ULTRA-LOW ENERGY MICRO-FLUID EJECTION DEVICE
    1.
    发明申请
    ULTRA-LOW ENERGY MICRO-FLUID EJECTION DEVICE 审中-公开
    超低能量微流体喷射装置

    公开(公告)号:WO2006053221A3

    公开(公告)日:2007-03-01

    申请号:PCT/US2005040937

    申请日:2005-11-11

    Abstract: A micro-fluid ejection device for ultra-small droplet ejection and method of making a micro-fluid ejection device. The micro-fluid ejection device includes a semiconductor substrate containing a plurality of thermal ejection actuators disposed thereon. Each of the thermal ejection actuators includes a resistive layer and a protective layer for protecting a surface of the resistive layer. The resistive layer and the protective layer together define an actuator stack thickness. The actuator stack thickness ranges from about 500 to about 2000 Angstroms and provides an ejection energy per unit volume of from about 10 to about 20 gigajoules per cubic meter. A nozzle plate is attached to the semiconductor substrate to provide the micro-fluid ejection device.

    Abstract translation: 用于超小液滴喷射的微流体喷射装置和制造微流体喷射装置的方法。 微流体喷射装置包括含有多个设置在其上的热喷射致动器的半导体基板。 每个热喷射致动器包括电阻层和用于保护电阻层的表面的保护层。 电阻层和保护层一起限定致动器堆叠厚度。 致动器堆叠厚度范围为约500至约2000埃,并且每单位体积提供约10至约20千兆焦耳/立方米的喷射能量。 喷嘴板附接到半导体衬底以提供微流体喷射装置。

    LOW EJECTION ENERGY MICRO-FLUID EJECTION HEADS
    2.
    发明申请
    LOW EJECTION ENERGY MICRO-FLUID EJECTION HEADS 审中-公开
    低喷射能量微流体喷射头

    公开(公告)号:WO2006026333A3

    公开(公告)日:2006-12-07

    申请号:PCT/US2005030198

    申请日:2005-08-25

    Abstract: A micro-fluid ejection device structure and method therefor having improved low energy design. The devices includes a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAI, Ta2N, TaAI(O,N), TaA1Si, Ti(N,O), WSi(O,N), TaA1N, and TaAI/TaA1N. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

    Abstract translation: 一种具有改进的低能量设计的微流体喷射装置结构及其方法。 这些器件包括沉积在半导体衬底上的半导体衬底和绝缘层。 在绝缘层上形成多个加热电阻,该电阻层选自TaAI,Ta2N,TaAl(O,N),TaAlSi,Ti(N,O),WSi(O,N),TaAlN, 和TaAI / TaA1N。 选自可氧化金属并且具有约500至约5000埃的厚度的牺牲层沉积在多个加热电阻器上。 电极从第一金属导电层形成在牺牲层上,以提供与多个加热电阻器的阳极和阴极连接。 牺牲层在等离子体氧化过程中被氧化以在多个加热电阻器上提供流体接触层。

    IMPROVED INK JET PRINTHEADS
    3.
    发明申请
    IMPROVED INK JET PRINTHEADS 审中-公开
    改进的喷墨打印头

    公开(公告)号:WO2005021266B1

    公开(公告)日:2005-05-19

    申请号:PCT/US2004022823

    申请日:2004-07-15

    Abstract: An ink jet printer including a printer cartridge containing a printhead attached to a cartridge carriage for translation of the cartridge across a print media. The printer also includes an off carriage ink supply, a printer microprocessor, and a combined ink fill tube and electrical connection cable connected between the cartridge and the off carriage ink supply for providing refill ink to the ink cartridge and control of the carriage and printhead. Improvements to the printer enable low cost, high quality printing to be achieved.

    Abstract translation: 一种喷墨打印机,其包括打印机墨盒,所述打印机墨盒包含附接到墨盒托架的打印头,用于使墨盒在打印介质上平移。 该打印机还包括一个托架墨水源,一个打印机微处理器以及连接在墨盒和托架墨水源之间的组合墨水填充管和电连接电缆,用于向墨盒提供填充墨水并控制墨盒和打印头。 对打印机的改进可实现低成本,高质量的打印。

    PRINTED CONDUCTIVE CONNECTORS
    4.
    发明申请
    PRINTED CONDUCTIVE CONNECTORS 审中-公开
    打印导电连接器

    公开(公告)号:WO2006089026A2

    公开(公告)日:2006-08-24

    申请号:PCT/US2006005478

    申请日:2006-02-16

    Abstract: Methods of connecting a circuit device to a semiconductor substrate and micro- fluid ejection devices made by the methods. One method includes printing an elongate strip of an electrically conductive fluid to electrically interconnect a first contact pad on a semiconductor substrate containing fluid ejection actuator devices with a second contact pad on an electrical trace circuit, wherein the electrical trace circuit is disposed adjacent to and spaced-apart from the semiconductor substrate. The electrically conductive fluid contains a liquid component and a conductive particle component. The liquid component is removed from the conductive particle component to provide a solid elongate strip of conductive material interconnecting the first contact pad and the second contact pad.

