理晶片的高压室。 一旦形成高压室,下室部分和壳体之间的区域可被抽真空,以在高压室的一部分外部形成真空室。

    ATMOSPHERIC WAFER TRANSFER MODULE WITH NEST FOR WAFER TRANSPORT ROBOT AND METHOD OF IMPLEMENTING SAME
    4.
    发明申请
    ATMOSPHERIC WAFER TRANSFER MODULE WITH NEST FOR WAFER TRANSPORT ROBOT AND METHOD OF IMPLEMENTING SAME 审中-公开
    带有运输机器人的大气波传输模块及其实施方法

    公开(公告)号:WO0101454A9

    公开(公告)日:2002-02-07

    申请号:PCT/US0040191

    申请日:2000-06-08

    Applicant: LAM RES CORP

    Abstract: A load lock wafer transfer face is provided at an acute angle with respect to a footprint dimension line, so the length of the footprint dimension line does not include the entire minimum length of the wafer transfer distance that must separate a robot from the wafer transfer face of a load lock. Two adjacent load locks provided for use with a robot have two load lock wafer transfer faces defining a nest, in that each such face is at an acute angle with respect to the footprint dimension line. A robot is mounted for rotation at a fixed location relative to wafer cassettes and to the nested load lock wafer transfer faces, avoiding use of a robot track to move transversely. Because the faces are at the acute angle, there is only a component of, and not the entire, minimum wafer transfer distance extending in the direction of the footprint dimension line. The robot is positioned at least partly in the nest formed by the adjacent load lock faces without requiring rotation of the base of the robot on a vertical axis at the same time as the arms of the robot are moved in an extend motion during wafer transfer into the load lock. The footprint of the modules may be substantially reduced, in that at least one dimension of the footprint is minimized, yet the robot may operate with only relatively simple extend motion to transfer the wafers into the load locks, avoiding more complex motions that include both transverse motion (i.e., on a linear track), and rotate motion.

    Abstract translation: 相对于占地面积尺寸线以锐角设置负载锁定晶片传送面,因此覆盖尺寸线的长度不包括必须将机器人与晶片传送面分开的晶片传送距离的整个最小长度 的加载锁。 提供用于机器人的两个相邻的加载锁具有两个限定嵌套的装载锁定晶片传送面,其中每个这样的面相对于印迹尺寸线处于锐角。 安装机器人以相对于晶片盒和固定的负载锁定晶片传送面在固定位置旋转,避免使用机器人轨道横向移动。 因为这些面是锐角,所以只有一部分的最小晶片传输距离在占用空间尺寸线的方向上延伸而不是整个。 机器人至少部分地位于由相邻的装载锁定面形成的座中,而不需要在机器人的臂在晶片转移期间以伸展运动移动的同时在垂直轴上旋转机器人的基座 加载锁定。 模块的占地面积可以大大降低,因为足迹的至少一个尺寸被最小化,但是机器人可以仅使用相对简单的延伸运动来操作以将晶片转移到负载锁中,从而避免更复杂的运动,包括横向 运动(即在线性轨迹上),并旋转运动。

    ATMOSPHERIC WAFER TRANSFER MODULE WITH NEST FOR WAFER TRANSPORT ROBOT AND METHOD OF IMPLEMENTING SAME
    5.
    发明申请
    ATMOSPHERIC WAFER TRANSFER MODULE WITH NEST FOR WAFER TRANSPORT ROBOT AND METHOD OF IMPLEMENTING SAME 审中-公开
    用于晶圆运输机器人的具有巢的大气晶圆转移模块及实施该方法的方法

    公开(公告)号:WO0101454A2

    公开(公告)日:2001-01-04

    申请号:PCT/US0040191

    申请日:2000-06-08

    Applicant: LAM RES CORP

    Abstract: A load lock wafer transfer face is provided at an acute angle with respect to a footprint dimension line, so the length of the footprint dimension line does not include the entire minimum length of the wafer transfer distance that must separate a robot from the wafer transfer face of a load lock. Two adjacent load locks provided for use with a robot have two load lock wafer transfer faces defining a nest, in that each such face is at an acute angle with respect to the footprint dimension line. A robot is mounted for rotation at a fixed location relative to wafer cassettes and to the nested load lock wafer transfer faces, avoiding use of a robot track to move transversely. Because the faces are at the acute angle, there is only a component of, and not the entire, minimum wafer transfer distance extending in the direction of the footprint dimension line. The robot is positioned at least partly in the nest formed by the adjacent load lock faces without requiring rotation of the base of the robot on a vertical axis at the same time as the arms of the robot are moved in an extend motion during wafer transfer into the load lock. The footprint of the modules may be substantially reduced, in that at least one dimension of the footprint is minimized, yet the robot may operate with only relatively simple extend motion to transfer the wafers into the load locks, avoiding more complex motions that include both transverse motion (i.e., on a linear track), and rotate motion.

