公开(公告)号：MY144397A

公开(公告)日：2011-09-15

申请号：MYPI20045299

申请日：2004-12-22

Applicant: LAM RES CORP

Inventor： DAVIS GLENN W ,  WOODS CARL ,  PARKS JOHN ,  REDEKER FRED C ,  RAVKIN MIKE ,  ORBOCK MICHAEL L

IPC: B08B5/04 ,  H01L21/00 ,  H01L21/687

Abstract: AN APPARATUS FOR DRYING A SUBSTRATE (10) INCLUDES A VACUUM MANIFOLD (120) POSITIONED ADJACENT TO AN EDGE WHEEL (102). THE EDGE WHEEL INCLUDES AN EDGE WHEEL GROOVE (104) FOR RECEIVING A PERIPHERAL EDGE OF A SUBSTRATE, AND THE EDGE WHEEL IS CAPABLE OF ROTATING THE SUBSTRATE AT A DESIRED SET VELOCITY. THE VACUUM MANIFOLD INCLUDES A PROXIMITY END (126) HAVING ONE OR MORE VACUUM PORTS (128) DEFINED THEREIN. THE PROXIMITY END IS POSITIONED AT LEAST PARTIALLY WITHIN THE EDGE WHEEL GROOVE, AND USING SUPPLIED VACUUM REMOVES FLUIDS THAT ACCUMULATE IN THE EDGE WHEEL GROOVE AND PREVENTS RE-DEPOSIT OF TRAPPED FLUIDS AROUND THE PERIPHERAL EDGE OF THE SUBSTRATE.

公开(公告)号：IL176467A

公开(公告)日：2011-06-30

申请号：IL17646706

申请日：2006-06-21

Applicant: LAM RES CORP ,  REDEKER FRED C ,  DAVIS GLENN W ,  WOODS CARL ,  PARKS JOHN ,  RAVKIN MIKE ,  ORBOCK MICHAEL L

Inventor： REDEKER FRED C ,  DAVIS GLENN W ,  WOODS CARL ,  PARKS JOHN ,  RAVKIN MIKE ,  ORBOCK MICHAEL L

IPC: H01L21/00 ,  H01L21/687

Abstract: A apparatus for drying a substrate includes a vacuum manifold positioned adjacent to an edge wheel. The edge wheel includes an edge wheel groove for receiving a peripheral edge of a substrate, and the edge wheel is capable of rotating the substrate at a desired set velocity. The vacuum manifold includes a proximity end having one or more vacuum ports defined therein. The proximity end is positioned at least partially within the edge wheel groove, and using supplied vacuum removes fluids that accumulate in the edge wheel groove and prevents re-deposit of trapped fluids around the peripheral edge of the substrate.

公开(公告)号：DE602004023878D1

公开(公告)日：2009-12-10

申请号：DE602004023878

申请日：2004-12-20

Applicant: LAM RES CORP

Inventor： DAVIS GLENN W ,  WOODS CARL ,  PARKS JOHN ,  REDEKER FRED C ,  RAVKIN MIKE ,  ORBOCK MICHAEL L

IPC: H01L21/00 ,  H01L21/687

Abstract: A apparatus for drying a substrate includes a vacuum manifold positioned adjacent to an edge wheel. The edge wheel includes an edge wheel groove for receiving a peripheral edge of a substrate, and the edge wheel is capable of rotating the substrate at a desired set velocity. The vacuum manifold includes a proximity end having one or more vacuum ports defined therein. The proximity end is positioned at least partially within the edge wheel groove, and using supplied vacuum removes fluids that accumulate in the edge wheel groove and prevents re-deposit of trapped fluids around the peripheral edge of the substrate.

公开(公告)号：MY137807A

公开(公告)日：2009-03-31

申请号：MYPI20045236

申请日：2004-12-20

Applicant: LAM RES CORP

Inventor： BOYD JOHN M ,  ORBOCK MICHAEL L ,  REDEKER FRED C

IPC: H01L21/00

Abstract: A wafer preparation method is provided for producing a wet region and then a corresponding dry region on the wafer. Brushing produces the wet region on the wafer. As the brushing moves in a selected scan operation across the wafer, a generating operation forms a meniscus that follows the brushing and dries the wet region. The generating operation produces the meniscus at least partially surrounding the wet region scrubbed by the scrubbing. The controlled meniscus is formed by applying fluid to the surface of the wafer and simultaneously removing the fluid. The scan operations may be selected so the brushing scrubs the wet region and then the meniscus forms the dry region where the scrubbing took place. The scan operations include a radial scan, a linear scan, a spiral scan and a raster scan.