公开(公告)号：JP2001210956A

公开(公告)日：2001-08-03

申请号：JP2000329569

申请日：2000-10-27

Applicant: MICROCOATING TECHNOLOGIES INC

Inventor： HUNT ANDREW T ,  WEN-I RIN ,  CARPENTER RICHARD W

IPC: B32B7/02 ,  H01C13/00 ,  H01G4/10 ,  H01G4/30 ,  H01G4/33 ,  H01G4/40 ,  H05K1/16 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a nanolaminate structure having a circuit for providing both a capacitor and a resistor. SOLUTION: Concerning the multiplayer laminate for forming a thin layer copacitor and a resistor or combination thereof, this multiplayer laminate has at least two layers of resistance materials and a dielectric layer, inserted between two layers of resistance materials.

公开(公告)号：BR9901357A

公开(公告)日：2001-03-20

申请号：BR9901357

申请日：1999-04-28

Applicant: MORTON INT INC ,  MICROCOATING TECHNOLOGIES INC

Inventor： HUNT ANDREW T ,  HWANG TZYY JIUAN ,  SHAO HONG ,  THOMAS JOE ,  LIN WEN-YI ,  SHOUP SHARA S ,  LUTEN HENRY A ,  MCENTYRE JOHN ERIC ,  CARPENTER RICHARD W ,  BOTTOMLEY STEPHEN E ,  HENDRICK MICHELLE

IPC: C23C16/40 ,  C23C16/453 ,  H01C7/00 ,  H01C17/20 ,  H01C17/24 ,  H01L21/02 ,  H05K1/16 ,  H05K3/06 ,  H01C17/14 ,  C23C16/00

Abstract: The invention is directed to thin film resistors which may be embedded in multi-layer printed circuit boards. The invention is also directed to structures for forming such thin film resistors and to methods for forming such structures, including the use of combustion chemical vapor deposition. The invention is also directed to chemical precursor solutions by which resistive materials can be deposited on a substrate by combustion chemical vapor deposition techniques.

公开(公告)号：SG68713A1

公开(公告)日：1999-11-16

申请号：SG1999001670

申请日：1999-04-14

Applicant: MICROCOATING TECHNOLOGIES INC ,  MORTON INT INC

Inventor： HUNT ANDREW T ,  HWANG TZYY JIUAN ,  SHAO HONG ,  THOMAS JOE ,  LIN WEN-YI ,  SHOUP SHARA S ,  LUTEN HENRY A ,  MCENTRYRE JOHN ERIC ,  CARPENTER RICHARD W ,  BOTTOMLEY STEPHEN E ,  HENDRICK MICHELLE

IPC: C23C16/40 ,  C23C16/453 ,  H01C7/00 ,  H01C17/20 ,  H01C17/24 ,  H01L21/02 ,  H05K1/16 ,  H05K3/06 ,  H01L49/02 ,  H01C1/012

Abstract: The invention is directed to thin film resistors which may be embedded in multi-layer printed circuit boards. The invention is also directed to structures for forming such thin film resistors and to methods for forming such structures, including the use of combustion chemical vapor deposition. The invention is also directed to chemical precursor solutions by which resistive materials can be deposited on a substrate by combustion chemical vapor deposition techniques.

公开(公告)号：IL156217A

公开(公告)日：2004-12-15

申请号：IL15621799

申请日：1999-04-18

Applicant: MORTON INT INC ,  MICROCOATING TECHNOLOGIES INC

Inventor： HUNT ANDREW T ,  HWANG TZYY JIUAN ,  HONG SHAO ,  THOMAS JOE ,  LIN WEN-YI ,  SHOUP SHARA S ,  LUTEN HENRY A ,  MCENTYRE JOHN ERIC ,  CARPENTER RICHARD W ,  BOTTOMLEY STEPHEN E ,  HENDRIK MICHELLE

IPC: C23C20060101 ,  C23C16/40 ,  H01L1/20

公开(公告)号：IL129493A

公开(公告)日：2004-12-15

申请号：IL12949399

申请日：1999-04-18

Applicant: MORTON INT INC ,  MICROCOATING TECHNOLOGIES INC

Inventor： HUNT ANDREW T ,  HWANG TZYY JIUAN ,  HONG SHAO ,  THOMAS JOE ,  LIN WEN-YI ,  SHOUP SHARA S ,  LUTTEN HENRY A ,  MCENTYRE JOHN ERIC ,  CARPENTER RICHARD W ,  BOTTOMLEY STEPHEN E ,  HENDRICK MICHELLE

IPC: C23C16/40 ,  C23C16/453 ,  H01C7/00 ,  H01C17/20 ,  H01C17/24 ,  H01L21/02 ,  H05K1/16 ,  H05K3/06 ,  H01L1/102

Abstract: The invention is directed to thin film resistors which may be embedded in multi-layer printed circuit boards. The invention is also directed to structures for forming such thin film resistors and to methods for forming such structures, including the use of combustion chemical vapor deposition. The invention is also directed to chemical precursor solutions by which resistive materials can be deposited on a substrate by combustion chemical vapor deposition techniques.

公开(公告)号：CA2267492C

公开(公告)日：2003-09-23

申请号：CA2267492

申请日：1999-03-29

Applicant: MORTON INT INC ,  MICROCOATING TECHNOLOGIES INC

Inventor： LIN WEN-YI ,  SHOUP SHARA S ,  THOMAS JOE ,  HENDRICK MICHELLE ,  HUNT ANDREW T ,  HWANG TZYY JIUAN ,  SHAO HONG ,  LUTEN HENRY A ,  BOTTOMLEY STEPHEN E ,  CARPENTER RICHARD W ,  MCENTYRE JOHN ERIC

IPC: C23C16/40 ,  C23C16/453 ,  H01C7/00 ,  H01C17/20 ,  H01C17/24 ,  H01L21/02 ,  H05K1/16 ,  H05K3/06 ,  H01C17/075

Abstract: The invention is directed to thin film resistors which may be embedded in multi-layer printed circuit boards. The invention is also directed to structures for forming such thin film resistors and to methods for forming such structures, including the use of combustion chemical vapor deposition. The invention is also directed to chemical precursor solutions by which resistive materials can be deposited on a substrate by combustion chemical vapor deposition techniques.