    Abstract translation: 加载锁定晶片传送面相对于覆盖区尺寸线成锐角设置,因此覆盖区尺寸线的长度不包括必须将机器人与晶片传送面分开的晶片传送距离的整个最小长度 的加载锁。 提供与机器人一起使用的两个相邻的加载锁具有限定嵌套的两个加载锁定晶片传送面,其中每个这样的面相对于覆盖区尺寸线成锐角。 机器人被安装用于在相对于晶片盒和嵌套的负载锁定晶片传递面的固定位置旋转,避免使用机器人轨道横向移动。 因为这些面是锐角的,所以只有一部分(而不是整个)最小晶片传输距离在占地面积尺寸线的方向上延伸。 机器人至少部分地定位在由相邻加载锁定面形成的嵌套中,而不需要机器人在竖直轴线上的旋转,同时机器人的臂在晶片传送期间以伸展运动移动到竖直轴上 加载锁。 模块的占地面积可以显着减小,因为占地面积的至少一个尺寸被最小化,然而机器人可以仅用相对简单的伸展运动来操作以将晶片传送到负载锁中,从而避免更复杂的运动,其包括横向 运动(即,在线性轨道上)以及旋转运动。

    Dual-sided slot valve and method for implementing the same

    公开(公告)号:AU3610500A

    公开(公告)日:2000-10-16

    申请号:AU3610500

    申请日:2000-02-29

    Applicant: LAM RES CORP

    Abstract: A dual sided slot valve is in a vacuum body between adjacent process and transport modules. Separate valves are provided for each of two valve body slots, one body slot being separately closed or opened independently of the other. The separate valves allow a vacuum in the transport module while an adjacent process module is open to the atmosphere for servicing. The valve allows access to an open valve for servicing the open valve in that one actuator motor stops the valve in an open, but not vertically-spaced, position relative to the respective slot. The open valve is more easily reached by a gloved hand of a service worker. A separate actuator motor moves the valve vertically down from the open position and away from the slot to expose the sealing surface around the slot for cleaning. The vertical distance of the vertically-moved valve from an access opening makes it difficult for the worker's glove to reach the valve for service. However, in the vertically-moved position the valve does not interfere with the ability to clean around the valve door. The dual sided slot valves are offset relative to each other to reduce the distance occupied by the valve body between the adjacent transport and process modules.

    CLUSTER TOOL PROCESS CHAMBER HAVING INTEGRATED HIGH PRESSURE AND VACUUM CHAMBERS

    公开(公告)号:MY152897A

    公开(公告)日:2014-11-28

    申请号:MYPI20054575

    申请日:2005-09-28

    Applicant: LAM RES CORP

    Inventor: KROEKER TONY R

    Abstract: A CLUSTER TOOL (300, 400) INCLUDES A TRANSFER CHAMBER (302, 402) CONNECTED TO A PLURALITY OF VACUUM CHAMBERS. AN ADDITIONAL PROCESS CHAMBER (320, 420) CONNECTED TO THE TRANSFER CHAMBER (302, 402) INCLUDES A HIGH PRESSURE CHAMBER (322, 520) ASSEMBLY (520) SEATED ON A HOUSING (502). THE HIGH PRESSURE CHAMBER (322, 520) ASSEMBLY (520), WHICH IS ADJUSTABLE BETWEEN AN OPEN POSITION AND A CLOSED POSITION, INCLUDES AN UPPER CHAMBER PORTION (522) AND A LOWER CHAMBER PORTION (524). HYDRAULIC CYLINDERS MOUNTED ON THE UPPER CHAMBER PORTION (522) AND HAVING CHAMBER RODS THAT ATTACH TO THE LOWER CHAMBER PORTION (524) ARE CONFIGURED TO MOVE THE LOWER CHAMBER RELATIVE TO THE UPPER CHAMBER PORTION (522) BETWEEN THE TWO POSITIONS. WHEN THE TWO PORTIONS ARE BROUGHT TOGETHER INTO THE CLOSED, THE HIGH PRESSURE CHAMBER (322, 520) ASSEMBLY (520) FORMS A HIGH PRESSURE CHAMBER (322, 520) SUITABLE FOR PROCESSING WAFERS WITH SUPERCRITICAL CO2. ONCE THE HIGH PRESSURE CHAMBER (322, 520) IS FORMED, A REGION BETWEEN LOWER CHAMBER PORTION (524) AND A HOUSING (502) MAY BE EVACUATED TO FORM A VACUUM CHAMBER OUTSIDE A PORTION OF THE HIGH PRESSURE CHAMBER (322, 520). MOST ILLUSTRATIVE DRAWING:

    8.
    发明专利
    未知

    公开(公告)号:DE60036371T2

    公开(公告)日:2008-06-05

    申请号:DE60036371

    申请日:2000-02-29

    Applicant: LAM RES CORP

    Abstract: A dual sided slot valve is in a vacuum body between adjacent process and transport modules. Separate valves are provided for each of two valve body slots, one body slot being separately closed or opened independently of the other. The separate valves allow a vacuum in the transport module while an adjacent process module is open to the atmosphere for servicing. The valve allows access to an open valve for servicing the open valve in that one actuator motor stops the valve in an open, but not vertically-spaced, position relative to the respective slot. The open valve is more easily reached by a gloved hand of a service worker. A separate actuator motor moves the valve vertically down from the open position and away from the slot to expose the sealing surface around the slot for cleaning. The vertical distance of the vertically-moved valve from an access opening makes it difficult for the worker's glove to reach the valve for service. However, in the vertically-moved position the valve does not interfere with the ability to clean around the valve door. The dual sided slot valves are offset relative to each other to reduce the distance occupied by the valve body between the adjacent transport and process modules.

