Process for forming device comprising metallized magnetic substrates
    2.
    发明公开
    Process for forming device comprising metallized magnetic substrates 审中-公开
    一种用于制备阵列处理具有金属化磁性基体

    公开(公告)号:EP1017068A3

    公开(公告)日:2000-07-12

    申请号:EP00107371.7

    申请日:1999-02-02

    Abstract: The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. The invention relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.

    Abstract translation: 本发明提供了对用于制造含金属化陶瓷磁性材料,彩色设备改进的方法:例如电感器,变压器,和磁性基片。 本发明涉及在搜索过程中使用的改进的导电性材料,含有银/钯颗粒,铁氧体颗粒,纤维素系或其它有机粘合剂和溶剂的导电材料。 由焦磷酸铜浴中烧制在其上的墨水已经被涂覆在基底,并在其上的铜镀覆之后,将镀铜表现出拉拔强度超过约4千磅,有利地小于约5千磅更大更大。 焦磷酸铜浴中的使用,以便允许长而窄的通孔内均匀的镀覆。

    Process for forming device comprising metallized magnetic substrates
    3.
    发明公开
    Process for forming device comprising metallized magnetic substrates 有权
    用于形成包括金属化磁性衬底的器件的方法

    公开(公告)号:EP0936639A3

    公开(公告)日:1999-09-29

    申请号:EP99300743.4

    申请日:1999-02-02

    Abstract: The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.

    Abstract translation: 本发明提供了一种用于制造含有金属化磁性陶瓷材料的器件的改进方法,例如电感器,变压器和磁性基片。 具体地,本发明的工艺中使用的独特通孔允许仅用单个通孔涂覆步骤来制造来自多个未烧制铁氧体层的器件,从而避免需要多次冲压步骤。 而且,不需要扩大通孔的尺寸,因此不需要内部金属化。 因此,本发明以比现有方法更快,更简单和更可靠的方式提供了诸如电感器,变压器和磁性基板之类的器件的生带式制造。 本发明还涉及在这种方法中使用改进的导电材料,所述导电材料包含银/钯颗粒,铁氧体颗粒,纤维素基或其他有机粘合剂和溶剂。 在其上已经涂覆油墨的基底烧制之后,并且通过焦磷酸铜浴对其上的铜进行电镀之后,电镀的铜表现出大于约4kpsi的拉伸强度,有利地大于约5kpsi。 使用焦磷酸铜镀液还可以在长而狭窄的通孔内均匀镀覆。

    Process for forming device comprising metallized magnetic substrates
    4.
    发明公开
    Process for forming device comprising metallized magnetic substrates 审中-公开
    用于形成包括金属化磁性衬底的器件的方法

    公开(公告)号:EP1017068A2

    公开(公告)日:2000-07-05

    申请号:EP00107371.7

    申请日:1999-02-02

    Abstract: The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. The invention relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.

    Abstract translation: 本发明提供了一种用于制造含有金属化磁性陶瓷材料的器件的改进方法,例如电感器,变压器和磁性基片。 本发明涉及在这种方法中使用改进的导电材料,所述导电材料包含银/钯颗粒,铁氧体颗粒,纤维素基或其他有机粘合剂和溶剂。 在其上已经涂覆油墨的基底烧制之后,并且通过焦磷酸铜浴对其上的铜进行电镀之后,电镀的铜表现出大于约4kpsi的拉伸强度,有利地大于约5kpsi。 使用焦磷酸铜镀液还可以在长而狭窄的通孔内均匀镀覆。

    Process for forming device comprising metallized magnetic substrates
    5.
    发明公开
    Process for forming device comprising metallized magnetic substrates 有权
    一种用于制备阵列处理具有金属化磁性基体

    公开(公告)号:EP0936639A2

    公开(公告)日:1999-08-18

    申请号:EP99300743.4

    申请日:1999-02-02

    Abstract: The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.

    Abstract translation: 本发明提供了对用于制造含金属化陶瓷磁性材料,彩色设备改进的方法:例如电感器,变压器,和磁性基片。 特别地,在本发明的方法中使用的独特的通孔允许来自多个未焙烧铁氧体层器件的制造仅具有单个经由涂步骤,从而避免需要大量的冲孔步骤。 更完了,没有必要扩大通孔的尺寸,从而无需内部金属化。 本发明因此提供用于设备的生带型制造:例如电感器,变压器,和磁性基片的方式更快,更复杂的,并且比现有方法更可靠。 因此本发明涉及在搜索过程中使用的改进的导电性材料,含有银/钯颗粒,铁氧体颗粒,纤维素系或其它有机粘合剂和溶剂的导电材料。 由焦磷酸铜浴中烧制在其上的墨水已经被涂覆在基底,并在其上的铜镀覆之后,将镀铜表现出拉拔强度超过约4千磅,有利地小于约5千磅更大更大。 焦磷酸铜浴中的使用,以便允许长而窄的通孔内均匀的镀覆。

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