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    Non-volatile mems micro-relays using magnetic actuators
    2.
    发明公开
    Non-volatile mems micro-relays using magnetic actuators 有权
    非易失性MEMS微动继电器使用磁性致动器

    公开(公告)号：EP1093141A3

    公开(公告)日：2003-04-09

    申请号：EP00308867.1

    申请日：2000-10-09

    Applicant: LUCENT TECHNOLOGIES INC.

    Inventor： Bishop, David John ,  Jin, Sungho ,  Kim, Jungsang ,  Ramirez, Ainissa G.

    IPC: H01H50/00

    CPC classification number: H01H50/005 ,  H01H2050/007 ,  H02K99/20 ,  Y10S310/06

    Abstract: An actuation device employing square-loop latchable magnetic material (14, 16) having a magnetization direction (polarization) capable of being changed in response to exposure to an external magnetic field is disclosed. The magnetic field is created by a conductor assembly with non-solenoid configuration. Once the magnetization direction of the material is so changed, the external magnetic field is no longer required to maintain the new magnetization direction. The latchable magnetic material (14) is disposed on the mobile electrode (20) of a switching device, and another magnetic material (16) is disposed in spaced relation to the latchable magnetic material on a stationary electrode or surface (28). By applying an electrical current to a conductor assembly arranged proximate the latchable material, a magnetic field is created about the latchable magnetic material, to change the magnetization direction and thereby enable the attraction or repulsion of another magnetic material located on the stationary electrode. The resulting relative displacement of the mobile (20) and stationary (18) electrodes effects the selective connection or disconnection of electrical contacts carried on or associated with the respective electrodes of the actuation device without requiring additional power in order to maintain the switched state of the electrodes.

    Article comprising improved noble metal-based alloys and method for making the same
    4.
    发明公开
    Article comprising improved noble metal-based alloys and method for making the same 审中-公开
    制品具有改进的贵金属基合金和制造工艺

    公开(公告)号：EP1096523A3

    公开(公告)日：2003-06-18

    申请号：EP00309103.0

    申请日：2000-10-16

    Applicant: LUCENT TECHNOLOGIES INC.

    Inventor： Bishop, David John ,  Jin, Sungho ,  Kim, Jungsang ,  Ramirez, Ainissa C. ,  van Dover, Robert Bruce

    IPC: H01H1/02

    CPC classification number: H01H1/023 ,  H01H1/0036 ,  H01H1/027 ,  H01H2300/036

    Abstract: A device having electrical contacts formed from an alloy having improved wear resistance is provided, the alloy being particularly useful in microrelay devices formed by MEMS technology. In one embodiment, the alloys are chosen to allow sufficient precipitation hardening to improve wear resistance, but keep precipitation below a level that would unacceptably reduce electrical conductivity. This is achieved by using alloying materials that have very limited or no solid solubility in the noble metal matrix, e.g., less than 4 wt.% solid solubility. In a second embodiment, an alloy contains a noble metal matrix and insoluble, dispersoid particles having no solubility in the matrix, these dispersoid particles offering a similar strengthening mechanism.

    Hermatic firewall for mems packaging in flip-chip bonded geometry
    5.
    发明公开
    Hermatic firewall for mems packaging in flip-chip bonded geometry 审中-公开
    Hermetischer FeuerwallfürMEMS Verpackung in Flip-Chip-gebondeter Geometrie

    公开(公告)号：EP1093162A1

    公开(公告)日：2001-04-18

    申请号：EP00308893.7

    申请日：2000-10-09

    Applicant: LUCENT TECHNOLOGIES INC.

    Inventor： Bishop, David John ,  van Atta Gates II, John ,  Kim, Jungsang

    IPC: H01L23/04 ,  H01L23/10

    CPC classification number: B81B7/0041 ,  B81C2203/019 ,  H01L23/04 ,  H01L23/057 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

    Abstract: A package (10) for hermetically sealing a micro-electromechanical systems (MEMS) device (25) in a hybrid circuit comprise a firewall (30) formed on a substrate (40) for the MEMS device and which has a height defining a cavity of the package in which the MEMS device will be sealed. A second substrate (70) spaced from the first substrate hermetically seals the cavity when the second substrate is flip-chip bonded to the first substrate and soldered to the first substrate with a thin film metal material placed on at least a top portion of the firewall. The resulting firewall MEMS device package can be further packaged using conventional CMOS packaging techniques. By hermetically sealing the cavity, the enclosed MEMS device is protected from deleterious conditions found in the environment of conventional CMOS packaging techniques which is often detrimental to MEMS device function.

    Abstract translation: 用于气密地密封混合电路中的微机电系统（MEMS）装置（25）的封装（10）包括形成在用于MEMS器件的衬底（40）上的防火墙（30），其具有限定腔 其中MEMS器件将被密封的封装。 与第一基板间隔开的第二基板（70）在将第二基板倒装芯片接合到第一基板时密封空腔，并且将金属材料焊接到第一基板上，薄膜金属材料放置在防火墙的至少顶部 。 所得到的防火墙MEMS器件封装可以使用传统的CMOS封装技术进一步封装。 通过密封空腔，封装的MEMS器件得到保护，防止在常规CMOS封装技术的环境中发现有害条件，这常常对MEMS器件功能有害。

    Flip-chip bonded micro-relay on integrated circuit chip
    6.
    发明公开
    Flip-chip bonded micro-relay on integrated circuit chip 审中-公开
    Flip-chip montiertes Mikrorelais auf einer integrierten Schaltung

    公开(公告)号：EP1093143A1

    公开(公告)日：2001-04-18

    申请号：EP00308858.0

    申请日：2000-10-09

    Applicant: LUCENT TECHNOLOGIES INC.

