Abstract:
A method is disclosed for forming narrow thermal silicon dioxide side isolation regions in a semiconductor substrate and MOS or CMOS semiconductor devices fabricated by this method. A thin stress relief layer is used in conjunction with a polysilicon buffering stress relief layer on the surface of a semiconductor substrate prior to the field oxidation process to restrict lateral silicon dioxide expansion thereby permitting the creation of narrow thermal silicon dioxide side isolation regions in the semiconductor substrate. A silicon dioxide layer is also used between an amorphous polysilicon (buffering stress relief) layer and a silicon nitride layer to function as an oxide cap, to avoid undesired pitting of the amorphous polysilicon layer, and to avoid interaction between the silicon nitride and amorphous polysilicon layers in areas of high stress.
Abstract:
Ein Analog-Digital-Wandler (ADC) weist Spannungseingänge, einen Transkonduktor, der zum Umwandeln der Spannungseingänge in Ströme ausgebildet ist, stromgesteuerte Oszillatoren, einen Zähler und digitale Logik auf. Die stromgesteuerten Oszillatoren propagieren entsprechende Ströme vom Transkonduktor. Der Zähler ist so ausgebildet, dass er das wiederholte Durchlaufen eines oder mehrerer Oszillatoren zählt. Die digitale Logik ist so ausgebildet, dass sie basierend auf den Ergebnissen des Zählers einen Code bereitstellt, der ausgebildet ist, um einen Wert des zugehörigen Spannungseingangs anzugeben.
Abstract:
A method is disclosed for forming narrow thermal silicon dioxide side isolation regions in a semiconductor substrate and MOS or CMOS semiconductor devices fabricated by this method. A thin stress relief layer is used in conjunction with a polysilicon buffering stress relief layer on the surface of a semiconductor substrate prior to the field oxidation process to restrict lateral silicon dioxide expansion thereby permitting the creation of narrow thermal silicon dioxide side isolation regions in the semiconductor substrate. A silicon dioxide layer is also used between an amorphous polysilicon (buffering stress relief) layer and a silicon nitride layer to function as an oxide cap, to avoid undesired pitting of the amorphous polysilicon layer, and to avoid interaction between the silicon nitride and amorphous polysilicon layers in areas of high stress.
Abstract:
A conditional level shifter circuit is used to substantially eliminate sneak current from occurring in an integrated circuit device having two or more logic circuit modules in different voltage domains. Sneak current is caused when a signal between the two or more logic circuit modules in different voltage domains is at logic "0" and one of the logic circuit modules is biased at a voltage level above the true ground, Vss, of the integrated circuit device. The conditional ground restoration circuit shifts the virtual ground logic "0" to the true ground level. This eliminates sneak current and logic level corruption.