公开(公告)号：JP2001123272A

公开(公告)日：2001-05-08

申请号：JP30684999

申请日：1999-10-28

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  STEVEN KASUTARUDE ,  ANDREW KROLL

IPC: H05K3/18 ,  C08G85/00 ,  C08J7/04 ,  C23C18/20 ,  C23C18/31 ,  G03F7/40

Abstract: PROBLEM TO BE SOLVED: To provide a method for applying plating onto a polymeric surface with improved adhesive properties and coverability. SOLUTION: A polymeric surface which has not perfectly been polymerized is applied with plating, and next, the plated surface is cured as well.

公开(公告)号：JPH10135608A

公开(公告)日：1998-05-22

申请号：JP28324097

申请日：1997-10-16

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  LARSON GARY B ,  BENGSTON JON ,  SCHWEIKHER WILLIAM

IPC: C23C18/18 ,  H01C17/065 ,  H01C17/18 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To form a printed circuit board provided with a plated resistor which is unified in a body with a circuit, by eliminating exposed copper by etching, plating an exposed region by using a mask for plating, and eliminating the mask for plating by stripping. SOLUTION: The surface of a copper-coated laminate having an insulating dielectric substratum 10 and a stuck copper foil 11 is eliminated by etching. By stripping resist 12, the surface of an arbitrarily exposed dielectric material surface is made uniform. Thereon a mask for plating is so applied that resist 15 for plating covers the whole surface except the region where a resistor 16 is to be plated. By stripping the mask for plating, the surface of a printed circuit board is arbitrarily cleaned, and a plated resistor 16 is covered with a protective film. Thereby the printed circuit board provided with a plated resistor 16 unified in a body with a circuit can be formed.

公开(公告)号：JP2007158362A

公开(公告)日：2007-06-21

申请号：JP2007001542

申请日：2007-01-09

Applicant: Macdermid Inc ,  マクダーミド・インコーポレーテツド

Inventor： KUKANSKIS PETER ,  FRITZ DENNIS ,  DURSO FRANK ,  CASTALDI STEVEN ,  SAWOSKA DAVID

IPC: H05K1/16 ,  H01C7/00 ,  H01C17/16 ,  H01C17/24 ,  H01C17/242 ,  H01L23/12 ,  H05K3/06 ,  H05K3/18

CPC classification number: H01C17/24 ,  H01C17/242 ,  H05K1/167 ,  H05K3/027 ,  H05K3/064 ,  H05K3/184 ,  H05K2201/0344 ,  H05K2203/0315 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K2203/171

Abstract: PROBLEM TO BE SOLVED: To provide a production method of a printed circuit board having integrally plated resistors. SOLUTION: This production method of a printed circuit board comprises: applying an etching resist to a part of a metal surface of a metal-coated laminated boards; forming a metal circuit by corroding and removing an exposed metal surface; peeling the resist; plating an exposed region of the core with a resister material having a volume resistivity of 500 to 1×10 -4 Ω cm; and trimming the resistable material so that the resistor has an insulating resistance equal to a predetermined ohm value. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供具有整体电镀电阻器的印刷电路板的制造方法。 解决方案：印刷电路板的这种制造方法包括：在金属涂覆层压板的金属表面的一部分上施加抗蚀剂; 通过腐蚀和去除暴露的金属表面形成金属电路; 剥离抗蚀剂; 用体积电阻率为500〜1×10 -4Ω·cm的电阻材料电镀芯的露出区域; 并修整电阻材料，使得电阻器的绝缘电阻等于预定的欧姆值。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2000246432A

公开(公告)日：2000-09-12

申请号：JP2000043546

申请日：2000-02-16

Applicant: MACDERMID INC

Inventor： REDLINE RONALD ,  SAWOSKA DAVID ,  KUKANSKIS PETER

IPC: B23K1/20 ,  B23K35/00 ,  B23K101/42 ,  C23C18/42 ,  C25D3/46 ,  H05K3/24 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a method improving the solderability of the surface of a metal. SOLUTION: The surface of a metal is processed by immersion silver plating solution. The solution contains a) soluble source of silver ion, b) acid, c) aliphatic amine, aliphatic amide, quaternary salt, amphoteric salt, resin shape amine. resin shape amide, fatty acid, resin shape acid, ethoxyl conversion substance of an arbitrary one out of the above substances, propoxyl conversion substance of an arbitrary one out of the above substances and additives selected from a group consisting of the mixture of arbitrary ones out of the above substances.

公开(公告)号：DE69630555D1

公开(公告)日：2003-12-11

申请号：DE69630555

申请日：1996-03-21

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  GABRIELE PETER ,  LETIZE RAYMOND ,  ADAMS WILLIAM

IPC: G03F7/027 ,  B32B15/08 ,  C08F290/00 ,  C08K3/34 ,  C08K3/36 ,  C08L9/02 ,  C08L21/00 ,  C08L63/00 ,  C08L101/00 ,  C08L101/08 ,  G03F7/00 ,  G03F7/032 ,  G03F7/033 ,  H05K1/00 ,  H05K3/00 ,  H05K3/18 ,  H05K3/46

Abstract: A composition and process useful in fabricating circuitry packages with permanent resists is proposed. The proposed composition comprises a carboxy functional resin, an acrylate oligomer, an epoxy functional resin, a butadiene nitrile resin, and a photoinitiator.

