公开(公告)号：JPH11260856A

公开(公告)日：1999-09-24

申请号：JP5914798

申请日：1998-03-11

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： UENO JUNICHI ,  YAMADA YASUHIRO ,  ADACHI OSAMU ,  HAMAYA TAKESHI

IPC: H01L21/60

Abstract: PROBLEM TO BE SOLVED: To attain high density mounting by making this device compact and thin, to reduce cost, to simplify treatment, and to stabilize manufacturing quality. SOLUTION: This device is provided with a semiconductor chip 1, having a pad electrode 2, wire 3 bonded on the pad electrode 2, and sealing material formed by hardening liquid encapsulating resin 4 for encapsulating the semiconductor chip 1 by covering the pad electrode face, and a part of the wire 3 is exposed on the surface of the encapsulating material. Thus, since a part of the wire 3 is exposed on the surface of the encapsulating material so as to be used as an electrode for connection with the outside, it is not necessary to provide a conventional lead frame. Thus, the semiconductor device can be made compact and thin, and high density mounting can be attained. Also the number of item parts or materials are reduces so that costs can be reduced to pidlly, and manufacturing assembly is easily attained. Moreover, since the lead does not project so that handling is mode easy, connection failure based on lead deformation can be prevented, and yield can be improved.

公开(公告)号：JP2000183263A

公开(公告)日：2000-06-30

申请号：JP36051398

申请日：1998-12-18

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： YAMADA YASUHIRO ,  NANO MASANORI ,  OIDA SHIGEJI ,  MATSUO TAKAHIRO ,  YAMADA YUICHIRO

IPC: H01L21/56 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor package having improved reliability in substrate mounting and generating no metal burrs on the tip part of a lead part, even after cutting of a lead. SOLUTION: Chip cutting of a lead part 28 is performed, using a dicer 30 for the purpose of separating the lead part 28 and the lead frame 29 a semiconductor package 27, which is formed in the state wherein sheet 2 is adhered to the lead frame 29, and the lead is cut in the state wherein its tip parts are brought parallel with each other. Accordingly, since the package is cut by a dicer in a state wherein the sheet 21 is adhered, metal burrs are not generated on the lead tip, no touble is produced in the formation of a solder fillet when a substrate is mounted, and the reliability of substrate mounting can be improved.

公开(公告)号：JPH11297880A

公开(公告)日：1999-10-29

申请号：JP9878998

申请日：1998-04-10

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： YAMADA YASUHIRO ,  ADACHI OSAMU ,  HAMAYA TAKESHI ,  UENO JUNICHI

IPC: H01L23/28 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device of high reliability and a manufacturing method thereof, wherein its connection member through which signals are transmitted to or received from an outer equipment is partly exposed through a sealing resin. SOLUTION: This device is equipped with a semiconductor chip 1 provided with an electrode pad 10, a resin film 2 fixed to the semiconductor chip 1, a pad 3 of metal thin film, a metal fine wire 4 which connects the electrode pad 10 and the pad 3 together, a sealing resin 6, a columnar electrode 8 connected to the metal fine wire 4, and an outer terminal 9 formed of the tip of the columnar electrode 8 protruding from the surface of the sealing resin 6. At this point, the resin film 2 is used in place of a prior art die pad, the columnar electrode 8 is provided to a recess provide in the sealing resin 6, whereby a connection member through which signals are transmitted to or received from an outer equipment is partly exposed through the sealing resin 6, so that a structure of high connection reliability can be obtained. If the structure of the resin film 2 is devised, it is capable of coping with a reduction in size and an increase in number of pins.

