公开(公告)号：JP2000261219A

公开(公告)日：2000-09-22

申请号：JP2000056110

申请日：2000-03-01

Applicant: LUCENT TECHNOLOGIES INC

Inventor： FRYE ROBERT CHARLES ,  II REN ROO ,  TAI KING LIEN

IPC: H01P3/08 ,  H01P11/00 ,  H05K3/24

Abstract: PROBLEM TO BE SOLVED: To realize a method for improving sharpness of the edge of a conductive metal strip formed by thick film paste technique. SOLUTION: This method produces a hybrid thick film in order to produce a metallic strip line. For the purpose of obtaining a minute shape of the strip, a trim strip 42 of a thin film is formed so as to cover the end part of a thick film strip 17. Though electric characteristics of this line are mainly prescribed by bulk characteristics of materials of the thick film 17, the shape of the like is prescribed by the thin film trim strip.

公开(公告)号：JP2000049248A

公开(公告)日：2000-02-18

申请号：JP20518199

申请日：1999-07-19

Applicant: LUCENT TECHNOLOGIES INC

Inventor： DEGANI YINON ,  FRYE ROBERT CHARLES ,  II REN ROO

IPC: H01L23/12 ,  H01L23/498 ,  H01L23/50 ,  H05K1/18

Abstract: PROBLEM TO BE SOLVED: To provide an IC package where interconnection density can be improved. SOLUTION: A storage chip IC package has edge connectors 31 and 32, which extend to a base from the upper face of PWB14 along the edge and the sidewall of a cavity 15 for storing an IC chip 11, which is installed in a printed circuit board (PWB) 14. The edge connectors 31 and 32 operate as interconnection parts, instead of through-hole interconnection parts, and they improve mutual connection density. When the edge connectors 31 and 32 are used as interconnection parts for power and interconnection parts for ground, a signal I/O pad and a signal runner are insulated effectively.