公开(公告)号：CA2405830A1

公开(公告)日：2002-01-03

申请号：CA2405830

申请日：2001-03-07

Applicant: MACDERMID INC

Inventor： SCHWEIKHER WILLIAM ,  BENGSTON JON ,  LARSON GARY B ,  KUKANSKIS PETER

IPC: C23C18/18 ,  H01C17/065 ,  H01C17/18 ,  H01L23/12 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/26 ,  H05K3/38 ,  H01L23/48 ,  H01L21/20 ,  H01L21/302 ,  H01L21/31 ,  H01L29/40 ,  H01L21/44 ,  H01L21/461 ,  H01L21/469 ,  H01L23/52

Abstract: A process and product manufactured by the process is revealed whereby resistors (16) can be manufactured integral a printed circuit board (10, 13) by plating the resistors onto an insulative substrate (10). Uniformization o f the insulative substrate by etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.

公开(公告)号：DE68926622D1

公开(公告)日：1996-07-11

申请号：DE68926622

申请日：1989-11-20

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  WHITMORE BRYAN

IPC: C09K13/04 ,  C09K13/06 ,  C23F1/00 ,  C23F1/30 ,  C23F1/44 ,  H05K3/06 ,  H05K3/24 ,  B44C1/22

Abstract: A composition for stripping tin, lead or solder, as well as any underlying copper-tin alloy, from copper surfaces, containing an alkane sulfonic acid, preferably methane sulfonic acid, an inorganic nitrate, preferably ferric nitrate, and an inhibitor component. The composition effects rapid stripping without any appreciable formation of sludge or precipitate or suspended particles, and without any substantial attack on the underlying copper surface.

公开(公告)号：WO02066256A3

公开(公告)日：2002-11-21

申请号：PCT/US0201409

申请日：2002-01-15

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  FRITZ DENNIS ,  DURSO FRANK ,  CASTALDI STEVEN ,  SAWOSKA DAVID

IPC: H01C7/00 ,  H01C17/24 ,  H01C17/242 ,  H01L23/12 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H01L23/48 ,  B44C1/22 ,  C23F1/00

CPC classification number: H01C17/24 ,  H01C17/242 ,  H05K1/167 ,  H05K3/027 ,  H05K3/064 ,  H05K3/184 ,  H05K2201/0344 ,  H05K2203/0315 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K2203/171

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

Abstract translation: 揭示了一种工艺，其中电阻器可以通过将电阻器电镀到绝缘基板上而与印刷电路板一体制造。 作为用于改善镀覆电阻器的均匀性和一致性的技术，讨论了绝缘衬底通过电镀电阻器的蚀刻和氧化的均匀化。 还公开了修整和烘烤作为用于调节和稳定电镀电阻器的电阻的方法。

公开(公告)号：WO2004036964A3

公开(公告)日：2004-07-01

申请号：PCT/US0324499

申请日：2003-08-06

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  DURSO FRANK ,  SAWOSKA DAVID

IPC: C23C18/16 ,  C23C18/32 ,  C23C18/42 ,  H01C17/06 ,  H05K1/16 ,  H05K3/18 ,  H05K3/24 ,  H05K3/28 ,  H05K3/00 ,  H05K3/10

CPC classification number: H01C17/06 ,  C23C18/1605 ,  C23C18/1651 ,  C23C18/32 ,  C23C18/42 ,  H05K1/167 ,  H05K3/184 ,  H05K3/244 ,  H05K3/28 ,  H05K2203/0565 ,  H05K2203/1453

Abstract: The present invention is a process for manufacturing resistors integral with the printed circuit board by plating the resistors onto the insulative substrate. The invention uses a mask during the activation step so as to selectively activate only selected portions of the surface thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used. The process of the instant invention produced printed circuit boards having greater uniformity and reliability as compared to the prior art.

Abstract translation: 本发明是一种通过将电阻器电镀到绝缘基板上来制造与印刷电路板成为一体的电阻器的工艺。 本发明在激活步骤期间使用掩模，以便仅选择性地激活表面的选定部分，因此使得较小的区域能够镀在印刷电路板上，因为不使用电镀掩模。 与现有技术相比，本发明的方法制造的印刷电路板具有更高的均匀性和可靠性。

公开(公告)号：ES2224209T3

公开(公告)日：2005-03-01

申请号：ES97307983

申请日：1997-10-09

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  LARSON GARY B ,  BENGSTON JON ,  SCHWEIKHER WILLIAM

IPC: C23C18/18 ,  H01C17/065 ,  H01C17/18 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38

Abstract: SE REVELA UN PROCESO EN DONDE LAS RESISTENCIAS SE PUEDEN FABRICAR DE FORMA INTEGRADA CON LA PLACA DE CIRCUITO IMPRESO, COLOCANDO LAS RESISTENCIAS EN FORMA DE PLACAS (16) EN EL SUSTRATO AISLANTE (10). LA UNIFORMIZACION DEL SUSTRATO AISLANTE (10) POR MEDIO DEL DECAPADO CON ACIDO Y DE LA OXIDACION DE LA RESISTENCIA COLOCADA EN FORMA DE PLACAS (16) SE REVELAN COMO TECNICAS PARA LA MEJORA DE LA UNIFORMIDAD Y DE LA CONSISTENCIA DE LAS RESISTENCIAS COLOCADAS EN FORMA DE PLACAS (16).