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    CONTROLLED AMBIENT SYSTEM FOR INTERFACE ENGINEERING
    1.
    发明申请
    CONTROLLED AMBIENT SYSTEM FOR INTERFACE ENGINEERING 审中-公开
    用于界面工程的控制环境系统

    公开(公告)号：WO2008027386A3

    公开(公告)日：2008-08-21

    申请号：PCT/US2007018924

    申请日：2007-08-28

    Applicant: LAM RES CORP ,  BOYD JOHN ,  DORDI YEZDI ,  ARUNAGIRI TIRUCHIRAPALLI ,  MOORING BENJAMIN W ,  PARKS JOHN ,  THIE WILLIAM ,  REDEKER FRITZ C ,  HOWALD ARTHUR M ,  SCHOEPP ALAN ,  HEMKER DAVID

    Inventor： BOYD JOHN ,  DORDI YEZDI ,  ARUNAGIRI TIRUCHIRAPALLI ,  MOORING BENJAMIN W ,  PARKS JOHN ,  THIE WILLIAM ,  REDEKER FRITZ C ,  HOWALD ARTHUR M ,  SCHOEPP ALAN ,  HEMKER DAVID

    IPC: H01L21/00 ,  H01L21/20

    CPC classification number: H01L21/67184 ,  H01L21/67017 ,  H01L21/67207 ,  H01L21/67745

    Abstract: A cluster architecture including a lab-ambient controlled transfer module that is coupled to one or more wet substrate processing modules The lab-ambient controlled transfer module and the one or more wet substrate processing modules manage a first ambient environment having a vacuum transfer module coupled to the lab-ambient controlled transfer module and one or more plasma processing modules The vacuum transfer module and the one or more plasma processing modules manage a second ambient environment A controlled ambient transfer module coupled to the vacuum transfer module and one or more ambient processing modules manage a third ambient environment The cluster architecture therefore enables controlled processing of the substrate in eith the first, second or third ambient environments, as well as dupng associated transitions The embodiments also provide for efficient methods for filling a trench of a substrate

    Abstract translation: 一种集群架构，包括耦合到一个或多个湿式衬底处理模块的实验室环境受控传输模块。实验室环境受控传输模块和一个或多个湿衬底处理模块管理第一环境环境，其具有耦合到 实验室环境控制转移模块和一个或多个等离子体处理模块真空转移模块和一个或多个等离子体处理模块管理第二周围环境。耦合到真空转移模块的受控环境转移模块和一个或多个环境处理模块管理 第三环境环境因此，集群体系结构能够在第一，第二或第三环境环境中进行衬底的受控处理，以及重复相关的过渡。实施例还提供用于填充衬底的沟槽的有效方法

    Method and device for transferring board using non-newtonian fluid
    3.
    发明专利
    Method and device for transferring board using non-newtonian fluid 有权
    使用非牛顿流体转移板的方法和装置

    公开(公告)号：JP2007053341A

    公开(公告)日：2007-03-01

    申请号：JP2006164313

    申请日：2006-06-14

    Applicant: Lam Res Corp ,  ラム リサーチ コーポレーションLam Research Corporation

    Inventor： DE LARIOS JOHN M ,  RAVKIN MIKE ,  PARKS JOHN ,  KOROLIK MIKHAIL ,  REDEKER FRED C

    IPC: H01L21/677 ,  B65G49/07 ,  B65G51/00 ,  H01L21/304

    CPC classification number: H01L21/67784 ,  H01L21/67057

    Abstract: PROBLEM TO BE SOLVED: To solve the problem that transferring a board with rollers and other mechanical devices may result in application of a large stress to the board, thus leading to the deterioration of the board.
    SOLUTION: A non-Newtonian fluid is provided to float the board in the non-Newtonian fluid capable of supporting the board. Subsequently, a supply force is added to the non-Newtonian fluid to cause the non-Newtonian fluid to flow so that the flow moves the board along a direction of the flow. This method applies to a device and a system that transfers the board using the non-Newtonian fluid.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题为了解决用辊和其他机械装置传送板的问题可能导致对板的施加大的应力，导致板的劣化。

    解决方案：提供非牛顿流体以将板漂浮在能够支撑板的非牛顿流体中。 随后，向非牛顿流体添加供应力以使非牛顿流体流动，使得流动沿着流动方向移动板。 此方法适用于使用非牛顿流体传输电路板的设备和系统。 版权所有（C）2007，JPO＆INPIT

    WAFER HEATING AND TEMPERATURE CONTROL BY BACKSIDE FLUID INJECTION
    4.
    发明申请
    WAFER HEATING AND TEMPERATURE CONTROL BY BACKSIDE FLUID INJECTION 审中-公开
    背面流体注射的加热和温度控制

    公开(公告)号：WO2006065532A3

    公开(公告)日：2007-04-19

    申请号：PCT/US2005043256

    申请日：2005-11-29

    Applicant: LAM RES CORP ,  MOORING BEN ,  PARKS JOHN ,  HYMES DIANE J

    Inventor： MOORING BEN ,  PARKS JOHN ,  HYMES DIANE J

    IPC: C23C16/00 ,  C23F1/00

    CPC classification number: H01L21/67109

    Abstract: In one of the many embodiments, an apparatus for processing a substrate is provided which includes a substrate processing chamber where the substrate is positioned within the substrate processing chamber so the substrate at least partially separates the substrate processing chamber into a first chamber and a second chamber. The apparatus further includes a first chamber inlet configured to input a first fluid of a first temperature into the first chamber at a first pressure and a second chamber inlet configured to input a second fluid of a second temperature into the second chamber at a second pressure wherein the first pressure and the second pressure are substantially equal. The second temperature is capable of being utilized to manage substrate temperature.

