公开(公告)号：SG11202108294UA

公开(公告)日：2021-08-30

申请号：SG11202108294U

申请日：2020-01-28

Applicant: LAM RES CORP

Inventor： SIRARD STEPHEN M ,  LIMARY RATCHANA ,  PAN YANG ,  HYMES DIANE

IPC: H01L21/56 ,  C09D5/16 ,  H01L21/02

Abstract: A method for protecting a surface of a substrate during processing includes a) providing a solution forming a co-polymer having a ceiling temperature; b) dispensing the solution onto a surface of the substrate to form a sacrificial protective layer, wherein the co-polymer is kinetically trapped to allow storage at a temperature above the ceiling temperature; c) exposing the substrate to ambient conditions for a predetermined period; and d) de-polymerizing the sacrificial protective layer by using stimuli selected from a group consisting of ultraviolet (UV) light and heat.

公开(公告)号：SG2013075718A

公开(公告)日：2014-05-29

申请号：SG2013075718

申请日：2013-10-07

Applicant: LAM RES CORP

Inventor： SIRARD STEPHEN M ,  HYMES DIANE ,  SCHOEPP ALAN M ,  LIMARY RATCHANA

Abstract: An apparatus for delamination drying a substrate is provided. A chamber for receiving a substrate is provided. A chuck supports and clamps the substrate within the chamber. A temperature controller controls the temperature of the substrate and is able to cool the substrate. A vacuum pump is in fluid connection with the chamber. A tilting mechanism is able to tilt the chuck at least 90 degrees.