公开(公告)号：JPH10190183A

公开(公告)日：1998-07-21

申请号：JP34237397

申请日：1997-12-12

Applicant: MACDERMID INC ,  HADCO CORP

Inventor： BENGSTON JON ,  LARSON GARY B ,  KOLOGE DONNA ,  SCHWEIKHER WILLIAM ,  DEREGO TODD ,  RAABERG BRUCE S ,  SORENSON BRUCE

IPC: H01C17/18 ,  H05K1/16 ,  H05K3/18

Abstract: PROBLEM TO BE SOLVED: To make a resistor to be printed and plated as the integrated part of the circuit of a printed circuit board by plating a resistive material to an insulating substrate existing between conductive areas so that the resistive material may connect the conductive areas to each other. SOLUTION: After exposed copper is etched off and an etch resist is removed, the exposed surface is activated and a mask for plating which substantially covers the entire exposed surface except an area where a resistor 16 is to be plated is applied to the surface. Then the exposed surface is plated with a resistive material and the mask for plating is removed. After the mask is removed, the surface of a bare dielectric substrate 10 is activated so that the surface may accept plating. Then a mask for plating is applied to the substrate 10 so that a desired circuit may be demarcated in a negative state and the area between the circuit and a position related to the resistor 16 may be demarcated in a positive state. Thereafter, the desired circuit is plated and a resist 15 is removed.

公开(公告)号：JPH10135608A

公开(公告)日：1998-05-22

申请号：JP28324097

申请日：1997-10-16

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  LARSON GARY B ,  BENGSTON JON ,  SCHWEIKHER WILLIAM

IPC: C23C18/18 ,  H01C17/065 ,  H01C17/18 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To form a printed circuit board provided with a plated resistor which is unified in a body with a circuit, by eliminating exposed copper by etching, plating an exposed region by using a mask for plating, and eliminating the mask for plating by stripping. SOLUTION: The surface of a copper-coated laminate having an insulating dielectric substratum 10 and a stuck copper foil 11 is eliminated by etching. By stripping resist 12, the surface of an arbitrarily exposed dielectric material surface is made uniform. Thereon a mask for plating is so applied that resist 15 for plating covers the whole surface except the region where a resistor 16 is to be plated. By stripping the mask for plating, the surface of a printed circuit board is arbitrarily cleaned, and a plated resistor 16 is covered with a protective film. Thereby the printed circuit board provided with a plated resistor 16 unified in a body with a circuit can be formed.

公开(公告)号：CA2405830A1

公开(公告)日：2002-01-03

申请号：CA2405830

申请日：2001-03-07

Applicant: MACDERMID INC

Inventor： SCHWEIKHER WILLIAM ,  BENGSTON JON ,  LARSON GARY B ,  KUKANSKIS PETER

IPC: C23C18/18 ,  H01C17/065 ,  H01C17/18 ,  H01L23/12 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/26 ,  H05K3/38 ,  H01L23/48 ,  H01L21/20 ,  H01L21/302 ,  H01L21/31 ,  H01L29/40 ,  H01L21/44 ,  H01L21/461 ,  H01L21/469 ,  H01L23/52

Abstract: A process and product manufactured by the process is revealed whereby resistors (16) can be manufactured integral a printed circuit board (10, 13) by plating the resistors onto an insulative substrate (10). Uniformization o f the insulative substrate by etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.

公开(公告)号：ES2224209T3

公开(公告)日：2005-03-01

申请号：ES97307983

申请日：1997-10-09

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  LARSON GARY B ,  BENGSTON JON ,  SCHWEIKHER WILLIAM

IPC: C23C18/18 ,  H01C17/065 ,  H01C17/18 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38

Abstract: SE REVELA UN PROCESO EN DONDE LAS RESISTENCIAS SE PUEDEN FABRICAR DE FORMA INTEGRADA CON LA PLACA DE CIRCUITO IMPRESO, COLOCANDO LAS RESISTENCIAS EN FORMA DE PLACAS (16) EN EL SUSTRATO AISLANTE (10). LA UNIFORMIZACION DEL SUSTRATO AISLANTE (10) POR MEDIO DEL DECAPADO CON ACIDO Y DE LA OXIDACION DE LA RESISTENCIA COLOCADA EN FORMA DE PLACAS (16) SE REVELAN COMO TECNICAS PARA LA MEJORA DE LA UNIFORMIDAD Y DE LA CONSISTENCIA DE LAS RESISTENCIAS COLOCADAS EN FORMA DE PLACAS (16).

公开(公告)号：DE69730288T2

公开(公告)日：2004-12-30

申请号：DE69730288

申请日：1997-10-09

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  LARSON GARY B ,  BENGSTON JON ,  SCHWEIKHER WILLIAM

IPC: C23C18/18 ,  H01C17/065 ,  H01C17/18 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38

公开(公告)号：CA2405830C

公开(公告)日：2007-05-22

申请号：CA2405830

申请日：2001-03-07

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  LARSON GARY B ,  BENGSTON JON ,  SCHWEIKHER WILLIAM

IPC: H01L23/48 ,  C23C18/18 ,  H01C17/065 ,  H01C17/18 ,  H01L21/20 ,  H01L21/302 ,  H01L21/31 ,  H01L21/44 ,  H01L21/461 ,  H01L21/469 ,  H01L23/12 ,  H01L23/52 ,  H01L29/40 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/26 ,  H05K3/38

Abstract: A process and product manufactured by the process is revealed whereby resistors (16) can be manufactured integral a printed circuit board (10, 13) by plating the resistors onto an insulative substrate (10). Uniformization of the insulative substrate by etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.

公开(公告)号：DE69730288D1

公开(公告)日：2004-09-23

申请号：DE69730288

申请日：1997-10-09

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  LARSON GARY B ,  BENGSTON JON ,  SCHWEIKHER WILLIAM

IPC: C23C18/18 ,  H01C17/065 ,  H01C17/18 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38

公开(公告)号：AU4009001A

公开(公告)日：2002-01-08

申请号：AU4009001

申请日：2001-03-07

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  LARSON GARY B ,  BENGSTON JON ,  SCHWEIKHER WILLIAM

IPC: C23C18/18 ,  H01C17/065 ,  H01C17/18 ,  H01L23/12 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/26 ,  H05K3/38 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/20 ,  H01L21/44 ,  H01L21/302 ,  H01L21/461 ,  H01L21/31 ,  H01L21/469

Abstract: A process is revealed whereby resistors can be manufactured integral with the printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.

公开(公告)号：EP1295337A4

公开(公告)日：2004-08-18

申请号：EP01914736

申请日：2001-03-07

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  LARSON GARY B ,  BENGSTON JON ,  SCHWEIKHER WILLIAM

IPC: C23C18/18 ,  H01C17/065 ,  H01C17/18 ,  H01L23/12 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H05K3/24 ,  H05K3/26 ,  H05K3/38

CPC classification number: H01C17/18 ,  H01C17/065 ,  H01L24/05 ,  H01L2924/12042 ,  H05K1/167 ,  H05K3/064 ,  H05K3/184 ,  H05K3/381 ,  H05K2201/0344 ,  H05K2203/025 ,  H05K2203/0315 ,  H05K2203/0796 ,  H05K2203/095 ,  H05K2203/1453 ,  H01L2924/00

Abstract: A process and product manufactured by the process is revealed whereby resistors (16) can be manufactured integral a printed circuit board (10, 13) by plating the resistors onto an insulative substrate (10). Uniformization of the insulative substrate by etching and oxidation of the plated resistor are revealed as techniques for improving the uniformity and consistency of the plated resistors.