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公开(公告)号：JPH10190183A
公开(公告)日：1998-07-21
申请号：JP34237397
申请日：1997-12-12
Applicant: MACDERMID INC , HADCO CORP
Inventor： BENGSTON JON , LARSON GARY B , KOLOGE DONNA , SCHWEIKHER WILLIAM , DEREGO TODD , RAABERG BRUCE S , SORENSON BRUCE
Abstract: PROBLEM TO BE SOLVED: To make a resistor to be printed and plated as the integrated part of the circuit of a printed circuit board by plating a resistive material to an insulating substrate existing between conductive areas so that the resistive material may connect the conductive areas to each other. SOLUTION: After exposed copper is etched off and an etch resist is removed, the exposed surface is activated and a mask for plating which substantially covers the entire exposed surface except an area where a resistor 16 is to be plated is applied to the surface. Then the exposed surface is plated with a resistive material and the mask for plating is removed. After the mask is removed, the surface of a bare dielectric substrate 10 is activated so that the surface may accept plating. Then a mask for plating is applied to the substrate 10 so that a desired circuit may be demarcated in a negative state and the area between the circuit and a position related to the resistor 16 may be demarcated in a positive state. Thereafter, the desired circuit is plated and a resist 15 is removed.
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公开(公告)号：JPH10135608A
公开(公告)日：1998-05-22
申请号：JP28324097
申请日：1997-10-16
Applicant: MACDERMID INC
Inventor： KUKANSKIS PETER , LARSON GARY B , BENGSTON JON , SCHWEIKHER WILLIAM
Abstract: PROBLEM TO BE SOLVED: To form a printed circuit board provided with a plated resistor which is unified in a body with a circuit, by eliminating exposed copper by etching, plating an exposed region by using a mask for plating, and eliminating the mask for plating by stripping. SOLUTION: The surface of a copper-coated laminate having an insulating dielectric substratum 10 and a stuck copper foil 11 is eliminated by etching. By stripping resist 12, the surface of an arbitrarily exposed dielectric material surface is made uniform. Thereon a mask for plating is so applied that resist 15 for plating covers the whole surface except the region where a resistor 16 is to be plated. By stripping the mask for plating, the surface of a printed circuit board is arbitrarily cleaned, and a plated resistor 16 is covered with a protective film. Thereby the printed circuit board provided with a plated resistor 16 unified in a body with a circuit can be formed.
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公开(公告)号：CA2405830A1
公开(公告)日：2002-01-03
申请号：CA2405830
申请日：2001-03-07
Applicant: MACDERMID INC
Inventor： SCHWEIKHER WILLIAM , BENGSTON JON , LARSON GARY B , KUKANSKIS PETER
IPC: C23C18/18 , H01C17/065 , H01C17/18 , H01L23/12 , H05K1/16 , H05K3/06 , H05K3/18 , H05K3/24 , H05K3/26 , H05K3/38 , H01L23/48 , H01L21/20 , H01L21/302 , H01L21/31 , H01L29/40 , H01L21/44 , H01L21/461 , H01L21/469 , H01L23/52
Abstract: A process and product manufactured by the process is revealed whereby resistors (16) can be manufactured integral a printed circuit board (10, 13) by plating the resistors onto an insulative substrate (10). Uniformization o f the insulative substrate by etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.
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公开(公告)号：ES2224209T3
公开(公告)日：2005-03-01
申请号：ES97307983
申请日：1997-10-09
Applicant: MACDERMID INC
Inventor： KUKANSKIS PETER , LARSON GARY B , BENGSTON JON , SCHWEIKHER WILLIAM
Abstract: SE REVELA UN PROCESO EN DONDE LAS RESISTENCIAS SE PUEDEN FABRICAR DE FORMA INTEGRADA CON LA PLACA DE CIRCUITO IMPRESO, COLOCANDO LAS RESISTENCIAS EN FORMA DE PLACAS (16) EN EL SUSTRATO AISLANTE (10). LA UNIFORMIZACION DEL SUSTRATO AISLANTE (10) POR MEDIO DEL DECAPADO CON ACIDO Y DE LA OXIDACION DE LA RESISTENCIA COLOCADA EN FORMA DE PLACAS (16) SE REVELAN COMO TECNICAS PARA LA MEJORA DE LA UNIFORMIDAD Y DE LA CONSISTENCIA DE LAS RESISTENCIAS COLOCADAS EN FORMA DE PLACAS (16).
