公开(公告)号：WO2012166727A3

公开(公告)日：2013-05-10

申请号：PCT/US2012039855

申请日：2012-05-29

Applicant: LAM RES CORP ,  SIRARD STEPHEN M ,  HYMES DIANE ,  SCHOEPP ALAN M

Inventor： SIRARD STEPHEN M ,  HYMES DIANE ,  SCHOEPP ALAN M

IPC: H01L21/302

CPC classification number: H01L21/02057 ,  H01L21/67034 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/67248 ,  H01L21/6831

Abstract: An apparatus for freeze drying a substrate is provided. A chamber for receiving a substrate is provided. An electrostatic chuck (ESC) for supporting and electrostatically clamping the substrate is within the chamber. A temperature controller controls the temperature of the electrostatic chuck. A condenser is connected to the chamber. A vacuum pump is in fluid connection with the chamber.

Abstract translation: 提供一种用于冷冻干燥基材的装置。 提供了用于接收基板的室。 用于支撑和静电夹持衬底的静电吸盘（ESC）在腔室内。 温度控制器控制静电卡盘的温度。 冷凝器连接到腔室。 真空泵与腔室流体连接。

公开(公告)号：SG11202108294UA

公开(公告)日：2021-08-30

申请号：SG11202108294U

申请日：2020-01-28

Applicant: LAM RES CORP

Inventor： SIRARD STEPHEN M ,  LIMARY RATCHANA ,  PAN YANG ,  HYMES DIANE

IPC: H01L21/56 ,  C09D5/16 ,  H01L21/02

Abstract: A method for protecting a surface of a substrate during processing includes a) providing a solution forming a co-polymer having a ceiling temperature; b) dispensing the solution onto a surface of the substrate to form a sacrificial protective layer, wherein the co-polymer is kinetically trapped to allow storage at a temperature above the ceiling temperature; c) exposing the substrate to ambient conditions for a predetermined period; and d) de-polymerizing the sacrificial protective layer by using stimuli selected from a group consisting of ultraviolet (UV) light and heat.

公开(公告)号：SG2013075718A

公开(公告)日：2014-05-29

申请号：SG2013075718

申请日：2013-10-07

Applicant: LAM RES CORP

Inventor： SIRARD STEPHEN M ,  HYMES DIANE ,  SCHOEPP ALAN M ,  LIMARY RATCHANA

Abstract: An apparatus for delamination drying a substrate is provided. A chamber for receiving a substrate is provided. A chuck supports and clamps the substrate within the chamber. A temperature controller controls the temperature of the substrate and is able to cool the substrate. A vacuum pump is in fluid connection with the chamber. A tilting mechanism is able to tilt the chuck at least 90 degrees.

公开(公告)号：AT397055T

公开(公告)日：2008-06-15

申请号：AT99907149

申请日：1999-02-18

Applicant: LAM RES CORP

Inventor： LI XU ,  ZHAO YUEXING ,  HYMES DIANE ,  DELARIOS JOHN

IPC: C09K13/00 ,  C11D1/00 ,  C09K13/02 ,  C09K13/04 ,  C09K13/06 ,  C09K13/08 ,  C11D3/02 ,  C11D7/02 ,  C11D7/04 ,  C11D7/08 ,  C11D7/26 ,  C11D11/00 ,  C23G1/10 ,  H01L21/02 ,  H01L21/304 ,  H01L21/306 ,  H01L21/308 ,  H01L21/3205 ,  H01L21/321

Abstract: A cleaning solution, method, and apparatus for cleaning semiconductor substrates after chemical mechanical polishing of copper films is described. The present invention includes a cleaning solution which combines deionized water, an organic compound, and an ammonium compound in an acidic pH environment for cleaning the surface of a semiconductor substrate after polishing a copper layer. Such methods of cleaning semiconductor substrates after copper CMP alleviate the problems associated with brush loading and surface and subsurface contamination.