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Patent Agency Ranking1.发明专利
公开(公告)号：JP2008022018A
公开(公告)日：2008-01-31
申请号：JP2007215388
申请日：2007-08-22
Applicant: Molex Inc , モレックス インコーポレーテッドMolex Incorporated
Inventor： MCGRATH JAMES L , CAPADONA JAMES P , MCGOWAN DANIEL B , PANELLA AUGUSTO P
CPC classification number: H05K1/117 , H01R12/721 , H01R13/6585 , H05K1/0219 , H05K2201/093 , H05K2201/0949 , H05K2201/0969 , H05K2201/09709 , H05K2201/09727
Abstract: PROBLEM TO BE SOLVED: To provide an improved edge card connector system, which provides a more adjusted operating impedance level.
SOLUTION: Circuit boards to which such high speed differential signal connectors are mounted are disclosed and they have a particular pattern of termination traces, commonly taking the form of plated vias extending through the circuit board. These vias are arranged in a triangular pattern and the ground reference plane of the circuit board is provided with voids, one void being associated and encompassing a pair of the differential signal vias of a single terminal triplet. This reduces the capacitance of the signal vias and thereby increases the impedance of the circuit board within the launch area to lessen impedance discontinuities in the connector-circuit board interface.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：提供改进的边缘卡连接器系统，其提供更加调整的操作阻抗水平。 解决方案：公开了安装这种高速差分信号连接器的电路板，并且它们具有特定的端接迹线图案，通常采用延伸穿过电路板的电镀通孔的形式。 这些通孔被布置成三角形图案，并且电路板的接地参考平面设置有空隙，一个空隙相关联并且包围一对单个三端口的差分信号通路。 这减小了信号通路的电容，从而增加了发射区域内的电路板的阻抗，以减少连接器 - 电路板接口中的阻抗不连续性。 版权所有（C）2008，JPO＆INPIT
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公开(公告)号：AU2002365917A8
公开(公告)日：2003-09-02
申请号：AU2002365917
申请日：2002-10-09
Applicant: MOLEX INC
Inventor： MCGOWAN DANIEL B , MCGRATH JAMES L , CAPADONA JAMES P , PANELLA AUGUSTO P
Abstract: A differential signal connector that is used for edge card application has a plurality of differential signal terminals and associated ground terminals arranged in "triplets", i.e., distinct sets of three conductive terminals, each such triplet including a pair of differential signal terminals and one associated ground terminal. The ground terminal is flanked by the two differential signal terminals and each triplet is spaced apart from an adjacent triplet by a spacing which is greater than any single spacing between adjacent terminals within a triplet. Circuit boards to which such a connector is mounted are also disclosed and they have a particular pattern of termination traces, commonly taking the form of plated vias extending through the circuit board. These vias are arranged in a triangular pattern and the ground reference plane of the circuit board is provided with voids, one void being associated and encompassing a pair of the differential signal vias of a single terminal triplet. This reduces the capacitance of the signal vias and thereby increases the impedance of the circuit board within the launch area to lessen impedance discontinuities in the connector-circuit board interface.
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公开(公告)号：AU2002365917A1
公开(公告)日：2003-09-02
申请号：AU2002365917
申请日：2002-10-09
Applicant: MOLEX INC
Inventor： MCGRATH JAMES L , CAPADONA JAMES P , MCGOWAN DANIEL B , PANELLA AUGUSTO P
Abstract: A differential signal connector that is used for edge card application has a plurality of differential signal terminals and associated ground terminals arranged in "triplets", i.e., distinct sets of three conductive terminals, each such triplet including a pair of differential signal terminals and one associated ground terminal. The ground terminal is flanked by the two differential signal terminals and each triplet is spaced apart from an adjacent triplet by a spacing which is greater than any single spacing between adjacent terminals within a triplet. Circuit boards to which such a connector is mounted are also disclosed and they have a particular pattern of termination traces, commonly taking the form of plated vias extending through the circuit board. These vias are arranged in a triangular pattern and the ground reference plane of the circuit board is provided with voids, one void being associated and encompassing a pair of the differential signal vias of a single terminal triplet. This reduces the capacitance of the signal vias and thereby increases the impedance of the circuit board within the launch area to lessen impedance discontinuities in the connector-circuit board interface.
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4.发明申请
公开(公告)号：WO03067711A2
公开(公告)日：2003-08-14
申请号：PCT/US0232404
申请日：2002-10-09
Applicant: MOLEX INC
Inventor： MCGRATH JAMES L , CAPADONA JAMES P , MCGOWAN DANIEL B , PANELLA AUGUSTO P
CPC classification number: H05K1/117 , H01R12/721 , H01R13/6585 , H05K1/0219 , H05K2201/093 , H05K2201/0949 , H05K2201/0969 , H05K2201/09709 , H05K2201/09727
Abstract: Circuit boards to which such high speed differential signal connectors are mounted are disclosed and they have a particular pattern of termination traces, commonly taking the form of plated vias extending through the circuit board. These vias are arranged in a triangular pattern and the ground reference plane of the circuit board is provided with voids, one void being associated and encompassing a pair of the differential signal vias of a single terminal triplet. This reduces the capacitance of the signal vias and thereby increases the impedance of the circuit board within the launch area to lessen impedance discontinuities in the connector-circuit board interface.
Abstract translation: 公开了安装这种高速差分信号连接器的电路板，并且它们具有特定的端接迹线图案，通常采取延伸穿过电路板的电镀通孔的形式。 这些通孔被布置成三角形图案，并且电路板的接地参考平面设置有空隙，一个空隙相关联并且包围一对单个三端口的差分信号通路。 这减小了信号通路的电容，从而增加了发射区域内的电路板的阻抗，以减少连接器 - 电路板接口中的阻抗不连续性。
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5.发明申请
公开(公告)号：WO03067711B1
公开(公告)日：2004-04-08
申请号：PCT/US0232404
申请日：2002-10-09
Applicant: MOLEX INC
Inventor： MCGRATH JAMES L , CAPADONA JAMES P , MCGOWAN DANIEL B , PANELLA AUGUSTO P
CPC classification number: H05K1/117 , H01R12/721 , H01R13/6585 , H05K1/0219 , H05K2201/093 , H05K2201/0949 , H05K2201/0969 , H05K2201/09709 , H05K2201/09727
Abstract: Circuit boards to which such high speed differential signal connectors are mounted are disclosed and they have a particular pattern of termination traces, commonly taking the form of plated vias extending through the circuit board. These vias are arranged in a triangular pattern and the ground reference plane of the circuit board is provided with voids, one void being associated and encompassing a pair of the differential signal vias of a single terminal triplet. This reduces the capacitance of the signal vias and thereby increases the impedance of the circuit board within the launch area to lessen impedance discontinuities in the connector-circuit board interface.
Abstract translation: 公开了安装这种高速差分信号连接器的电路板，并且它们具有终端迹线的特定图案，通常采用延伸穿过电路板的镀通孔的形式。 这些通孔以三角形图案排列，并且电路板的接地参考平面设置有空隙，一个空隙关联并且包围单个端子三元组的一对差分信号通孔。 这减少了信号通孔的电容并且由此增加了发射区域内的电路板的阻抗，以减小连接器电路板接口中的阻抗不连续性。
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