    Inventor： Bishop, David John ,  Bolle, Christain A. ,  Kim, Jungsang ,  Pardo, Flavio

    IPC: H01H59/00 ,  H01L25/065 ,  H01H50/00

    CPC classification number: B81C1/00238 ,  B81B2203/0118 ,  B81B2203/04 ,  H01H50/005 ,  H01H59/0009

    Abstract: Hybrid integrated circuits comprise a micro-electro mechanical systems (MEMS) relay which is flip-chip bonded to a CMOS chip. By bonding the CMOS chip to the MEMS micro-relay, a robust electrical connection is made between the relayed chip for high integrity electrical transmission through the hybrid circuit. Moreover, the electrical signal propagation delays between the CMOS and MEMS chips are greatly reduced to thereby allow the hybrid integrated circuits to be used in high bandwidth applications.

    Abstract translation: 混合集成电路包括被倒装芯片连接到CMOS芯片的微机电系统（MEMS）继电器。 通过将CMOS芯片连接到MEMS微型继电器，在中继芯片之间进行了牢固的电连接，用于通过混合电路的高完整性电传输。 此外，CMOS和MEMS芯片之间的电信号传播延迟大大降低，从而允许混合集成电路在高带宽应用中使用。

    Non-volatile mems micro-relays using magnetic actuators
    7.
    发明公开
    Non-volatile mems micro-relays using magnetic actuators 有权
    非易失性MEMS微动继电器使用磁性致动器

    公开(公告)号：EP1093141A2

    公开(公告)日：2001-04-18

    申请号：EP00308867.1

    申请日：2000-10-09

    Applicant: LUCENT TECHNOLOGIES INC.

    Inventor： Bishop, David John ,  Jin, Sungho ,  Kim, Jungsang ,  Ramirez, Ainissa G.

    IPC: H01H50/00

    CPC classification number: H01H50/005 ,  H01H2050/007 ,  H02K99/20 ,  Y10S310/06

    Abstract: An actuation device employing square-loop latchable magnetic material (14, 16) having a magnetization direction (polarization) capable of being changed in response to exposure to an external magnetic field is disclosed. The magnetic field is created by a conductor assembly with non-solenoid configuration. Once the magnetization direction of the material is so changed, the external magnetic field is no longer required to maintain the new magnetization direction. The latchable magnetic material (14) is disposed on the mobile electrode (20) of a switching device, and another magnetic material (16) is disposed in spaced relation to the latchable magnetic material on a stationary electrode or surface (28). By applying an electrical current to a conductor assembly arranged proximate the latchable material, a magnetic field is created about the latchable magnetic material, to change the magnetization direction and thereby enable the attraction or repulsion of another magnetic material located on the stationary electrode. The resulting relative displacement of the mobile (20) and stationary (18) electrodes effects the selective connection or disconnection of electrical contacts carried on or associated with the respective electrodes of the actuation device without requiring additional power in order to maintain the switched state of the electrodes.

    Article comprising improved noble metal-based alloys and method for making the same
    10.
    发明公开
    Article comprising improved noble metal-based alloys and method for making the same 审中-公开
    Artikel mit verb desserten Edelmetallbasislegierungen und Herstellungsverfahren

    公开(公告)号：EP1096523A2

    公开(公告)日：2001-05-02

    申请号：EP00309103.0

    申请日：2000-10-16

    Applicant: LUCENT TECHNOLOGIES INC.

    Inventor： Bishop, David John ,  Jin, Sungho ,  Kim, Jungsang ,  Ramirez, Ainissa C. ,  van Dover, Robert Bruce

    IPC: H01H1/02

    CPC classification number: H01H1/023 ,  H01H1/0036 ,  H01H1/027 ,  H01H2300/036

    Abstract: A device having electrical contacts formed from an alloy having improved wear resistance is provided, the alloy being particularly useful in microrelay devices formed by MEMS technology. In one embodiment, the alloys are chosen to allow sufficient precipitation hardening to improve wear resistance, but keep precipitation below a level that would unacceptably reduce electrical conductivity. This is achieved by using alloying materials that have very limited or no solid solubility in the noble metal matrix, e.g., less than 4 wt.% solid solubility. In a second embodiment, an alloy contains a noble metal matrix and insoluble, dispersoid particles having no solubility in the matrix, these dispersoid particles offering a similar strengthening mechanism.

    Abstract translation: 提供了具有由具有改善的耐磨性的合金形成的电触头的装置，该合金特别适用于通过MEMS技术形成的微型继电器件。 在一个实施方案中，选择合金以允许足够的沉淀硬化以改善耐磨性，但将沉淀保持在不可接受地降低导电性的水平。 这通过使用在贵金属基体中具有非常有限的或没有固溶度的合金材料来实现，例如小于4重量％的固体溶解度。 在第二实施方案中，合金含有贵金属基质和不溶于基质的不溶性分散质颗粒，这些分散质颗粒提供类似的强化机理。

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