    Abstract translation: 将电路器件连接到半导体衬底的方法和由该方法制成的微流体喷射装置。 一种方法包括印刷导电流体的细长条以将包含流体喷射致动器装置的半导体衬底上的第一接触焊盘与电迹线电路上的第二接触焊盘电互连,其中电迹线电路邻近并间隔开 从半导体衬底放置。 导电流体含有液体成分和导电性粒子成分。 将液体组分从导电颗粒组件移除以提供将第一接触垫和第二接触垫相互连接的导电材料的实心细长带。

    HEATER CHIP WITH DOPED DIAMOND-LIKE CARBON LAYER AND OVERLYING CAVITATION LAYER
    5.
    发明申请
    HEATER CHIP WITH DOPED DIAMOND-LIKE CARBON LAYER AND OVERLYING CAVITATION LAYER 审中-公开
    具有多层金刚石样碳层和覆盖层的加热片

    公开(公告)号:WO2004060676B1

    公开(公告)日:2005-05-19

    申请号:PCT/US0341245

    申请日:2003-12-24

    CPC classification number: B41J2/14129 B41J2202/03

    Abstract: An inkjet printhead heater chip has a silicon substrate with a heater stack formed of a plurality of thin film layers thereon for ejecting an ink drop during use. The thin film layers include: a thermal barrier layer on the silicon substrate; a resistor layer on the thermal barrier layer; a doped diamond-like carbon layer on the resistor layer; and a cavitation layer on the doped diamond-like carbon layer. The doped diamond-like carbon layer preferably includes silicon but may also include nitrogen, titanium, tantalum, combinations thereof or other. When it includes silicon, a preferred silicon concentration ranges from 20 to 25 atomic percent. A preferred cavitation layer includes an undoped diamond-like carbon, tantalum or titanium layer. The doped diamond-like carbon layer ranges in thickness from 500 to 3000 angstroms. The cavitation layer ranges from 500 to 6000 angstroms. Inkjet printheads and printers are also disclosed.

    Abstract translation: 喷墨打印头加热器芯片具有硅基板,其上具有由多个薄膜层形成的加热器叠层,用于在使用期间喷射墨滴。 薄膜层包括:硅衬底上的热障层; 在热障层上的电阻层; 在电阻器层上的掺杂类金刚石碳层; 和在掺杂类金刚石碳层上的空化层。 掺杂的类金刚石碳层优选包括硅,但也可以包括氮,钛,钽,它们的组合或其他。 当它包含硅时,优选的硅浓度范围从20到25原子百分比。 优选的空化层包括未掺杂的类金刚石碳,钽或钛层。 掺杂类金刚石碳层的厚度范围为500至3000埃。 空化层的范围从500到6000埃。 还公开了喷墨打印头和打印机。

    HEATER CHIP WITH DOPED DIAMOND-LIKE CARBON LAYER AND OVERLYING CAVITATION LAYER
    6.
    发明申请
    HEATER CHIP WITH DOPED DIAMOND-LIKE CARBON LAYER AND OVERLYING CAVITATION LAYER 审中-公开
    加热钻石与钻石相似的碳层和覆盖层

    公开(公告)号:WO2004060676A3

    公开(公告)日:2005-03-31

    申请号:PCT/US0341245

    申请日:2003-12-24

    CPC classification number: B41J2/14129 B41J2202/03

    Abstract: An inkjet printhead heater chip has a silicon substrate with a heater stack formed of a plurality of thin film layers thereon for ejecting an ink drop during use. The thin film layers include: a thermal barrier layer on the silicon substrate; a resistor layer on the thermal barrier layer; a doped diamond-like carbon layer on the resistor layer; and a cavitation layer on the doped diamond-like carbon layer. The doped diamond-like carbon layer preferably includes silicon but may also include nitrogen, titanium, tantalum, combinations thereof or other. When it includes silicon, a preferred silicon concentration ranges from 20 to 25 atomic percent. A preferred cavitation layer includes an undoped diamond-like carbon, tantalum or titanium layer. The doped diamond-like carbon layer ranges in thickness from 500 to 3000 angstroms. The cavitation layer ranges from 500 to 6000 angstroms. Inkjet printheads and printers are also disclosed.

