公开(公告)号：CA1130952A

公开(公告)日：1982-09-07

申请号：CA325487

申请日：1979-04-12

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  GRUNWALD JOHN J ,  FERRIER DONALD R ,  SAWOSKA DAVID A

IPC: C23C18/40 ,  H05K3/18 ,  C23C3/02

Abstract: Electroless copper deposition solutions, and method of electrolessly depositing copper onto a suitably catalysed and generally non-conductive workpiece surface using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with solution. The reducing agent is a soluble source of hypophosphite ions and the complexing agent is selected to be effective at pH level between 5 and 13 for complexing cupric ions and the solution pH is coordinated within the pH range for the complexer selected to give a deposited conductive copper film.

公开(公告)号：DE2920766A1

公开(公告)日：1979-11-29

申请号：DE2920766

申请日：1979-05-22

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  GRUNWALD JOHN J ,  FERRIER DONALD R ,  SAWOSKA DAVID A

IPC: C23C18/40 ,  H05K3/18 ,  C23C3/02

Abstract: Electroless copper deposition solutions, and method of electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with the solution. The invention comprehends replacing the usual formaldehyde-type reducing agents of commercial electroless copper baths with non-formaldehyde-type agents, specifically hypophosphites, by coordinating the particular complexing agents employed and the bath pH, to effect reduction of cupric ions to a metallic copper plating on a prepared surface of a substrate, wherein the resulting electroless metal deposit has conductive properties at least satisfactory for build-up of additional thickness of metal by standard electroplating techniques. Improvement over the prior formaldehyde-reduced electroless copper solutions is obtained in that the invention teaches those skilled in the art how to achieve satisfactory copper deposition over longer periods of bath operation than has been practical heretofore. Fluctuations in component concentration and bath temperatures are inherent and unavoidable in the course of commercial use of the bath and these are normally detrimental to protracted use of formaldehyde-reduced copper solutions. In the present invention, bath stability is maintained better, in spite of these inherent fluctuations.

公开(公告)号：AU536632B2

公开(公告)日：1984-05-17

申请号：AU4641779

申请日：1979-04-24

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  GRUNWALD JOHN J ,  FERRIER DONALD R ,  SAWOSKA DAVID A

IPC: C23C18/40 ,  H05K3/18 ,  C23C3/02

Abstract: Electroless copper deposition solutions, and method of electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with the solution. The invention comprehends replacing the usual formaldehyde-type reducing agents of commercial electroless copper baths with non-formaldehyde-type agents, specifically hypophosphites, by coordinating the particular complexing agents employed and the bath pH, to effect reduction of cupric ions to a metallic copper plating on a prepared surface of a substrate, wherein the resulting electroless metal deposit has conductive properties at least satisfactory for build-up of additional thickness of metal by standard electroplating techniques. Improvement over the prior formaldehyde-reduced electroless copper solutions is obtained in that the invention teaches those skilled in the art how to achieve satisfactory copper deposition over longer periods of bath operation than has been practical heretofore. Fluctuations in component concentration and bath temperatures are inherent and unavoidable in the course of commercial use of the bath and these are normally detrimental to protracted use of formaldehyde-reduced copper solutions. In the present invention, bath stability is maintained better, in spite of these inherent fluctuations.

公开(公告)号：AU4641779A

公开(公告)日：1979-11-29

申请号：AU4641779

申请日：1979-04-24

Applicant: MACDERMID INC

Inventor： KUKANSKIS PETER E ,  GRUNWALD JOHN J ,  FERRIER DONALD R ,  SAWOSKA DAVID A

IPC: C23C18/40 ,  H05K3/18 ,  C23C3/02

Abstract: Electroless copper deposition solutions, and method of electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with the solution. The invention comprehends replacing the usual formaldehyde-type reducing agents of commercial electroless copper baths with non-formaldehyde-type agents, specifically hypophosphites, by coordinating the particular complexing agents employed and the bath pH, to effect reduction of cupric ions to a metallic copper plating on a prepared surface of a substrate, wherein the resulting electroless metal deposit has conductive properties at least satisfactory for build-up of additional thickness of metal by standard electroplating techniques. Improvement over the prior formaldehyde-reduced electroless copper solutions is obtained in that the invention teaches those skilled in the art how to achieve satisfactory copper deposition over longer periods of bath operation than has been practical heretofore. Fluctuations in component concentration and bath temperatures are inherent and unavoidable in the course of commercial use of the bath and these are normally detrimental to protracted use of formaldehyde-reduced copper solutions. In the present invention, bath stability is maintained better, in spite of these inherent fluctuations.