公开(公告)号：JP2002339097A

公开(公告)日：2002-11-27

申请号：JP2002135188

申请日：2002-05-10

Applicant: LUCENT TECHNOLOGIES INC

Inventor： ABYS JOSEPH A ,  FAN CHONGLUN ,  XU CHEN ,  ZHANG YUN

IPC: C25D5/50 ,  C23C26/00 ,  C23C28/00 ,  C23C28/02 ,  C25D7/00 ,  H01L23/495 ,  H01L23/50 ,  H01R13/03 ,  C25D7/12

Abstract: PROBLEM TO BE SOLVED: To prevent production of whiskers on tin coated metallic products. SOLUTION: A metallic substrate is coated with a tin or tin alloy layer subjected to surface doping in order to suppress the growth of tin whiskers. A metallic ground surface layer is arbitrarily selectively arranged between the substrate and the tin. In an exemplary embodiment, the metallic substrate contains the nickel surface layer and the copper alloy formed by coating gold or palladium with the tin layer subjected to surface doping. The doping suppresses the growth of the whiskers and eventually the structure is particularly effective as an electrical connector or a lead frame.

公开(公告)号：DE60042514D1

公开(公告)日：2009-08-20

申请号：DE60042514

申请日：2000-09-11

Applicant: LUCENT TECHNOLOGIES INC

Inventor： ABYS JOSEPH A ,  FAN CHONGLUN ,  SMITH BRIAN T ,  STACY BRUCE F ,  XU CHEN

IPC: H05K1/09 ,  H05K3/24 ,  C25D5/12 ,  C25D7/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/22 ,  H05K3/28 ,  H05K3/38

Abstract: A printed wiring board (PWB) and a method of manufacturing the same. In one embodiment, the PWB includes: (1) a substrate having a conductive trace located thereon and (2) a multi-purpose finish including palladium alloy where palladium is alloyed with cobalt or a platinum group metal and is located on at least a portion of the conductive trace, which forms both a non-contact finish and a contact finish for the PWB.