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    Stackable and cost-reduced transformer with embedded EMI filters
    1.
    发明公开
    Stackable and cost-reduced transformer with embedded EMI filters 失效
    变压器和电动机变压器

    公开(公告)号：EP0865048A1

    公开(公告)日：1998-09-16

    申请号：EP98301564.5

    申请日：1998-03-03

    Applicant: LUCENT TECHNOLOGIES INC.

    Inventor： Johnson, David Wilfred, Jr. ,  Thomson, John, Jr. ,  Norte, David A.

    IPC: H01F27/29 ,  H01F17/04

    CPC classification number: H01F27/292 ,  H01F17/043 ,  H05K1/0233 ,  H05K1/18 ,  H05K2201/1003

    Abstract: A transformer (FIG. 1) optimized for surface-mount vacuum-pickup automated circuit assembly eliminates the expense of a transformer housing. The transformer has a ferrite body (100) that defines a pair of wells (208, 209) each opening onto an opposite face (108, 109) of the ferrite body. Transformer primary and secondary windings are wound in a coil (103) through slots (210, 211) around a transformer core (204) at the bottom of the wells. The windings do not protrude from the wells beyond the faces, resulting in flat faces. A first plurality of conductive vias (104-106), one pair for each winding, are completely embedded in the ferrite body and extend to both of the faces. Each pair of vias serves at one face to attach to the winding and at the other face to attach to solder pods of a PC board. The embedded vias also serve as EMI filters. A plate (107) covers the one face and provides a surface for vacuum pickup and for labeling of the transformer. The ferrite body (500) of a first transformer (FIG. 5) adapted for stacked mounting of transformers dispenses with the flat plate and further defines a second plurality of pairs of conductive vias (104-106). These vias are not connected to the first transformer's windings, but rather are positioned for connection to the winding-connected first pairs of vias of a second transformer that is positioned orthogonally to and mounted on the first transformer at the one of the faces.

    Abstract translation: 为表面贴装真空拾取自动化电路组件而优化的变压器（图1）消除了变压器外壳的费用。 变压器具有铁氧体本体（100），其限定了一对孔（208,209），每个孔分别打开到铁氧体的相对面（108,109）上。 变压器初级和次级绕组通过在井的底部的变压器铁芯（204）周围的槽（210,211）缠绕在线圈（103）中。 绕组不会从孔之外突出，导致平面。 第一多个导电通孔（104-106），每对绕组一对，完全嵌入在铁氧体中并延伸到两个面。 每对通孔在一个面上用于连接到绕组上，而在另一个面上连接到PC板的焊盘。 嵌入式通孔也可用作EMI滤波器。 板（107）覆盖一个面并提供用于真空拾取和变压器标签的表面。 适于堆叠安装变压器的第一变压器（图5）的铁氧体（500）免除平板，并进一步限定第二组多对导电通孔（104-106）。 这些通孔不连接到第一变压器的绕组，而是被定位成连接到第二变压器的与绕组连接的第一对通孔对准，该第二变压器的一个面正交于并安装在第一变压器上。

    Process for forming device comprising metallized magnetic substrates
    2.
    发明公开
    Process for forming device comprising metallized magnetic substrates 有权
    一种用于制备阵列处理具有金属化磁性基体

    公开(公告)号：EP0936639A2

    公开(公告)日：1999-08-18

    申请号：EP99300743.4

    申请日：1999-02-02

    Applicant: LUCENT TECHNOLOGIES INC.

    Inventor： Fleming, Debra Anne ,  Grader, Gideon S. ,  Johnson, David Wilfred, Jr. ,  Lambrecht, Vincent George, Jr. ,  Thomson, John, Jr.

    IPC: H01F41/04 ,  C25D3/00

    CPC classification number: C25D7/001 ,  C25D5/022 ,  H01F17/0033 ,  H01F41/043 ,  H01F41/046 ,  H01F41/16

    Abstract: The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.

    Abstract translation: 本发明提供了对用于制造含金属化陶瓷磁性材料，彩色设备改进的方法：例如电感器，变压器，和磁性基片。 特别地，在本发明的方法中使用的独特的通孔允许来自多个未焙烧铁氧体层器件的制造仅具有单个经由涂步骤，从而避免需要大量的冲孔步骤。 更完了，没有必要扩大通孔的尺寸，从而无需内部金属化。 本发明因此提供用于设备的生带型制造：例如电感器，变压器，和磁性基片的方式更快，更复杂的，并且比现有方法更可靠。 因此本发明涉及在搜索过程中使用的改进的导电性材料，含有银/钯颗粒，铁氧体颗粒，纤维素系或其它有机粘合剂和溶剂的导电材料。 由焦磷酸铜浴中烧制在其上的墨水已经被涂覆在基底，并在其上的铜镀覆之后，将镀铜表现出拉拔强度超过约4千磅，有利地小于约5千磅更大更大。 焦磷酸铜浴中的使用，以便允许长而窄的通孔内均匀的镀覆。

    Process for forming device comprising metallized magnetic substrates
    4.
    发明公开
    Process for forming device comprising metallized magnetic substrates 有权
    用于形成包括金属化磁性衬底的器件的方法

    公开(公告)号：EP0936639A3

    公开(公告)日：1999-09-29

    申请号：EP99300743.4

    申请日：1999-02-02

    Applicant: LUCENT TECHNOLOGIES INC.

    Inventor： Fleming, Debra Anne ,  Grader, Gideon S. ,  Johnson, David Wilfred, Jr. ,  Lambrecht, Vincent George, Jr. ,  Thomson, John, Jr.

    IPC: H01F41/04 ,  C25D3/00

    CPC classification number: C25D7/001 ,  C25D5/022 ,  H01F17/0033 ,  H01F41/043 ,  H01F41/046 ,  H01F41/16

    Abstract: The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent. After firing of the substrate onto which the ink has been coated, and plating of copper thereon by a copper pyrophosphate bath, the plated copper exhibits a pull strength greater than about 4 kpsi, advantageously greater than about 5 kpsi. Use of a copper pyrophosphate bath also allow uniform plating within long, narrow vias.

    Abstract translation: 本发明提供了一种用于制造含有金属化磁性陶瓷材料的器件的改进方法，例如电感器，变压器和磁性基片。 具体地，本发明的工艺中使用的独特通孔允许仅用单个通孔涂覆步骤来制造来自多个未烧制铁氧体层的器件，从而避免需要多次冲压步骤。 而且，不需要扩大通孔的尺寸，因此不需要内部金属化。 因此，本发明以比现有方法更快，更简单和更可靠的方式提供了诸如电感器，变压器和磁性基板之类的器件的生带式制造。 本发明还涉及在这种方法中使用改进的导电材料，所述导电材料包含银/钯颗粒，铁氧体颗粒，纤维素基或其他有机粘合剂和溶剂。 在其上已经涂覆油墨的基底烧制之后，并且通过焦磷酸铜浴对其上的铜进行电镀之后，电镀的铜表现出大于约4kpsi的拉伸强度，有利地大于约5kpsi。 使用焦磷酸铜镀液还可以在长而狭窄的通孔内均匀镀覆。

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