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公开(公告)号：JPH10190183A
公开(公告)日：1998-07-21
申请号：JP34237397
申请日：1997-12-12
Applicant: MACDERMID INC , HADCO CORP
Inventor： BENGSTON JON , LARSON GARY B , KOLOGE DONNA , SCHWEIKHER WILLIAM , DEREGO TODD , RAABERG BRUCE S , SORENSON BRUCE
Abstract: PROBLEM TO BE SOLVED: To make a resistor to be printed and plated as the integrated part of the circuit of a printed circuit board by plating a resistive material to an insulating substrate existing between conductive areas so that the resistive material may connect the conductive areas to each other. SOLUTION: After exposed copper is etched off and an etch resist is removed, the exposed surface is activated and a mask for plating which substantially covers the entire exposed surface except an area where a resistor 16 is to be plated is applied to the surface. Then the exposed surface is plated with a resistive material and the mask for plating is removed. After the mask is removed, the surface of a bare dielectric substrate 10 is activated so that the surface may accept plating. Then a mask for plating is applied to the substrate 10 so that a desired circuit may be demarcated in a negative state and the area between the circuit and a position related to the resistor 16 may be demarcated in a positive state. Thereafter, the desired circuit is plated and a resist 15 is removed.
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公开(公告)号：ES2410811T3
公开(公告)日：2013-07-03
申请号：ES03713509
申请日：2003-02-18
Applicant: MACDERMID INC
Inventor： KOLOGE DONNA , LETIZE RAYMOND , LARSON BRIAN
Abstract: Un método para eliminar plata depositada de una tarjeta de circuito impreso, estando la plata depositada sobre unmetal de base de la tarjeta de circuito impreso, comprendiendo dicho método las etapas de: (a) poner en contacto dicha tarjeta de circuito impreso con una disolución de separación que comprende unagente oxidante, un agente de ajuste de pH alcalino y un agente de solubilización de plata, donde dicho agenteoxidante está seleccionado entre permanganato de sodio, permanganato de potasio, clorito de sodio, clorito depotasio, clorato de sodio o clorato de potasio; dicho agente de solubilización de plata está seleccionado entresuccinimida y fuentes de iones amonio; y el pH de la disolución está entre 11 y 13,5; y (b) neutralizar dicha tarjeta de circuito impreso con una disolución de neutralización.
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公开(公告)号：ES2676750T3
公开(公告)日：2018-07-24
申请号：ES09818156
申请日：2009-07-17
Applicant: MACDERMID INC
Inventor： LONG ERNEST , TOSCANO LENORA M , MCKIRRYHER COLLEEN , ROMAINE PAUL , KOLOGE DONNA , CASTALDI STEVEN A , STEINECKER CARL P
IPC: C23C18/54 , B23K35/30 , B23K35/36 , C23C18/12 , C23C18/16 , C23C18/18 , C23C18/42 , H05K3/24 , H05K3/28
Abstract: Un proceso para mejorar la soldabilidad de una superficie de metal, comprendiendo dicho proceso: a) contacto de la superficie de metal con una solución de metalizado de plata produciendo así una placa de plata sobre la superficie de metal; y a continuación b) tratamiento de la superficie de metal metalizada con plata con una solución que comprende un mercapto o tio silano sustituido.
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公开(公告)号：EP2342372A4
公开(公告)日：2013-01-23
申请号：EP09818156
申请日：2009-07-17
Applicant: MACDERMID INC
Inventor： LONG ERNEST , TOSCANO LENORA M , MCKIRRYHER COLLEEN , ROMAINE PAUL , KOLOGE DONNA , CASTALDI STEVEN A , STEINECKER CARL P
CPC classification number: H05K3/282 , B23K35/3006 , B23K35/3612 , C23C18/1204 , C23C18/1601 , C23C18/1689 , C23C18/1824 , C23C18/42 , C23C18/54 , H05K3/244
Abstract: A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with a silver plate prior to soldering, which immersion silver plate is treated with an additive comprising a mercapto substituted or thio substituted silane compound. Preferred post treatments comprise 3-mercapto propyl trimethoxysilane and/or 3-oxtanoylthio-1-propyltriethoxy silane.
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