公开(公告)号：JP2001144393A

公开(公告)日：2001-05-25

申请号：JP2000287891

申请日：2000-09-22

Applicant: LUCENT TECHNOLOGIES INC

Inventor： XU CHEN ,  JOSEPH ANTHONY ,  FAN CHONGLUN ,  SMITH BRIAN THOMAS ,  STACY BRUCE F

IPC: H05K1/09 ,  C25D5/12 ,  C25D7/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/22 ,  H05K3/24 ,  H05K3/28 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board and a manufacturing method thereof. SOLUTION: In this printed circuit board, comprising a board with a conductive trace thereon and a multipurpose final finished layer containing palladium alloy, the palladium forms an alloy with cobalt or platinum group metal, and the palladium alloy is formed at least in a part of the conductive trace, and forms both a noncontact final finished layer and a contact final finished layer of a printed circuit board.

公开(公告)号：DE60042514D1

公开(公告)日：2009-08-20

申请号：DE60042514

申请日：2000-09-11

Applicant: LUCENT TECHNOLOGIES INC

Inventor： ABYS JOSEPH A ,  FAN CHONGLUN ,  SMITH BRIAN T ,  STACY BRUCE F ,  XU CHEN

IPC: H05K1/09 ,  H05K3/24 ,  C25D5/12 ,  C25D7/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/22 ,  H05K3/28 ,  H05K3/38

Abstract: A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.