    Abstract translation: 喷墨打印头加热器芯片具有硅衬底,其具有由其上的多个薄膜层形成的加热器堆叠,用于在使用期间喷射墨滴。 薄膜层包括:硅衬底上的热障层; 阻热层上的电阻层; 电阻层上的掺杂类金刚石碳层; 以及掺杂的类金刚石碳层上的空穴层。 掺杂的类金刚石碳层优选包括硅,但也可包括氮,钛,钽,其组合或其它。 当其包括硅时,优选的硅浓度范围为20至25原子%。 优选的空化层包括未掺杂的类金刚石碳,钽或钛层。 掺杂的类金刚石碳层的厚度范围为500至3000埃。 空化层的范围为500至6000埃。 还公开了喷墨打印头和打印机。

    INK JET PRINT HEAD HAVING OFFSET NOZZLE ARRAYS
    8.
    发明公开
    INK JET PRINT HEAD HAVING OFFSET NOZZLE ARRAYS 有权
    TINTENSTRAHLDRUCKKOPF MIT VERSETZTENDÜSENREIHEN

    公开(公告)号:EP1257422A4

    公开(公告)日:2003-05-21

    申请号:EP01906973

    申请日:2001-02-02

    Abstract: An ink jet printing apparatus includes a print head having a nozzle array (N1-N320) and which scans across the print medium in a scan direction. The nozzle array includes first and second substantially columnar nozzle arrays (34, 36), each aligned with a print medium advance direction. Each substantially columnar array has an upper subarray pair including an upper left and an upper right subarray of nozzles (C84, C83; C74, C73), each including a substantially linear arrangement of n nozzles having equal nozzle-to-nozzle spacings. Each upper right subarray is offset from the corresponding upper left subarray in the scan direction by a first spacing and in the print medium advance direction by one-half of the nozzle-to-nozzle spacing. The second substantially columnar array of offset from the first substantially columnar array in the second direction by a second spacing and in the print medium advance direction by one-forth of the nozzle-to-nozzle spacing.

    Abstract translation: 一种喷墨打印设备包括具有喷嘴阵列(N1-N320)并且在扫描方向上扫描打印介质的打印头。 喷嘴阵列包括第一和第二基本上柱状的喷嘴阵列(34,36),每个喷嘴阵列与打印介质前进方向对准。 每个基本上柱状阵列具有上部子阵列对,其包括喷嘴的上左和右上方阵列(C84,C83; C74,C73),每个喷嘴对应于具有相同喷嘴间距的n个喷嘴的基本线性排列。 每个右上方的子阵列在扫描方向上偏离相应的左上方子阵列第一间隔,并且在打印介质前进方向上偏离了喷嘴间距的一半。 第二基本上柱状阵列,其从第一大致圆柱阵列沿第二方向偏移第二间距,并且在打印介质前进方向上以喷嘴间距的四分之一偏移。

    IMPROVED MULTI-FLUID JETTING DEVICE
    9.
    发明公开
    IMPROVED MULTI-FLUID JETTING DEVICE 有权
    改进更多液体喷射装置

    公开(公告)号:EP1633566A4

    公开(公告)日:2008-11-12

    申请号:EP04752421

    申请日:2004-05-17

    CPC classification number: B41J3/36 B41J2/211

    Abstract: An improved multi-fluid jetting device. The jetting device includes a nozzle plate having a substantially planar surface for ejecting a fluid therefrom. The nozzle plate has at least 10 or more nozzles wherein groups of three adjacent nozzles are arranged in a triad orientation and wherein at least two adjacent nozzles in said triad orientation are coupled to two different fluid sources for fluid ejection from said adjacent nozzles substantially perpendicular to said nozzle plate surface.

    HEATER CHIP WITH DOPED DIAMOND-LIKE CARBON LAYER AND OVERLYING CAVITATION LAYER
    10.
    发明公开
    HEATER CHIP WITH DOPED DIAMOND-LIKE CARBON LAYER AND OVERLYING CAVITATION LAYER 审中-公开
    用掺杂的类金刚石碳的加热器片层,并且还空化

    公开(公告)号:EP1592559A4

    公开(公告)日:2008-10-08

    申请号:EP03814956

    申请日:2003-12-24

    CPC classification number: B41J2/14129 B41J2202/03

    Abstract: An inkjet printhead heater chip has a silicon substrate with a heater stack formed of a plurality of thin film layers thereon for ejecting an ink drop during use. The thin film layers include: a thermal barrier layer on the silicon substrate; a resistor layer on the thermal barrier layer; a doped diamond-like carbon layer on the resistor layer; and a cavitation layer on the doped diamond-like carbon layer. The doped diamond-like carbon layer preferably includes silicon but may also include nitrogen, titanium, tantalum, combinations thereof or other. When it includes silicon, a preferred silicon concentration ranges from 20 to 25 atomic percent. A preferred cavitation layer includes an undoped diamond-like carbon, tantalum or titanium layer. The doped diamond-like carbon layer ranges in thickness from 500 to 3000 angstroms. The cavitation layer ranges from 500 to 6000 angstroms. Inkjet printheads and printers are also disclosed.

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