METHOD AND SYSTEM FOR CENTERING WAFER ON CHUCK
    1.
    发明申请
    METHOD AND SYSTEM FOR CENTERING WAFER ON CHUCK 审中-公开
    用于在卡盘上定中晶片的方法和系统

    公开(公告)号:WO2010067284A2

    公开(公告)日:2010-06-17

    申请号:PCT/IB2009055503

    申请日:2009-12-04

    Abstract: A wafer handling mechanism is operated to place a wafer on a chuck. A chucking force is then applied to the wafer, whereby wafer support features of the chuck transfer a defect pattern onto a surface of the wafer. The surface of the wafer is analyzed by a defect metrology tool to obtain a mapping of the defect pattern transferred onto the surface of the wafer. A center coordinate of the chuck within a coordinate system of the wafer is determined by analyzing the defect pattern as transferred to the surface of the wafer. A spatial offset between the center coordinate of the chuck and the center of the wafer is determined. The spatial offset is used to adjust the wafer handling mechanism so as to enable alignment of the center of the wafer to the center coordinate of the chuck.

    Abstract translation: 操作晶片处理机构以将晶片放置在卡盘上。 然后将夹紧力施加到晶片,由此夹盘的晶片支撑特征将缺陷图案转移到晶片的表面上。 通过缺陷度量工具分析晶片的表面,以获得转移到晶片表面上的缺陷图案的映射。 通过分析传送到晶片表面的缺陷图案来确定晶片的坐标系内的卡盘的中心坐标。 确定卡盘的中心坐标和晶片的中心之间的空间偏移。 空间偏移用于调整晶片处理机构,以使晶片的中心能够对准卡盘的中心坐标。

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