    ATMOSPHERIC WAFER TRANSFER MODULE WITH NEST FOR WAFER TRANSPORT ROBOT AND METHOD OF IMPLEMENTING SAME

    公开(公告)号:IL147278A

    公开(公告)日:2005-09-25

    申请号:IL14727800

    申请日:2000-06-08

    Applicant: LAM RES CORP

    Abstract: A load lock wafer transfer face is provided at an acute angle with respect to a footprint dimension line, so the length of the footprint dimension line does not include the entire minimum length of the wafer transfer distance that must separate a robot from the wafer transfer face of a load lock. Two adjacent load locks provided for use with a robot have two load lock wafer transfer faces defining a nest, in that each such face is at an acute angle with respect to the footprint dimension line. A robot is mounted for rotation at a fixed location relative to wafer cassettes and to the nested load lock wafer transfer faces, avoiding use of a robot track to move transversely. Because the faces are at the acute angle, there is only a component of, and not the entire, minimum wafer transfer distance extending in the direction of the footprint dimension line. The robot is positioned at least partly in the nest formed by the adjacent load lock faces without requiring rotation of the base of the robot on a vertical axis at the same time as the arms of the robot are moved in an extend motion during wafer transfer into the load lock. The footprint of the modules may be substantially reduced, in that at least one dimension of the footprint is minimized, yet the robot may operate with only relatively simple extend motion to transfer the wafers into the load locks, avoiding more complex motions that include both transverse motion (i.e., on a linear track) and rotate motion.

    ATMOSPHERIC WAFER TRANSFER MODULE WITH NEST FOR WAFER TRANSPORT ROBOT

    公开(公告)号:MY117518A

    公开(公告)日:2004-07-31

    申请号:MYPI20002973

    申请日:2000-06-29

    Applicant: LAM RES CORP

    Abstract: A LOAD LOCK WAFER TRANSFER FACE (216) IS PROVIDED AT AN ACUTE ANGLE WITH RESPECT TO A FOOTPRINT DIMENSION LINE (228), SO THE LENGTH OF A DISTANCE (230) ALONG THE FOOTPRINT DIMENSION LINE (228) DOES NOT INCLUDE THE ENTIRE MINIMUM LENGTH OF THE WAFER TRANSFER DISTANCE (127) THAT MUST SEPARATE A ROBOT (212) FROM THE WAFER TRANSFER FACE (216) OF A LOAD LOCK (204). TWO ADJACENT LOAD LOCKS (204) PROVIDED FOR USE WITH A ROBOT (212) HAVE TWO LOAD LOCK WAFER TRANSFER FACES (216) DEFINING A NEST (248), IN THAT EACH SUCH FACE (216) IS AT AN CUTE ANGLE WITH RESPECT TO THE FOOTPRINT DIMENSION LINE (228). A ROBOT (212) IS MOUNTED FOR ROTATION AT AFIXED LOCATION RELATIVE TO WAFER CASSETTES (210) AND TO THE NESTED LOAD LOCK WAFER TRANSFER FACES (216), AVOIDING USE OF A ROBOT TRACK (112) TO MOVE TRANSVERSELY. BECAUSE THE FACES (216) ARE AT ACUTE ANGLE, THERE IS ONLY A COMPONENT (232) OF, AND NOT THE ENTIRE, MINIMUM WAFER TRANSFER DISTANCE (127) EXTENDING IN THE DIRECTION OF THE FOOTPRINT DIMENSION LINE (228). THE ROBOT (212) IS POSITIONED AT LEAST PARTLY IN THE NEST (248) FORMED BY THE ADJACENT LOAD LOCK FACES (216) WITHOUT REQUIRING ROTATION OF THE BASE (260) OF THE ROBOT (212) ON A VERTICAL AXIS (214) AT THE SAME TIME AS THE ARMS OF THE ROBOT (212) ARE MOVED IN AN EXTEND MOTION DURING WAFER TRANSFER INTO THE LOAD LOCK (204). A FOOTPRINT OF A SYSTEM INCLUDING THE LOAD LOCKS MAY BE SUBSTANTIALLY REDUCED, IN THAT AT LEAST ONE DIMENSION OF THE FOOTPRINT IS MINIMIZED, YET THE ROBOT (212) MAY OPERATE WITH ONLY RELATIVELY SIMPLE EXTEND MOTION TO TRANSFER THE WAFER (208) INTO THE LOAD LOCKS (204), AVOIDING MORE COMPLEX MOTIONS THAT INCLUDE BOTH TRANSVERSE MOTION (I.E., ON A LINEAR TRACK) AND ROTATE MOTION.FIGURE 2A

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