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公开(公告)号：US3650859A
公开(公告)日：1972-03-21
申请号：US3650859D
申请日：1969-09-12
Applicant: MACDERMID INC
Inventor： OTTAVIO EUGENE D D
CPC classification number: C23C18/1617 , Y10T428/31
Abstract: A spent chromic acid etching solution, which has been used, for example, to etch plastic substrates, is regenerated by adding, with mixing, an alkali metal permanganate, such as potassium permanganate, and separating the resulting sludge which forms. During the regeneration process trivalent chromium in the etchant is oxidized to hexavalent chromium. The regenerated etching solution, thus recovered, is utilized as an etchant per se or it may be reconstituted with added sulfuric acid and/or chromic acid as required.
Abstract translation: 已经用于例如蚀刻塑料基材的废铬酸蚀刻溶液通过混合加入碱金属高锰酸盐如高锰酸钾并分离所形成的污泥来再生。 在再生过程中，蚀刻剂中的三价铬被氧化成六价铬。 如此回收的再生蚀刻液被用作蚀刻剂本身，或者可以根据需要用添加的硫酸和/或铬酸重构。
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2.发明授权Pre-activation treatment in the electroless plating of synthetic resin substrates 失效合成树脂基材的电沉积中的预活化处理
公开(公告)号：US3563784A
公开(公告)日：1971-02-16
申请号：US3563784D
申请日：1968-09-09
Applicant: MACDERMID INC
Inventor： INNES WILLIAM P , OTTAVIO EUGENE D D , BROWN SHARON D
CPC classification number: C23C18/30 , C23C18/208 , C23C18/24 , C23C18/26 , C23C18/285
Abstract: AQUEOUS DILUTE SURFACTANT SOLUTIONS ARE EMPLOYED IN THE TREATMENT OF PLASTIC SUBSTRATES TO PREPARE THEM FOR ELECTROLESS PLAING TO ENSURE COMPLETE COVERAGE OF THE SUBSTRATE SURFACE BY THE METAL. THE SUBSTRATES ARE IMMERSED IN THE SUFACTANT SOLUTION AS A PRELIMINARY STEP IMMEDIATELY PRECEDING THE ACTIVATION OF THE SUBSTRATE IN THE NORMAL CYCLE OF ELECTROLESS PLATING OPERATIONS, SUPPLANTING VARIOUS OTHER PRE-ACTIVATION STEPS AND, UNLIKE SUCH PRIOR STEPS, BEING OPERATIVE FOR ALL TYPES OF SYNTHETIC RESINS ENCOUNTERED IN ELECTROLESS PLATING OPERATIONS.
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公开(公告)号：US3647512A
公开(公告)日：1972-03-07
申请号：US3647512D
申请日：1970-07-02
Applicant: MACDERMID INC
Inventor： GRUNWALD JOHN J , OTTAVIO EUGENE D D
CPC classification number: C23C18/206 , C01B25/003 , H05K3/181 , H05K3/381
Abstract: The invention discloses compositions for and methods of treating the surface of molded polyolefins, more especially polypropylene, polyethylene and polybutylene, prior to the deposition of a metallic plate thereon in order to improve the adherence of the plate to the surface of the polyolefin substrate. The compositions comprise stable, aqueous microemulsions of the oilin-water-type containing as the principal active agents a mixture of white phosphorus and trichloroethylene.
Abstract translation: 本发明公开了在其上沉积金属板之前处理模塑聚烯烃表面，尤其是聚丙烯，聚乙烯和聚丁烯表面的组合物和方法，以便改善板对聚烯烃基材表面的粘附性。 所述组合物包含稳定的水包油型微乳液，其含有白磷和三氯乙烯的混合物作为主要活性剂。
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4.发明授权
公开(公告)号：US3592744A
公开(公告)日：1971-07-13
申请号：US3592744D
申请日：1968-12-02
Applicant: MACDERMID INC
Inventor： GRUNWALD JOHN J , OTTAVIO EUGENE D D , DURSO FRANK L
CPC classification number: C23C18/163 , C23C18/1625 , C23C18/1632 , C23C18/1653 , C23C18/2086 , C25D17/08
Abstract: A METHOD IS DISCLOSED FOR TREATING PLASTIC SHEATHED METAL JIGS OR RACKS CONVENTIONALLY USED IN SUPPORTING AND TRANSPORTING NONCONDUCTIVE ARTICLES THROUGH CHEMICAL AND ELECTROPLATING SOLUTIONS IN THE COURSE OF A CONTINUOUS PLATING CYCLE FOR METALLIZING THE ARTICESS, WHEREBY TO PREVENT OR REDUCE DEPOSIT OF METAL ON THE RACKS THEMSELVES. O THIS END, THE RACKS ARE TREATED TO CAUSE ADSORPTION OF HEXAVALENT CHROMIUM IONS AT THE SURFACE OF THEIR PLASTIC SHEATHED PROTIONS.
