Abstract:
A method for converting a slope based detection task to a threshold based detection task is provided. The method initiates with defining an approximation equation for a set of points corresponding to values of a process being monitored (140). Then, an expected value at a current point of the process being monitored is predicted (142). Next, a difference between a measured value at the current point of the process being monitored and the corresponding expected value is calculated (144). Then, the difference is monitored for successive points to detect a deviation value between the measured value and the expected value (146). Next, a transition point for the process being monitored is identified based on the detection of the deviation value (148). A processing system configured to provide real time data for a slope based transition and a computer readable media are also provided.
Abstract:
A semiconductor processing system is provided. The system includes a sensor configured to detect a signal representing a thickness of a film disposed on a surface of a substrate. A first nozzle configured to apply a first fluid to a surface of a polishing pad is included. A fluid restraining device located upstream from the first nozzle is provide. The fluid restraining device is configured to evenly distribute the slurry over the surface of the polishing pad. A second nozzle located upstream from the fluid restraining device is included. The second nozzle is configured to apply a second fluid to the evenly distributed slurry. A CMP system and a method for applying differential removal rates to a surface of a substrate are also provided.
Abstract:
A dual sided slot valve is in a vacuum body between adjacent process and transport modules. Separate valves are provided for each of two valve body slots, one body slot being separately closed or opened independently of the other. The separate valves allow a vacuum in the transport module while an adjacent process module is open to the atmosphere for servicing. The valve allows access to an open valve for servicing the open valve in that one actuator motor stops the valve in an open, but not vertically-spaced, position relative to the respective slot. The open valve is more easily reached by a gloved hand of a service worker. A separate actuator motor moves the valve vertically down from the open position and away from the slot to expose the sealing surface around the slot for cleaning. The vertical distance of the vertically-moved valve from an access opening makes it difficult for the worker's glove to reach the valve for service. However, in the vertically-moved position the valve does not interfere with the ability to clean around the valve door. The dual sided slot valves are offset relative to each other to reduce the distance occupied by the valve body between the adjacent transport and process modules.
Abstract:
A method for converting a slope based detection task to a threshold based detection task is provided. The method initiates with defining an approximation equation for a set of points corresponding to values of a process being monitored. Then, an expected value at a current point of the process being monitored is predicted. Next, a difference between a measured value at the current point of the process being monitored and the corresponding expected value is calculated. Then, the difference is monitored for successive points to detect a deviation value between the measured value and the expected value. Next, a transition point for the process being monitored is identified based on the detection of the deviation value. A processing system configured to provide real time data for a slope based transition and a computer readable media are also provided.
Abstract:
An interlocked control system is provided for dual sided slot valves contained in a vacuum body between each of a plurality of adjacent process and transport modules. Separate valves are provided for each of two valve body slots, one body slot being separately closed or opened independently of the other. The separate valves allow a vacuum in the transport module while an adjacent process module is open to the atmosphere for servicing. Under control of the system, the valve may allow separate operation of the transport module and certain ones of the process modules, while a selected one of the process modules is in either a maintenance state or a locked out state for servicing. The system includes a separate controller for the transport module and a separate controllers for the process modules. A control interface coordinates the flow of signals between the controllers and local devices, and system user interfaces provide inputs to the control system from operational and service personnel.
Abstract:
A dual sided slot valve is in a vacuum body between adjacent process and transport modules. Separate valves are provided for each of two valve body slots, one body slot being separately closed or opened independently of the other. The separate valves allow a vacuum in the transport module while an adjacent process module is open to the atmosphere for servicing. The valve allows access to an open valve for servicing the open valve in that one actuator motor stops the valve in an open, but not vertically-spaced, position relative to the respective slot. The open valve is more easily reached by a gloved hand of a service worker. A separate actuator motor moves the valve vertically down from the open position and away from the slot to expose the sealing surface around the slot for cleaning. The vertical distance of the vertically-moved valve from an access opening makes it difficult for the worker's glove to reach the valve for service. However, in the vertically-moved position the valve does not interfere with the ability to clean around the valve door. The dual sided slot valves are offset relative to each other to reduce the distance occupied by the valve body between the adjacent transport and process modules.
Abstract:
A METHOD AND AN APPARATUS FOR ENHANCEMENT OF THE EDDY CURRENT FOR MEASURING RESISTANCE-BASED FEATURES OF A SUBSTRATE IS PROVIDED. THE APPARATUS INCLUDES A SENSOR (210) CONFIGURED TO DETECT A SIGNAL PRODUCED BY AN EDDY CURRENT GENERATED ELECTROMAGNETIC FIELD. THE MAGNETIC FIELD ENHANCING SOURCE (218) IS POSITIONED TO THE ALTERNATIVE SIDE OF THE OBJECT UNDER MEASUREMENT RELATIVE TO THE SENSOR (210) TO ENABLE THE SENSITIVITY ENHANCING ACTION. THE SENSITIVITY ENHANCING SOURCE INCREASES THE INTENSITY OF THE EDDY CURRENT GENERATED IN THE OBJECT UNDER MEASUREMENT, AND AS A RESULT THE SENSITIVITY OF THE SENSOR (210). A SYSTEM ENABLED TO DETERMINE A THICKNESS OF A LAYER AND A METHOD FOR DETERMINING A RESISTANCE-BASED FEATURE CHARACTERISTIC ARE ALSO PROVIDED.
Abstract:
A method for detecting a thickness of a layer of a wafer to be processed is provided. The method includes defining a plurality of sensors configured to create a set of complementary sensors proximate the wafer. Further included in the method is distributing the plurality of sensors along a particular radius of the wafer such that each sensor of the plurality of sensors is out of phase with an adjacent sensor by a same angle. The method also includes measuring signals generated by the plurality of sensors. Further included is averaging the signals generated by the plurality of sensors so as to generate a combination signal. The averaging is configured to remove noise from the combination signal such that the combination signal is capable of being correlated to identify the thickness of the layer.
Abstract:
A system for processing a wafer is provided. The system includes a chemical mechanical planarization (CMP) tool. The CMP tool includes a wafer carrier defined within a housing. A carrier film is affixed to the bottom surface and supports a wafer. A sensor embedded in the wafer carrier. The sensor is configured to induce an eddy current in the wafer to determine a proximity and a thickness of the wafer. A cluster of sensors external to the CMP tool is included. The cluster of sensors is in communication with the sensor embedded in the wafer carrier and substantially eliminates a distance sensitivity. The cluster of sensors provides an initial thickness of the wafer to allow for a calibration to be performed on the sensor embedded in the wafer carrier. The calibration offsets variables causing inaccuracies in the determination of the thickness of the wafer during CMP operation. A method and an apparatus are also provided.
Abstract:
A dual sided slot valve is in a vacuum body between adjacent process and transport modules. Separate valves are provided for each of two valve body slots, one body slot being separately closed or opened independently of the other. The separate valves allow a vacuum in the transport module while an adjacent process module is open to the atmosphere for servicing. The valve allows access to an open valve for servicing the open valve in that one actuator motor stops the valve in an open, but not vertically-spaced, position relative to the respective slot. The open valve is more easily reached by a gloved hand of a service worker. A separate actuator motor moves the valve vertically down from the open position and away from the slot to expose the sealing surface around the slot for cleaning. The vertical distance of the vertically-moved valve from an access opening makes it difficult for the worker's glove to reach the valve for service. However, in the vertically-moved position the valve does not interfere with the ability to clean around the valve door. The dual sided slot valves are offset relative to each other to reduce the distance occupied by the valve body between the adjacent transport and process modules.