Abstract:
Un proceso para el metalizado de cobre de un artículo de cinc o aleación de cinc que comprende las etapas de: a. sumergir dicho artículo de cinc o aleación de cinc en una disolución acuosa y alcalina de níquel para formar un revestimiento de níquel continuo y adherente sobre una superficie de dicho artículo de cinc o aleación de cinc, comprendiendo dicha disolución acuosa y alcalina de níquel una fuente de níquel, una fuente de pirofosfato, y una fuente de hidróxido; y posteriormente b. someter a electrometalizado dicho artículo de cinc o aleación de cinc en una disolución de pirofosfato de cobre para formar un revestimiento de cobre adherente sobre dicho artículo de cinc o aleación de cinc revestido con níquel, donde dicha disolución de pirofosfato de cobre no contiene cianuro.
Abstract:
Un proceso para mejorar la soldabilidad de una superficie de metal, comprendiendo dicho proceso: a) contacto de la superficie de metal con una solución de metalizado de plata produciendo así una placa de plata sobre la superficie de metal; y a continuación b) tratamiento de la superficie de metal metalizada con plata con una solución que comprende un mercapto o tio silano sustituido.
Abstract:
A method of extending the lifetime of an electroless nickel plating bath by avoiding the addition of unwanted anions to the process and of improving the pH stability of the bath and minimizing additions of pH correcting additives. The method includes the steps of (a) depositing electroless nickel from an electroless nickel plating bath onto a substrate, wherein the electroless nickel plating bath preferably contains a source of nickel ions and a source of hypophosphite ions; (2) immersing a nickel anode in the plating bath; (3) completing the circuit by utilizing a cathode separated from the nickel bath by an ion exchange membrane and using a catholyte comprising an acid or a salt thereof; and (4) passing a current through the bath. Nickel is dissolved into the plating bath to maintain the nickel concentration and hydrogen is discharged from the cathode.
Abstract:
The invention consists of a method for producing an adherent copper coating on a zinc or zinc alloy article without the use of cyanide as a component of the process. The zinc or zinc alloy article is first immersed in an aqueous nickel pyrophosphate solution and is then electroplated with a copper pyrophosphate solution. The method produces an adherent copper coating on the zinc or zinc alloy, which can be deformed without any loss of the copper coating.
Abstract:
The invention consists of a method for producing an adherent copper coating on a zinc or zinc alloy article without the use of cyanide as a component of the process. The zinc or zinc alloy article is first immersed in an aqueous nickel pyrophosphate solution and is then electroplated with a copper pyrophosphate solution. The method produces an adherent copper coating on the zinc or zinc alloy, which can be deformed without any loss of the copper coating.
Abstract:
A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with a silver plate prior to soldering, which immersion silver plate is treated with an additive comprising a mercapto substituted or thio substituted silane compound. Preferred post treatments comprise 3-mercapto propyl trimethoxysilane and/or 3-oxtanoylthio-1-propyltriethoxy silane.