公开(公告)号：JPH11311853A

公开(公告)日：1999-11-09

申请号：JP2094799

申请日：1999-01-29

Applicant: LUCENT TECHNOLOGIES INC

Inventor： CIRELLI RAYMOND ANDREW ,  DAVID LEE WINT

IPC: H01L21/027 ,  G03F1/26 ,  G03F1/68 ,  G03F1/80 ,  G03F1/08

Abstract: PROBLEM TO BE SOLVED: To obtain a phase shift lithography mask suitable, specially, to the ultraviolet lithography system by including a substrate which has at least one main surface and is transparent to radiation of wavelength λ and a carbon thin film which is arranged on the main surface and patterned to optical thickness corresponding to wavelength a half as long as λ. SOLUTION: This mask includes the substrate 20 transparent to wavelength λand is provided with one or plural areas 21 of a carbon thin film which are arranged at a part on the main surface of the substrate 20 and has an optical thickness of π rad to radiation of wavelength λ. The thickness of the carbon thin film is preferably selected so that it is sufficiently large that πrad phase variation and the amplitude of phase shift radiation minimize the effect of diffraction and at the same time transmission is made so as to maintain contrast. The main surface is divided into a phase shift part 21 and a part 22 where a phase shift thin film is absent. The patterns of the areas 21 and 22 are selected to prescribe the phase shift mask prescribing a circuit shape on a semiconductor substrate coated with resist.

公开(公告)号：JPH11317356A

公开(公告)日：1999-11-16

申请号：JP4084199

申请日：1999-02-19

Applicant: LUCENT TECHNOLOGIES INC

Inventor： CIRELLI RAYMOND ANDREW ,  MKRTCHYAN MASIS ,  TRIMBLE LEE EDWARD ,  WATSON GEORGE P ,  WINDT DAVID LEE

IPC: H01L21/027 ,  G03F7/20

Abstract: PROBLEM TO BE SOLVED: To optimize the depth of focus of an exposure, by selecting the size of a plurality of apertures of a filter element and their transmittance which is variable within a prescribed range, based on a comparison made between an intensity profile of radioactive rays based on a mask pattern and an intensity profile of radioactive rays that have transmitted through the filter element. SOLUTION: A plurality of apertures of a filter element 20 each have such a transmittance as to change from about zero to about 100 percent with respect to radioactive rays. By combining intensity profiles with respect to the radioactive rays which have transmitted through each part of the element 20, an intensity profile of the element 20 is modelled, and the modelled intensity profile is compared with a desired intensity profile based on a pattern of a mask 30. When both do no coincide, any of the transmittance, location and shape of one or more apertures of the element 20 is altered. The above process is repeated until the intensity profile modelled from the element 20 coincides with the desired intensity profile.

公开(公告)号：DE69900003D1

公开(公告)日：2000-06-08

申请号：DE69900003

申请日：1999-02-09

Applicant: LUCENT TECHNOLOGIES INC

Inventor： CIRELLI RAYMOND ANDREW ,  MKRTCHYAN MASIS ,  TRIMBLE LEE EDWARD ,  WATSON GEORGE PATRICK ,  WINDT DAVID LEE

IPC: H01L21/027 ,  G03F7/20

Abstract: A process for device fabrication is disclosed. In the process, optical lithography is used to introduce an image of a desired pattern into an energy sensitive material. In the process, a filter element (100) is provided. The filter element has at least two regions (110,120,130) of different transmittance, each region denominated an aperture. The regions are selected by obtaining information about the desired pattern and an optical lithographic tool that will be used to introduce the image of the desired pattern into the energy sensitive resist material. A filter element that provides an image that, when developed, will provide features with dimensions within acceptable process tolerances is then designed. The filter element is designed by modeling the effects of each aperture of the filter element on the intensity profile of an image of the desired pattern. The combined effect of the apertures is then determined. If required, an aspect (transmittance, orientation, dimension) of the one or more of the proposed apertures is adjusted to provide a modeled intensity profile that more closely corresponds to the desired lithographic result. Once the aspects of all apertures is determined, the filter element is fabricated and used in the optical lithographic process by placing the filter element in the optical lithography tool.

公开(公告)号：DE69900003T2

公开(公告)日：2001-01-11

申请号：DE69900003

申请日：1999-02-09

Applicant: LUCENT TECHNOLOGIES INC

Inventor： CIRELLI RAYMOND ANDREW ,  MKRTCHYAN MASIS ,  TRIMBLE LEE EDWARD ,  WATSON GEORGE PATRICK ,  WINDT DAVID LEE

IPC: H01L21/027 ,  G03F7/20

Abstract: A process for device fabrication is disclosed. In the process, optical lithography is used to introduce an image of a desired pattern into an energy sensitive material. In the process, a filter element (100) is provided. The filter element has at least two regions (110,120,130) of different transmittance, each region denominated an aperture. The regions are selected by obtaining information about the desired pattern and an optical lithographic tool that will be used to introduce the image of the desired pattern into the energy sensitive resist material. A filter element that provides an image that, when developed, will provide features with dimensions within acceptable process tolerances is then designed. The filter element is designed by modeling the effects of each aperture of the filter element on the intensity profile of an image of the desired pattern. The combined effect of the apertures is then determined. If required, an aspect (transmittance, orientation, dimension) of the one or more of the proposed apertures is adjusted to provide a modeled intensity profile that more closely corresponds to the desired lithographic result. Once the aspects of all apertures is determined, the filter element is fabricated and used in the optical lithographic process by placing the filter element in the optical lithography tool.