MANUFACTURE OF PRINTED CIRCUIT BOARD HAVING PLATED RESISTOR

    公开(公告)号:JPH10190183A

    公开(公告)日:1998-07-21

    申请号:JP34237397

    申请日:1997-12-12

    Abstract: PROBLEM TO BE SOLVED: To make a resistor to be printed and plated as the integrated part of the circuit of a printed circuit board by plating a resistive material to an insulating substrate existing between conductive areas so that the resistive material may connect the conductive areas to each other. SOLUTION: After exposed copper is etched off and an etch resist is removed, the exposed surface is activated and a mask for plating which substantially covers the entire exposed surface except an area where a resistor 16 is to be plated is applied to the surface. Then the exposed surface is plated with a resistive material and the mask for plating is removed. After the mask is removed, the surface of a bare dielectric substrate 10 is activated so that the surface may accept plating. Then a mask for plating is applied to the substrate 10 so that a desired circuit may be demarcated in a negative state and the area between the circuit and a position related to the resistor 16 may be demarcated in a positive state. Thereafter, the desired circuit is plated and a resist 15 is removed.

    Método para separar plata de una tarjeta de circuito impreso

    公开(公告)号:ES2410811T3

    公开(公告)日:2013-07-03

    申请号:ES03713509

    申请日:2003-02-18

    Applicant: MACDERMID INC

    Abstract: Un método para eliminar plata depositada de una tarjeta de circuito impreso, estando la plata depositada sobre unmetal de base de la tarjeta de circuito impreso, comprendiendo dicho método las etapas de: (a) poner en contacto dicha tarjeta de circuito impreso con una disolución de separación que comprende unagente oxidante, un agente de ajuste de pH alcalino y un agente de solubilización de plata, donde dicho agenteoxidante está seleccionado entre permanganato de sodio, permanganato de potasio, clorito de sodio, clorito depotasio, clorato de sodio o clorato de potasio; dicho agente de solubilización de plata está seleccionado entresuccinimida y fuentes de iones amonio; y el pH de la disolución está entre 11 y 13,5; y (b) neutralizar dicha tarjeta de circuito impreso con una disolución de neutralización.

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