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公开(公告)号：US3682786A
公开(公告)日：1972-08-08
申请号：US3682786D
申请日：1970-02-18
Applicant: MACDERMID INC
Inventor： BROWN SHARON D , OTTAVIO EUGENE D D , KUZMIK JOHN J , GRUNWALD JOHN J
CPC classification number: C23C18/26 , C23C18/208 , C23C18/285 , C23C18/30 , H05K3/188 , Y10S205/927 , Y10S205/928
Abstract: PLASTIC SUBSTRATES, SUCH AS POLYPROPYLENE, ABS, ETC. ARE PLATED WITH AN ADHERENT METAL COATING IN A PROCESS WHICH AVOIDS COMPLETELY THE ART-EMPLOYED STEPS OF ETCHING IN A CHROMIC-SULFURIC ACID SOLUTION AS WELL AS THE DEPOSITION OF A THIN COATING OF METAL ON THE SUBSTRATE FROM AN ELECTROLESS PLATING BATH PRIOR TO THE ELECTROLYTIC PLATING OPERATION. PLASTIC SUBSTRATES ARE (1) TREATED WITH A SOLUTION OR DISPERSION OF SULFUR IN A SUITABLE SOLVENT, SUCH AS A TRICHLOROETHYLENE, (2) CONTACTED WITH AN AQUEOUS SOLUTION OF A CUPROUS SALT; SUCH AS CUPROUS CHLORIDE, (3) OPTIONALLY TREATED WITH AN AQUEOUS SOLUTION OF PALLADIUM CHLORIDE AND FINALLY (4) ELECTROPLATED TO FORM A COATING OF THE DESIRED METAL OF THE DESIRED THICKNESS.
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Patent Agency Ranking6.发明授权An electroless plating process employing a specially prepared palladium-tin activator solution 失效采用特制的PADADIUM-TIN激活剂溶液的电沉积工艺
公开(公告)号：US3650913A
公开(公告)日：1972-03-21
申请号：US3650913D
申请日：1969-09-08
Applicant: MACDERMID INC
Inventor： OTTAVIO EUGENE D D
CPC classification number: C23C18/28
Abstract: A METHOD OF ELECTROLESS METAL PLATING OF PLASTIC SUBSTRATES IS DISCLOSED INVOLVING THE USE OF A ONE-STEP ACID TIN-PALLADIUM CATALYST ACTIVATING SOLUTION PREPARED IN A PARTICULAR MANNER, RESULTING IN IMPROVED PLATING OPERATIONS AND PLATED SUBSTRATES.
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7.发明授权Method of and solution for accelerating activation of plastic substrates in electroless metal plating system 失效用于加速电镀金属镀层系统中塑料基板的激活的方法和解决方案
公开(公告)号：US3622370A
公开(公告)日：1971-11-23
申请号：US3622370D
申请日：1969-04-07
Applicant: MACDERMID INC
Inventor： OTTAVIO EUGENE D D , GRUNWALD JOHN J
CPC classification number: C23C18/28 , C23C18/1617 , C23C18/26
Abstract: A method is disclosed for accelerating the activation of a polymeric plastic substrate in a chemical plating process incorporating a preliminary chromic acid etch involving immersing the substrate in an acidic dilute palladium chloride solution following activation, and rejuvenating that accelerating solution with periodic additions of stannous ions sufficient to reduce hexavalent chromium contamination carried over from the preliminary chromic acid etch to a prescribed maximum level without incurring substantial precipitation of palladium in the accelerating solution.