    Abstract translation: 在许多实施例中的一个实施例中，提供了一种用于处理衬底的装置，其包括衬底处理室，其中衬底位于衬底处理室内，使得衬底至少部分地将衬底处理室分离成第一腔室和第二腔室 。 该装置还包括第一室入口，其构造成在第一压力下将第一温度的第一流体输入到第一室中，并且第二室入口构造成在第二压力下将第二温度的第二流体输入到第二室中， 第一压力和第二压力基本相等。 第二个温度可以用来管理衬底温度。

    WAFER EDGE WHEEL WITH DRYING FUNCTION
    5.
    发明申请
    WAFER EDGE WHEEL WITH DRYING FUNCTION 审中-公开
    具有干燥功能的WAFER边缘轮

    公开(公告)号：WO2006039127A2

    公开(公告)日：2006-04-13

    申请号：PCT/US2005033301

    申请日：2005-09-16

    Applicant: LAM RES CORP ,  PARKS JOHN

    Inventor： PARKS JOHN

    IPC: F26B5/04

    CPC classification number: H01L21/67034 ,  H01L21/6838

    Abstract: An edge wheel for supporting and rotating a disk-shaped substrate includes a wheel body having a peripheral groove configured to support and edge of a substrate and at least one radial channel extending into said wheel body from said peripheral groove. An edge wheel dryer and a method for processing a disk-shaped substrate are also described.

    Abstract translation: 用于支撑和旋转盘形基板的边缘轮包括具有构造成支撑基板的边缘的周边槽和从所述外围槽延伸到所述车轮主体中的至少一个径向通道的车轮主体。 还描述了边缘轮干燥器和用于处理盘形基底的方法。

    CHAMBER AND ASSOCIATED METHODS FOR WAFER PROCESSING
    6.
    发明申请
    CHAMBER AND ASSOCIATED METHODS FOR WAFER PROCESSING 审中-公开
    用于波浪加工的室和相关方法

    公开(公告)号：WO2004093166A2

    公开(公告)日：2004-10-28

    申请号：PCT/US2004008994

    申请日：2004-03-23

    Applicant: LAM RES CORP ,  PARKS JOHN

    Inventor： PARKS JOHN

    IPC: B08B7/00 ,  H01L21/00 ,  H01L21/683 ,  H01L21/687

    CPC classification number: H01L21/67126 ,  B08B7/0021 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/67751 ,  H01L21/6838

    Abstract: A wafer processing chamber is provided for allowing a fluid flow and a fluid pressure within the chamber to be controlled in a variable manner. The chamber utilizes removable plates that can be configured to control the fluid flow and the fluid pressure in an inner volume within the chamber. Also, the removable plates can be used to separate the inner volume within the chamber from an outer volume within the chamber. Additionally, a wafer clamping apparatus is provided for use in the chamber. The wafer clamping apparatus uses a pressure differential between a top surface and a bottom surface of the wafer to pull the wafer toward a wafer support structure in contact with the wafer bottom surface, whereby the wafer is secured and maintained in an immobile state. Furthermore, high-pressure chamber configurations are provided.

    Abstract translation: 提供晶片处理室以允许以可变的方式控制腔室内的流体流动和流体压力。 该室利用可移动的板，其可被构造成控制腔内的内部体积中的流体流动和流体压力。 而且，可拆卸的板可用于将腔室内的体积与室内的外部容积分开。 此外，提供晶片夹紧装置用于室中。 晶片夹紧装置使用晶片的顶表面和底表面之间的压力差将晶片拉向与晶片底表面接触的晶片支撑结构，由此晶片被固定并保持在固定状态。 此外，还提供了高压室配置。

    Apparatus and system for cleaning substrate
    7.
    发明专利
    Apparatus and system for cleaning substrate 审中-公开
    用于清洁基板的装置和系统

    公开(公告)号：JP2007208247A

    公开(公告)日：2007-08-16

    申请号：JP2006353540

    申请日：2006-12-28

    Applicant: Lam Res Corp ,  ラム リサーチ コーポレーションLam Research Corporation

    Inventor： FREER ERIK M ,  DE LARIOS JOHN M ,  MIKHAYLICHENKO KATRINA ,  RAVKIN MICHAEL ,  KOROLIK MIKHAIL ,  REDEKER FRED C ,  THOMAS CLINT ,  PARKS JOHN

