公开(公告)号：JP2007158362A

公开(公告)日：2007-06-21

申请号：JP2007001542

申请日：2007-01-09

Applicant: Macdermid Inc ,  マクダーミド・インコーポレーテツド

Inventor： KUKANSKIS PETER ,  FRITZ DENNIS ,  DURSO FRANK ,  CASTALDI STEVEN ,  SAWOSKA DAVID

IPC: H05K1/16 ,  H01C7/00 ,  H01C17/16 ,  H01C17/24 ,  H01C17/242 ,  H01L23/12 ,  H05K3/06 ,  H05K3/18

CPC classification number: H01C17/24 ,  H01C17/242 ,  H05K1/167 ,  H05K3/027 ,  H05K3/064 ,  H05K3/184 ,  H05K2201/0344 ,  H05K2203/0315 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K2203/171

Abstract: PROBLEM TO BE SOLVED: To provide a production method of a printed circuit board having integrally plated resistors. SOLUTION: This production method of a printed circuit board comprises: applying an etching resist to a part of a metal surface of a metal-coated laminated boards; forming a metal circuit by corroding and removing an exposed metal surface; peeling the resist; plating an exposed region of the core with a resister material having a volume resistivity of 500 to 1×10 -4 Ω cm; and trimming the resistable material so that the resistor has an insulating resistance equal to a predetermined ohm value. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供具有整体电镀电阻器的印刷电路板的制造方法。 解决方案：印刷电路板的这种制造方法包括：在金属涂覆层压板的金属表面的一部分上施加抗蚀剂; 通过腐蚀和去除暴露的金属表面形成金属电路; 剥离抗蚀剂; 用体积电阻率为500〜1×10 -4Ω·cm的电阻材料电镀芯的露出区域; 并修整电阻材料，使得电阻器的绝缘电阻等于预定的欧姆值。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：CA2434161A1

公开(公告)日：2002-08-29

申请号：CA2434161

申请日：2002-01-15

Applicant: MACDERMID INC

Inventor： SAWOSKA DAVID ,  FRITZ DENNIS ,  CASTALDI STEVEN ,  DURSO FRANK ,  KUKANSKIS PETER

IPC: H01C7/00 ,  H01C17/24 ,  H01C17/242 ,  H01L23/12 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  C23F1/00

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate . Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

公开(公告)号：AU2002235402A1

公开(公告)日：2002-09-04

申请号：AU2002235402

申请日：2002-01-15

Applicant: MACDERMID INC

Inventor： DURSO FRANK ,  SAWOSKA DAVID ,  CASTALDI STEVEN ,  FRITZ DENNIS ,  KUKANSKIS PETER

IPC: H01C7/00 ,  H01C17/24 ,  H01C17/242 ,  H01L23/12 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H01L23/48 ,  C23F1/00 ,  B44C1/22

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

公开(公告)号：CA2434161C

公开(公告)日：2006-12-05

申请号：CA2434161

申请日：2002-01-15

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  CASTALDI STEVEN ,  SAWOSKA DAVID ,  FRITZ DENNIS ,  DURSO FRANK

IPC: H05K1/16 ,  C23F1/00 ,  H01C7/00 ,  H01C17/24 ,  H01C17/242 ,  H01L23/12 ,  H05K3/06 ,  H05K3/18

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate . Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

公开(公告)号：HK1066321A1

公开(公告)日：2005-03-18

申请号：HK04109030

申请日：2004-11-16

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  FRITZ DENNIS ,  DURSO FRANK ,  CASTALDI STEVEN ,  SAWOSKA DAVID

IPC: H01L20060101 ,  B44C20060101 ,  C23F20060101 ,  H01C7/00 ,  H01C17/24 ,  H01C17/242 ,  H01L23/12 ,  H05K20060101 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

公开(公告)号：WO02066256A3

公开(公告)日：2002-11-21

申请号：PCT/US0201409

申请日：2002-01-15

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  FRITZ DENNIS ,  DURSO FRANK ,  CASTALDI STEVEN ,  SAWOSKA DAVID

IPC: H01C7/00 ,  H01C17/24 ,  H01C17/242 ,  H01L23/12 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H01L23/48 ,  B44C1/22 ,  C23F1/00

CPC classification number: H01C17/24 ,  H01C17/242 ,  H05K1/167 ,  H05K3/027 ,  H05K3/064 ,  H05K3/184 ,  H05K2201/0344 ,  H05K2203/0315 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K2203/171

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

Abstract translation: 揭示了一种工艺，其中电阻器可以通过将电阻器电镀到绝缘基板上而与印刷电路板一体制造。 作为用于改善镀覆电阻器的均匀性和一致性的技术，讨论了绝缘衬底通过电镀电阻器的蚀刻和氧化的均匀化。 还公开了修整和烘烤作为用于调节和稳定电镀电阻器的电阻的方法。

公开(公告)号：EP1360720A4

公开(公告)日：2007-01-10

申请号：EP02702009

申请日：2002-01-15

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER ,  FRITZ DENNIS ,  DURSO FRANK ,  CASTALDI STEVEN ,  SAWOSKA DAVID

IPC: H01C7/00 ,  H01C17/24 ,  H01C17/242 ,  H01L23/12 ,  H05K1/16 ,  H05K3/06 ,  H05K3/18 ,  H01L23/48 ,  B44C1/22 ,  C23F1/00

CPC classification number: H01C17/24 ,  H01C17/242 ,  H05K1/167 ,  H05K3/027 ,  H05K3/064 ,  H05K3/184 ,  H05K2201/0344 ,  H05K2203/0315 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K2203/1453 ,  H05K2203/171

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.