公开(公告)号：SG71203A1

公开(公告)日：2000-03-21

申请号：SG1999001655

申请日：1999-04-07

Applicant: MICROCOATING TECHNOLOGIES INC

Inventor： HUNT ANDREW T ,  SHANMUGHAM SUBRAMANIAM ,  DANIELSON WILLIAM D ,  LUTEN HENRY A ,  HWANG TZYY JIUAN ,  DESHPANDE GIRISH

IPC: C23C16/44 ,  B05D1/08 ,  C23C16/14 ,  C23C16/18 ,  C23C16/30 ,  C23C16/34 ,  C23C16/36 ,  C23C16/40 ,  C23C16/448 ,  C23C16/453 ,  C23C16/455 ,  C23C16/50 ,  C23C16/00

Abstract: An improved chemical vapor deposition apparatus and procedure is disclosed. The technique provides improved shielding of the reaction and deposition zones (26, 28) involved in providing CVD coatings by establishing a barrier zone (30) wherein gases flowing from a reaction zone (26) and deposition zone (28) to the ambient atmosphere are made to flow at a velocity of at least 15.24 m/min. Coatings can thus be produced, at atmospheric pressure, of materials which are sensitive to components in the atmosphere on substrates which are sensitive to high temperatures and which are too large, or inconvenient, to process in vacuum or similar chambers. The improved technique can be used with various energy sources and is particularly compatible with Combustion Chemical Vapor Deposition (CCVD) techniques.

公开(公告)号：BR9901287A

公开(公告)日：2000-03-21

申请号：BR9901287

申请日：1999-04-27

Applicant: MICROCOATING TECHNOLOGIES INC

Inventor： HUNT ANDREW T ,  SHANMUGHAM SUBRAMANIAM ,  DANIELSON WILLIAN D ,  LUTEN HENRY A ,  HWANG TZYY JIUAN ,  DESHPANDE GIRISH

IPC: C23C16/44 ,  B05D1/08 ,  C23C16/14 ,  C23C16/18 ,  C23C16/30 ,  C23C16/34 ,  C23C16/36 ,  C23C16/40 ,  C23C16/448 ,  C23C16/453 ,  C23C16/455 ,  C23C16/50

Abstract: An improved chemical vapor deposition apparatus and procedure is disclosed. The technique provides improved shielding of the reaction and deposition zones (26, 28) involved in providing CVD coatings by establishing a barrier zone (30) wherein gases flowing from a reaction zone (26) and deposition zone (28) to the ambient atmosphere are made to flow at a velocity of at least 15.24 m/min. Coatings can thus be produced, at atmospheric pressure, of materials which are sensitive to components in the atmosphere on substrates which are sensitive to high temperatures and which are too large, or inconvenient, to process in vacuum or similar chambers. The improved technique can be used with various energy sources and is particularly compatible with Combustion Chemical Vapor Deposition (CCVD) techniques.

公开(公告)号：IL156217A

公开(公告)日：2004-12-15

申请号：IL15621799

申请日：1999-04-18

Applicant: MORTON INT INC ,  MICROCOATING TECHNOLOGIES INC

Inventor： HUNT ANDREW T ,  HWANG TZYY JIUAN ,  HONG SHAO ,  THOMAS JOE ,  LIN WEN-YI ,  SHOUP SHARA S ,  LUTEN HENRY A ,  MCENTYRE JOHN ERIC ,  CARPENTER RICHARD W ,  BOTTOMLEY STEPHEN E ,  HENDRIK MICHELLE

IPC: C23C20060101 ,  C23C16/40 ,  H01L1/20

公开(公告)号：CA2267492C

公开(公告)日：2003-09-23

申请号：CA2267492

申请日：1999-03-29

Applicant: MORTON INT INC ,  MICROCOATING TECHNOLOGIES INC

Inventor： LIN WEN-YI ,  SHOUP SHARA S ,  THOMAS JOE ,  HENDRICK MICHELLE ,  HUNT ANDREW T ,  HWANG TZYY JIUAN ,  SHAO HONG ,  LUTEN HENRY A ,  BOTTOMLEY STEPHEN E ,  CARPENTER RICHARD W ,  MCENTYRE JOHN ERIC

IPC: C23C16/40 ,  C23C16/453 ,  H01C7/00 ,  H01C17/20 ,  H01C17/24 ,  H01L21/02 ,  H05K1/16 ,  H05K3/06 ,  H01C17/075

Abstract: The invention is directed to thin film resistors which may be embedded in multi-layer printed circuit boards. The invention is also directed to structures for forming such thin film resistors and to methods for forming such structures, including the use of combustion chemical vapor deposition. The invention is also directed to chemical precursor solutions by which resistive materials can be deposited on a substrate by combustion chemical vapor deposition techniques.