    IPC: H01L21/304

    CPC classification number: H01L21/67051 ,  B08B3/003 ,  B08B3/02

    Abstract: PROBLEM TO BE SOLVED: To provide a cleaning apparatus and a method thereof which can remove particulate contamination substance of a sufficiently small size, even if the substance has a shape of a high aspect ratio.
    SOLUTION: The apparatus for cleaning a substrate 116 is disclosed. The apparatus is provided with a first head unit 110 and a second head unit 112. The first head unit 110 is arranged proximate to the surface of the substrate and is provided with a first row of channels configured to supply a foam to the surface of the substrate. The second head unit 112 is arranged substantially adjacent to the first head unit and proximate to the surface of the substrate. The second head unit is provided with a second and a third row of channels. The second row of channels 112 is configured to supply a fluid to the surface of the substrate. The third row of channels 114 is configured to cause a vacuum to work on the surface of the substrate.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：即使该物质具有高纵横比的形状，也可提供能够去除足够小尺寸的微粒污染物质的清洁装置及其方法。 解决方案：公开了一种用于清洁衬底116的设备。 该设备设置有第一头单元110和第二头单元112.第一头单元110布置成靠近基底的表面，并且设置有第一排通道，其构造成将泡沫供应到 基质。 第二头单元112被布置成基本上与第一头单元相邻并且靠近衬底的表面。 第二头单元设置有第二和第三排通道。 第二排通道112构造成将流体供应到基板的表面。 第三排通道114构造成使真空在基板的表面上起作用。 版权所有（C）2007，JPO＆INPIT

    Proximity meniscus manifold
    8.
    发明专利
    Proximity meniscus manifold 有权
    临近男子名人录音

    公开(公告)号：JP2005340781A

    公开(公告)日：2005-12-08

    申请号：JP2005100378

    申请日：2005-03-31

    Applicant: Lam Res Corp ,  ラム リサーチ コーポレーションLam Research Corporation

    Inventor： WOODS CARL ,  SMITH MICHAEL G R ,  PARKS JOHN ,  GARCIA JAMES P ,  DE LARIOS JOHN M

    IPC: B05C9/02 ,  B05D1/00 ,  B05D3/12 ,  H01L21/00 ,  H01L21/02 ,  H01L21/027 ,  H01L21/304 ,  H01L21/306

    CPC classification number: H01L21/67063 ,  B05C9/02 ,  H01L21/02052 ,  H01L21/67023 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/6704 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S134/902

    Abstract: PROBLEM TO BE SOLVED: To reduce contamination and reduce wafer cleaning cost in semiconductor wafer processing.
    SOLUTION: Management of movement of a manifold carrier 104, movement of a secondary manifold 102, flow-in and drain of a fluid between a primary manifold 106 and the secondary manifold 102, and flow-in and drain of a fluid using a flow-in channel and a drain channel are managed by a fluid controller 250. The fluid controller 250 comprises any appropriate software and/or hardware that is executable of appropriate adjustment and movement required for monitoring wafer processing and processing a wafer 108 as required using the primary manifold 106, secondary manifold 102, and manifold carrier 104. The secondary manifold 102 further moves the primary manifold 106 to an opening 109.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：减少半导体晶片加工中的污染和降低晶圆清洗成本。 解决方案：管理歧管支架104的运动，辅助歧管102的运动，在主歧管106和次级歧管102之间的流体的流入和排出，以及流体的流入和排出，使用 流体通道和排出通道由流体控制器250管理。流体控制器250包括任何适当的软件和/或硬件，其可执行适当的调整和移动，用于根据需要监视晶片处理和处理晶片108所需的使用 主歧管106，次级歧管102和歧管载体104.次级歧管102进一步将主歧管106移动到开口109.版权所有：（C）2006，JPO＆NCIPI

    CONTROLLED AMBIENT SYSTEM FOR INTERFACE ENGINEERING
    10.
    发明专利
    CONTROLLED AMBIENT SYSTEM FOR INTERFACE ENGINEERING 未知

    公开(公告)号：SG10201501328WA

    公开(公告)日：2015-04-29

    申请号：SG10201501328W

    申请日：2007-08-28

    Applicant: LAM RES CORP

    Inventor： BOYD JOHN ,  DORDI YEZDI ,  ARUNAGIRI TIRUCHIRAPALLI ,  MOORING BENJAMIN W ,  PARKS JOHN ,  THIE WILLIAM ,  REDEKER FRITZ C ,  HOWALD ARTHUR M ,  SCHOEPP ALAN ,  HEMKER DAVID ,  CARL WOODS ,  HYUNGSUK ALEXANDER YOON ,  ALEKSANDER OWCZARZ

    Abstract: A cluster architecture including a lab-ambient controlled transfer module that is coupled to one or more wet substrate processing modules The lab-ambient controlled transfer module and the one or more wet substrate processing modules manage a first ambient environment having a vacuum transfer module coupled to the lab-ambient controlled transfer module and one or more plasma processing modules The vacuum transfer module and the one or more plasma processing modules manage a second ambient environment A controlled ambient transfer module coupled to the vacuum transfer module and one or more ambient processing modules manage a third ambient environment The cluster architecture therefore enables controlled processing of the substrate in eith the first, second or third ambient environments, as well as dupng associated transitions The embodiments also provide for efficient methods for filling a trench of a substrate

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