Abstract:
A jet impingement cooling system (1) for an electronic device (3) comprises: a housing (4); a substrate to be cooled (5) located in the housing which substrate is arranged to be in thermal contact with the device to be cooled and which has a surface pattern (14) thereon; a fluid inlet (8) to the housing; at least one fluid outlet (9) from the housing; and at least one nozzle (17) in fluid connection with the fluid inlet for directing a jet (12) of fluid at a portion of the substrate, wherein that the surface pattern (14) defines at least one channel (19) and the jet is aligned with the pattern (14) such that at least a portion of the jet is incident on at least a portion of the channel (19) such that the flow of the fluid from the jet is subsequently confined by the channel (19). The arrangement assists in maximizing the cooling effect of the fluid on a given area of substrate.
Abstract:
An apparatus (AP) comprises i) a plurality of cells (C) disposed on a surface (SS) of a substrate (SU), each of these cells (C) comprising a lateral wall (LW) defining an open housing (OH) for holding a medium (M) therein and having at least one dimension that is less than the capillary length of a fluid (F) - medium (M) combination, and ii) a foam (FO) situated at the boundary of a fluid (F) and comprising fluid walls (FW) contacting these cells (C) and defining at least partly bubbles (B) filled with the medium (M). The fluid walls (FW) include dissolved molecules of at least one ionic salt, intended to stabilize the bubbles (B).
Abstract:
Techniques for heat transfer are provided. In one aspect of the invention, a heat-transfer device (200) is provided. The heat-transfer device comprises one or more microchannels (213) suitable for containing a heat-transfer fluid, one or more of the microchannels having protruding structures (214) on at least one inner surface thereof configured to affect flow of the heat-transfer fluid through the one or more microchannels. The structures may comprise posts coated with a hydrophobic coating.
Abstract:
Techniques for heat transfer are provided. In one aspect of the invention, a heat-transfer device (200) is provided. The heat-transfer device comprises one or more microchannels (213) suitable for containing a heat-transfer fluid, one or more of the microchannels having protruding structures (214) on at least one inner surface thereof configured to affect flow of the heat-transfer fluid through the one or more microchannels. The structures may comprise posts coated with a hydrophobic coating.