公开(公告)号：CA2269862C

公开(公告)日：2003-09-16

申请号：CA2269862

申请日：1999-04-26

Applicant: MICROCOATING TECHNOLOGIES INC

Inventor： DANIELSON WILLIAM D ,  LUTEN HENRY A ,  HUNT ANDREW T ,  SHANMUGHAM SUBRAMANIAM ,  DESHPANDE GIRISH ,  HWANG TZYY JIUAN

IPC: C23C16/44 ,  B05D1/08 ,  C23C16/14 ,  C23C16/18 ,  C23C16/30 ,  C23C16/34 ,  C23C16/36 ,  C23C16/40 ,  C23C16/448 ,  C23C16/453 ,  C23C16/455 ,  C23C16/50

Abstract: An improved chemical vapor deposition apparatus and procedure is disclosed. The technique provides improved shielding of the reaction and deposition zones involved in providing CVD coatings, whereby coatings can be produced, at atmospheric pressure, of materials which are sensitive to components in the atmosphere on substrates which are sensitive to high temperatures and which are too large, or inconvenient, to process in vacuum or similar chambers. The improved technique can be used with various energy sources and is particularly compatible with Combustion Chemical Vapor Deposition (CCVD) techniques.

公开(公告)号：BR9901357A

公开(公告)日：2001-03-20

申请号：BR9901357

申请日：1999-04-28

Applicant: MORTON INT INC ,  MICROCOATING TECHNOLOGIES INC

Inventor： HUNT ANDREW T ,  HWANG TZYY JIUAN ,  SHAO HONG ,  THOMAS JOE ,  LIN WEN-YI ,  SHOUP SHARA S ,  LUTEN HENRY A ,  MCENTYRE JOHN ERIC ,  CARPENTER RICHARD W ,  BOTTOMLEY STEPHEN E ,  HENDRICK MICHELLE

IPC: C23C16/40 ,  C23C16/453 ,  H01C7/00 ,  H01C17/20 ,  H01C17/24 ,  H01L21/02 ,  H05K1/16 ,  H05K3/06 ,  H01C17/14 ,  C23C16/00

Abstract: The invention is directed to thin film resistors which may be embedded in multi-layer printed circuit boards. The invention is also directed to structures for forming such thin film resistors and to methods for forming such structures, including the use of combustion chemical vapor deposition. The invention is also directed to chemical precursor solutions by which resistive materials can be deposited on a substrate by combustion chemical vapor deposition techniques.

公开(公告)号：SG68713A1

公开(公告)日：1999-11-16

申请号：SG1999001670

申请日：1999-04-14

Applicant: MICROCOATING TECHNOLOGIES INC ,  MORTON INT INC

Inventor： HUNT ANDREW T ,  HWANG TZYY JIUAN ,  SHAO HONG ,  THOMAS JOE ,  LIN WEN-YI ,  SHOUP SHARA S ,  LUTEN HENRY A ,  MCENTRYRE JOHN ERIC ,  CARPENTER RICHARD W ,  BOTTOMLEY STEPHEN E ,  HENDRICK MICHELLE

IPC: C23C16/40 ,  C23C16/453 ,  H01C7/00 ,  H01C17/20 ,  H01C17/24 ,  H01L21/02 ,  H05K1/16 ,  H05K3/06 ,  H01L49/02 ,  H01C1/012

Abstract: The invention is directed to thin film resistors which may be embedded in multi-layer printed circuit boards. The invention is also directed to structures for forming such thin film resistors and to methods for forming such structures, including the use of combustion chemical vapor deposition. The invention is also directed to chemical precursor solutions by which resistive materials can be deposited on a substrate by combustion chemical vapor deposition techniques.