公开(公告)号：JPS6362366A

公开(公告)日：1988-03-18

申请号：JP20726486

申请日：1986-09-03

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： ISHIGURO TSUTOMU ,  YAMADA YASUHIRO

IPC: H01L23/50

Abstract: PURPOSE:To inspect the electric characteristics of the main body of an electronic part stably and quickly, by providing a protruding part at an outer frame part, making the tip of the protruding part to penetrate into a resin molded body, and supporting the resin molded body. CONSTITUTION:A part of the tip of a protruding part 4 of an outer frame 2 is extended to a position, where the part is made to penetrate and buried in a resin molded body 3. After the molding of a resin package, a lead part 1 is cut out of an outer frame part 2. A tie bar 5, by which each lead part is bridged, is cut out. An electronic part is separated into individual outer electrode terminals. At this stage, the resin molded body 3 is supported by the outer frame 2 by the penetration of the tip of the protruding part 4..The body 3 can be moved and handled in the fixed state as a unitary body with the outer frame part 2. Therefore, under this state, the molding step of the outer electrode terminal, the inspecting step of the electric characteristics and the mounting step of the electronic part on a printed wiring board can be accomplished.

公开(公告)号：JP2000196001A

公开(公告)日：2000-07-14

申请号：JP37269798

申请日：1998-12-28

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： YAMADA YASUHIRO ,  NANO MASANORI ,  OIDA SHIGEJI

IPC: B21D28/00 ,  H01L23/50

Abstract: PROBLEM TO BE SOLVED: To prevent generation of chip cracks at lead cutting, in order to prevent peeling of leads and resin at the interface, when a package is lifted. SOLUTION: A process for cutting the lead of package of which lead is exposed to the rear surface is included, and the lead is cut in this process under the condition that only a lead exposed part 1a of the rear surface of a package 1 is supported. Moreover, after cutting lead, only the lead exposed part 1a of the rear surface of package 1 is lifted for ejection during the process to eject the package. Thereby, even when a foreign matter such as resin is deposited to the center area of the rear surface of the package 1 at lead cutting, the stress is not concentrated to the area where the foreign matter is deposited, and thereby generation of package cracks and chip cracks which are serious faults can be prevented. Moreover, even if a situation arises in which the metal die cannot be separated easily from the package 1, a force which generates separation at the interface of the lead and resin is not be applied to the package 1.

公开(公告)号：JPH03180054A

公开(公告)日：1991-08-06

申请号：JP31968989

申请日：1989-12-08

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： YAMADA YASUHIRO

IPC: H01L23/36

Abstract: PURPOSE:To make position alignment easy and correct on the occasion of matched close contact and to improve a joining strength by forming a projection on one of the joining surfaces of an exposed part of a heat-radiating block and an external radiator and by providing on the other a hole part which can be fitted on this projection. CONSTITUTION:A heat-radiating block 3 being in contact with a semiconductor chip 2 is provided in such a manner that it is sealed with a resin part 1 so that a part thereof is exposed, and a projection 7 to be joined in matched close contact to a hole part 5 of an external radiator 4 is formed on the exposed part 3a of the heat-radiating block 3. Moreover, high-heat conducting grease 6 is interposed between the heat-radiating block 3 and the external radiator 4. According to this constitution, position alignment on the occasion of matching can be executed easily and correctly and, besides, a stable radiation effect can be obtained.

公开(公告)号：JPS63133655A

公开(公告)日：1988-06-06

申请号：JP28241786

申请日：1986-11-26

Applicant: MATSUSHITA ELECTRONICS CORP

Inventor： YAMADA YASUHIRO

IPC: H01L21/56 ,  H01L23/50

Abstract: PURPOSE:To eliminate the reduction in dampproofness, inferior characteristic, inferior outward appearance or the like by a method wherein a lead part, an outer frame part and a specific fishtail fin are installed with a view to reducing the residual of the air inside a resin-molded object. CONSTITUTION:The following are installed: a lead part 1 whose one end is sealed inside a resin-molded object 3; an outer frame part 2 which is connected to the other end of the lead part 1; a fishtail fin 4 which is extended from the outer frame part 2 to the position to be buried inside the resin-molded body 3, support the resin-molded object 3 and is connected to the outer frame part 2 so as to finely shape the resin-molded object 3. Through this constitution, the fishtail fin agitates a resin material which is poured during a resin-molding process, disperses the resin material toward the upper part and the lower part of the resin-molded object and reduces the residual of the air inside the resin- molded part. Accordingly, it is possible to mold the resin-molded object perfectly and to enhance the electrical characteristic, dampproofness and outward appearance.