Process for forming device comprising metallized magnetic substrates
    1.
    发明公开
    Process for forming device comprising metallized magnetic substrates 审中-公开
    用于形成包括金属化磁性衬底的器件的方法

    公开(公告)号:EP1017068A2

    公开(公告)日:2000-07-05

    申请号:EP00107371.7

    申请日:1999-02-02

    Abstract: The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. The invention relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.

    Abstract translation: 本发明提供了一种用于制造含有金属化磁性陶瓷材料的器件的改进方法,例如电感器,变压器和磁性基片。 本发明涉及在这种方法中使用改进的导电材料,所述导电材料包含银/钯颗粒,铁氧体颗粒,纤维素基或其他有机粘合剂和溶剂。 在其上已经涂覆油墨的基底烧制之后,并且通过焦磷酸铜浴对其上的铜进行电镀之后,电镀的铜表现出大于约4kpsi的拉伸强度,有利地大于约5kpsi。 使用焦磷酸铜镀液还可以在长而狭窄的通孔内均匀镀覆。

    Process for forming device comprising metallized magnetic substrates
    2.
    发明公开
    Process for forming device comprising metallized magnetic substrates 审中-公开
    一种用于制备阵列处理具有金属化磁性基体

    公开(公告)号:EP1017068A3

    公开(公告)日:2000-07-12

    申请号:EP00107371.7

    申请日:1999-02-02

    Abstract: The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. The invention relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.

    Abstract translation: 本发明提供了对用于制造含金属化陶瓷磁性材料,彩色设备改进的方法:例如电感器,变压器,和磁性基片。 本发明涉及在搜索过程中使用的改进的导电性材料,含有银/钯颗粒,铁氧体颗粒,纤维素系或其它有机粘合剂和溶剂的导电材料。 由焦磷酸铜浴中烧制在其上的墨水已经被涂覆在基底,并在其上的铜镀覆之后,将镀铜表现出拉拔强度超过约4千磅,有利地小于约5千磅更大更大。 焦磷酸铜浴中的使用,以便允许长而窄的通孔内均匀的镀覆。

Patent Agency Ranking