Abstract:
The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.
Abstract:
The invention is a sol-gel extrusion process which allows fabrication of both thick and thin wall tubes. For example, the process is capable of preparing silica overcladding tubes in a manner easier than sol-gel casting processes, and also capable of preparing relatively thin substrate tubes, which are difficult to cast. According to the invention, a silica dispersion containing a stabilizing agent is provided, a gelling agent is added to the dispersion to induce gellation, and the resultant gel is extruded into a silica body, in the substantial absence, i.e. less than 0.5%wt., of polymeric material from the gel. Substantially avoiding the inclusion of such polymeric material in overcladding and substrate tubes offers significant commercial advantages by reducing the time and energy required to remove organic materials from the tube bodies, by reducing environmental impact and by reducing the amount of impurities introduced in the tubes.
Abstract:
The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. The invention relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.
Abstract:
The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.
Abstract:
The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. The invention relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.
Abstract:
Conventional optical gratings are relatively temperature sensitive. This sensitivity is generally undesirable but can be reduced or eliminated by attaching the grating to a support member (11) having a negative coefficient of thermal expansion. Exemplarily the member comprises Zr-tungstate and/or Hf-tungstate. The thermal expansion can be tailored by admixture of positive expansion coefficient material (e.g., Al 2 O 3 , SiO 2 ) to the negative expansion coefficient material (e.g., ZrW 2 O 8 ), or by a variety of other techniques.
Abstract translation:常规光栅相对温度敏感。 这种灵敏度通常是不希望的,但可以通过将光栅附着到具有负热膨胀系数的支撑构件(11)来减小或消除。 示例性地,该构件包含Zr钨酸盐和/或Hf钨酸盐。 热膨胀可以通过将正膨胀系数材料(例如,Al 2 O 3,SiO 2)与负膨胀系数材料(例如ZrW 2 O 8)混合或通过各种其他技术来调整。
Abstract:
A silica sol-gel fabrication process is provided which allows improved control of the shrinkage that takes place during the drying of a gel body. In particular, the invention makes it possible to attain extremely low shrinkage through the completion of the drying stage, e.g., below 1% linear shrinkage, in relatively large sol-gel bodies of (dry weight) 1 kg or more, typically 10 kg or more, or even 40 kg or more, compared to the much higher shrinkages typically encountered. Specifically, use of a particular polymeric additive makes it possible for a gel body to experience linear shrinkage at least 55% less than an identical process without the polymeric additive.