公开(公告)号：JP2001118994A

公开(公告)日：2001-04-27

申请号：JP29777499

申请日：1999-10-20

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： TORII MICHIHARU ,  IMAZU KENICHI

IPC: H01L21/822 ,  G01R1/06 ,  H01L21/60 ,  H01L27/04

Abstract: PROBLEM TO BE SOLVED: To improve the fitting a accuracy of a probe and the hit of the probe to an electrode when a probe inspection device is generated and to perform a stable total inspection of chips on a wafer, when electrical inspection of the semiconductor chips with metal bump electrodes for liquid crystal driver and electrode pitches are made to be fine. SOLUTION: Aluminum pad electrodes for electric inspection 8, which are connected to metal bump electrodes 1a on a silicon chip 2, are installed. By not forming metal bumps in inspection electrodes but inspecting in aluminum pad state, inspection can be executed, without having to develop new facilities. Since the aluminum pad electrodes 8 are arranged on the silicon chip 2 at positions which are not related to junctions with a tape carrier, they can be arranged on the chip at rough pitches with respect to the metal bump electrodes 1a and accordingly stable inspection can be executed.

公开(公告)号：JPH11251503A

公开(公告)日：1999-09-17

申请号：JP5165198

申请日：1998-03-04

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： SAKAGUCHI SHIGEKI ,  IMAZU KENICHI ,  NARAOKA HIROKI ,  SAWADA TOMIZO ,  AOI KAZUHIRO

IPC: H05K1/18 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To solder parts easily firmly, by depositing a metal layer made of Sn containing Bi less than predetermined in percent on an electrode lead wire to be connected to the outside. SOLUTION: A metal layer made of Sn containing by weight less than 4% Bi is deposited on an electrode lead wire 5 connected to the outside as an outermost metal layer 6. A semiconductor element is die-bonded on a Cu lead frame and is provided with a wiring connected to an external electrode. An underlayer Ni-plated film is formed on the electrode lead wire 5 to be connected to the outside of the semiconductor device subjected to plastic sealing and lead forming, and then Bi is deposited on the metal underlayer as an Sn-Bi alloy film. This can make it possible to easily mount electronic parts on a printed substrate or a circuit substrate with solder at a low temperature and to improve the reliability of the portion bonded with solder.