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公开(公告)号：DE69730288T2
公开(公告)日：2004-12-30
申请号：DE69730288
申请日：1997-10-09
Applicant: MACDERMID INC
Inventor： KUKANSKIS PETER , LARSON GARY B , BENGSTON JON , SCHWEIKHER WILLIAM
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Patent Agency Ranking
公开(公告)号：ES2590255T3
公开(公告)日：2016-11-21
申请号：ES04760783
申请日：2004-03-26
Applicant: MACDERMID INC
Inventor： CROTTY DAVID , BENGSTON JON
Abstract: Una dispersión acuosa de politetrafluoroetileno que comprende (i) un tensioactivo de glicol de silicona que tiene una viscosidad a 25 ºC de 3 x 10-5 m2/s a 6 x 10-5 m2/s (de 30 a 60 centiestokes) y (ii) polvo de politetrafluoroetileno, donde dicho polvo de politetrafluoroetileno está presente en dicha dispersión en una cantidad de 500-700 gramos /1000 gramos de dispersión.
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公开(公告)号：AU2002305124A1
公开(公告)日：2003-09-04
申请号：AU2002305124
申请日：2002-04-01
Applicant: MACDERMID INC
Inventor： BENGSTON JON , WOJTASZEK MARK , WOJCIK GERALD , DIMARCO MASSIMO
Abstract: A conversion coating composition and a method of applying the conversion coating composition to magnesium and magnesium alloy articles prior to painting to prevent corrosion. The conversion coating composition comprises a source of vanadate ions, a material comprising phosphorus, and nitric acid or a source of nitrate ions. In addition, the composition may also contain boric acid or a source of borate ions and a source of fluoride ions or a source of fluoroborate ions.
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公开(公告)号：WO2005094394A2
公开(公告)日：2005-10-13
申请号：PCT/US2005001353
申请日：2005-01-18
Applicant: MACDERMID INC
Inventor： BENGSTON JON
CPC classification number: C23C18/22 , C23C18/30 , H05K3/181 , H05K3/381 , H05K2203/0796 , H05K2203/1157
Abstract: The invention comprises a process of preparing a non-conductive substrate for subsequent metalization. The process replaces the traditional chromic acid etching step with an etching solution comprising a permanganate and a mineral acid. The process also includes a novel activation solution comprising a palladium salt and an amine complexor. The new process of the invention is more environmentally friendly than the traditional chromic acid etching solutions but achieves a comparable result on most non-conductive substrates.
Abstract translation: 本发明包括制备用于随后金属化的不导电基底的方法。 该方法用包含高锰酸盐和无机酸的蚀刻溶液替代传统的铬酸蚀刻步骤。 该方法还包括包含钯盐和胺络合物的新型活化溶液。 本发明的新方法比传统的铬酸蚀刻溶液更环保，但在大多数非导电基材上获得可比的结果。
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公开(公告)号：CA2405830C
公开(公告)日：2007-05-22
申请号：CA2405830
申请日：2001-03-07
Applicant: MACDERMID INC
Inventor： KUKANSKIS PETER , LARSON GARY B , BENGSTON JON , SCHWEIKHER WILLIAM
IPC: H01L23/48 , C23C18/18 , H01C17/065 , H01C17/18 , H01L21/20 , H01L21/302 , H01L21/31 , H01L21/44 , H01L21/461 , H01L21/469 , H01L23/12 , H01L23/52 , H01L29/40 , H05K1/16 , H05K3/06 , H05K3/18 , H05K3/24 , H05K3/26 , H05K3/38
Abstract: A process and product manufactured by the process is revealed whereby resistors (16) can be manufactured integral a printed circuit board (10, 13) by plating the resistors onto an insulative substrate (10). Uniformization of the insulative substrate by etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.
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公开(公告)号：DE69730288D1
公开(公告)日：2004-09-23
申请号：DE69730288
申请日：1997-10-09
Applicant: MACDERMID INC
Inventor： KUKANSKIS PETER , LARSON GARY B , BENGSTON JON , SCHWEIKHER WILLIAM
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