公开(公告)号：EP1662852B1

公开(公告)日：2007-05-09

申请号：EP05257053.8

申请日：2005-11-15

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Hodes, Marc Scott ,  Kolodner, Paul Robert ,  Krupenkin, Thomas Nikita ,  Lee, Wonsuck ,  Lyons, Alan Michael ,  Salamon, Todd Richard ,  Taylor, Joseph Ashley ,  Weiss, Donald P.

IPC: H05K7/20 ,  H01L23/473

CPC classification number: F28F3/12 ,  F28F3/048 ,  F28F2245/04 ,  F28F2260/02 ,  H01L23/473 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Techniques for heat transfer are provided. In one aspect of the invention, a heat-transfer device (200) is provided. The heat-transfer device comprises one or more microchannels (213) suitable for containing a heat-transfer fluid, one or more of the microchannels having protruding structures (214) on at least one inner surface thereof configured to affect flow of the heat-transfer fluid through the one or more microchannels. The structures may comprise posts coated with a hydrophobic coating.

公开(公告)号：EP1662852A1

公开(公告)日：2006-05-31

申请号：EP05257053.8

申请日：2005-11-15

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Hodes, Marc Scott ,  Kolodner, Paul Robert ,  Krupenkin, Thomas Nikita ,  Lee, Wonsuck ,  Lyons, Alan Michael ,  Salamon, Todd Richard ,  Taylor, Joseph Ashley ,  Weiss, Donald P.

IPC: H05K7/20 ,  H01L23/473

CPC classification number: F28F3/12 ,  F28F3/048 ,  F28F2245/04 ,  F28F2260/02 ,  H01L23/473 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Techniques for heat transfer are provided. In one aspect of the invention, a heat-transfer device (200) is provided. The heat-transfer device comprises one or more microchannels (213) suitable for containing a heat-transfer fluid, one or more of the microchannels having protruding structures (214) on at least one inner surface thereof configured to affect flow of the heat-transfer fluid through the one or more microchannels. The structures may comprise posts coated with a hydrophobic coating.

Abstract translation: 提供了传热技术。 在本发明的一个方面，提供一种传热装置（200）。 热传递装置包括一个或多个适于容纳传热流体的微通道（213），一个或多个微通道在其至少一个内表面上具有突出结构（214），其构造成影响热传递的流动 流体通过一个或多个微通道。 结构可以包括涂覆有疏水涂层的柱。