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公开(公告)号：US3632388A
公开(公告)日：1972-01-04
申请号：US3632388D
申请日：1969-04-14
Applicant: MACDERMID INC
Inventor： GRUNWALD JOHN J , OTTAVIO EUGENE D D , KUZMIK JOHN J
CPC classification number: C23C18/28
Abstract: A method is disclosed for treating the surface of a polymeric plastic substrate in a chemical plating process incorporating a preliminary chromic acid etch followed by one-step activation in a tin-palladium hydrosol. The method involves the step of immersing the substrate in a dilute aqueous acid solution of stannous chloride between the etching and activating steps.
Abstract translation: 公开了一种在化学电镀工艺中处理聚合物塑料基材表面的方法，其中包括初步铬酸蚀刻，随后在锡 - 钯水溶胶中进行一步活化。 该方法包括在蚀刻和激活步骤之间将衬底浸入氯化亚锡的稀酸水溶液中的步骤。
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公开(公告)号：US3620933A
公开(公告)日：1971-11-16
申请号：US3620933D
申请日：1969-12-31
Applicant: MACDERMID INC
Inventor： GRUNWALD JOHN J , OTTAVIO EUGENE D D , RHODENIZER HAROLD L , LOMBARDO MICHAEL S
CPC classification number: B32B15/08 , B32B15/20 , B32B27/32 , B32B2309/022 , B32B2309/025 , B32B2311/24 , B32B2323/10 , B32B2355/02 , B32B2457/08 , C23C18/1653 , C25D5/022 , H05K1/0366 , H05K1/09 , H05K3/184 , H05K3/381 , H05K3/385 , H05K2201/0129 , H05K2201/0355 , H05K2203/0315 , H05K2203/0716 , H05K2203/1105 , H05K2203/1152 , H05K2203/1407
Abstract: Plastic parts are formed against an anodically treated aluminum surface by molding, laminating, etc., whereby the surface of the formed part after removal of or separation from the aluminum has a high-energy level and is receptive to adherent coatings of paint or metal plate. In particular, in addition to preparing plastic surfaces for acceptance and adhesion of paints, inks or the like, printed circuit boards and other metal-plated plastic substrates are prepared by first bonding anodically treated aluminum foil to a plastic substrate to provide a sacrificial cladding on the substrate, then stripping the aluminum chemically from the substrate, catalyzing the stripped surface and depositing a conductor metal plate thereon by electroless and/or electrolytic deposition, after application of a resist pattern of the desired circuit in the case of printed circuit boards.
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10.发明授权Compositions for and methods of improving adhesion of plated metal on plastic substrates 失效改善塑料基材上镀金属粘合剂的组合物和方法
公开(公告)号：US3579365A
公开(公告)日：1971-05-18
申请号：US3579365D
申请日：1967-06-14
Applicant: MACDERMID INC
Inventor： GRUNWALD JOHN J , OTTAVIO EUGENE D D
CPC classification number: C23C18/30 , C23C18/208 , C23C18/24 , C23C18/285
Abstract: A METHOD OF AND COMPOSITION FOR PROMOTING ADHESION BETWEEN PLATED METAL AND A PLASTIC SUBSTRATE, IN WHICH THE ACTIVE AGENT IS PROVIDED IN FINELY DIVIDED DISPERSED OR COLLOIDAL AQUEOUS EMULSION FORM. THE ACTIVE AGENTS ARE ANY OF A GROUP OF LOW MOLECULAR WEIGHT ORGANIC UNSATURATED COMPOUNDS OF THE FATTY ACID TYPE, AND MORE ESPECIALLY OF THE GROUP OF NATURALLY OCCURRING PRODUCTS SUCH AS LINSEED, TALL, TUNG AND CASTOR OILS, TURPENTINE AND SIMILAR WOOD ROSINS. THESE, WHEN DISPERSED IN WATER TO PROVIDE STABLE EMULSIONS, ARE USED AS A PRETREATMENT BATH FOR PLASTIC SUBSTRATES, PRIOR TO PLATING OF THE SUBSTRATE, IN ORDER TO PROMOTE THE FORMTAION OF A STRONGER BOND BETWEEN THE METAL PLATE AND SUBSTRATE.
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