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    TOUCH WINDOW
    6.
    发明申请
    TOUCH WINDOW 有权
    触摸窗口

    公开(公告)号：US20160004353A1

    公开(公告)日：2016-01-07

    申请号：US14793415

    申请日：2015-07-07

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Soung Kyu PARK ,  Chung Wan LEE ,  Do Youb KWON ,  Ji Chang RYU ,  Taek Hoon NAM ,  Jin Seok LEE ,  Jae Hak HER

    IPC: G06F3/044 ,  G06F3/0484 ,  G06F3/0488 ,  G06F3/0481

    CPC classification number: G06F3/044 ,  G06F2203/04102

    Abstract: A touch window includes a substrate comprising a first area and a second area, a wire electrode on the second area, an intermediate layer provided on the substrate to cover an end of the wire electrode, a sensing electrode on the intermediate layer, and a connection electrode to connect the sensing electrode with the wire electrode. The connection electrode is provided on the intermediate layer to connect the sensing electrode with the wire electrode.

    Abstract translation: 触摸窗包括包括第一区域和第二区域的基板，第二区域上的线电极，设置在基板上以覆盖线电极的端部的中间层，中间层上的感测电极，以及连接 电极将感应电极与线电极连接起来。 连接电极设置在中间层上，以将感测电极与线电极连接。

    CIRCUIT BOARD
    7.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号：US20240314937A1

    公开(公告)日：2024-09-19

    申请号：US18263621

    申请日：2021-04-26

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Hee Jung LEE ,  Jin Seok LEE ,  Yong Han JEON

    IPC: H05K3/28 ,  H05K1/11

    CPC classification number: H05K3/282 ,  H05K1/113 ,  H05K2201/09218 ,  H05K2203/1377

    Abstract: A circuit board according to an embodiment includes an insulating layer including a first region and a second region; a circuit pattern disposed on an upper surface of the first region and an upper surface of the second region of the insulating layer; and a solder resist including a first portion disposed on the upper surface of the first region of the insulating layer and a second portion disposed the upper surface of the second region; wherein a height of the first portion of the solder resist is smaller than a height of the circuit pattern, wherein a height of the second portion of the solder resist is greater than the height of the circuit pattern, wherein at least one of the first region and the second region is divided into a plurality of partial regions, wherein at least one of the first portion and the second portion of the solder resist has a different height in the plurality of partial regions.

    CIRCUIT BOARD
    10.
    发明申请
    CIRCUIT BOARD 有权

    公开(公告)号：US20230113302A1

    公开(公告)日：2023-04-13

    申请号：US17906166

    申请日：2021-03-12

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Yong Han JEON ,  Jin Seok LEE ,  Tae Ki KIM

    IPC: H05K1/11

    Abstract: A circuit board according to an embodiment includes an insulating layer; a circuit pattern disposed on an upper surface of the insulating layer; a first solder resist disposed on an upper surface of the insulating layer and having a height smaller than a height of the circuit pattern; and a second solder resist disposed on an upper surface of the first solder resist and including a first portion having an upper surface lower than an upper surface of the circuit pattern and a second. portion having an upper surface higher than the upper surface of the circuit pattern, wherein the circuit pattern includes: a plurality of first circuit patterns disposed on an upper surface of a first region of the insulating layer, and a plurality of second circuit patterns disposed on an upper surface of a second region of the insulating layer; wherein the first portion of the second solder resist is disposed between the plurality of first circuit patterns to have an upper surface lower than an upper surface of the first circuit pattern; and wherein the second portion of the second solder resist has an upper surface higher than an upper surface of the second circuit pattern, and is disposed to cover the plurality of second circuit patterns between the plurality of second circuit patterns.

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