公开(公告)号：AU2002252682A1

公开(公告)日：2003-01-29

申请号：AU2002252682

申请日：2002-04-17

Applicant: MOTOROLA INC

Inventor： KLOSOWIAK TOMASZ L ,  TUNGARE AROON

IPC: C30B25/02 ,  C30B25/18 ,  H01L21/20 ,  H01L41/22 ,  H01L41/04 ,  C30B29/40 ,  C30B29/48 ,  C30B23/02 ,  C30B29/22

Abstract: High quality epitaxial layers of piezoelectric monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the piezoelectric monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying piezoelectric monocrystalline material layer.

公开(公告)号：DE60034806D1

公开(公告)日：2007-06-21

申请号：DE60034806

申请日：2000-08-02

Applicant: MOTOROLA INC

Inventor： ANDERSON DAVID J ,  KLOSOWIAK TOMASZ L

IPC: H05K1/03 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00

Abstract: A flexible circuit board and a method for making a flexible circuit board. The flexible circuit board (10) is formed from a substantially rigid material and includes a first portion (12) and a second portion (14) coupled by a bend region (16). The bend region (16) includes at least one bend (40, 52) having a radius less than 120 mils.

公开(公告)号：DE60034806T2

公开(公告)日：2008-01-17

申请号：DE60034806

申请日：2000-08-02

Applicant: MOTOROLA INC

Inventor： ANDERSON DAVID J ,  KLOSOWIAK TOMASZ L

IPC: H05K1/03 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00

Abstract: A flexible circuit board and a method for making a flexible circuit board. The flexible circuit board (10) is formed from a substantially rigid material and includes a first portion (12) and a second portion (14) coupled by a bend region (16). The bend region (16) includes at least one bend (40, 52) having a radius less than 120 mils.

公开(公告)号：ES2284512T3

公开(公告)日：2007-11-16

申请号：ES00950932

申请日：2000-08-02

Applicant: MOTOROLA INC

Inventor： ANDERSON DAVID J ,  KLOSOWIAK TOMASZ L

IPC: H05K1/03 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00

Abstract: Una tarjeta de circuito flexible (10) caracterizado por: al menos una capa de un material del sustrato del circuito sustancialmente rígido (11), teniendo la, al menos una, capa una primera porción (12) y una segunda porción (14) y una región de doblado (16) que separa la primera y la segunda porción, estando formadas cada una de las porciones primera (12) y segunda (14) con trazas conductoras (32, 33) y con isletas conductoras para fijar e interconectar los componentes eléctricos a los mismos y conectar las trazas conductoras formadas entre la primera porción (12) y la segunda porción (14), extendiéndose las trazas conductoras de conexión (38) a través de la región de doblado (16); y estando plegada la primera porción (12) respecto a la segunda porción (14) formando un primer doblez (R1), un segundo doblez (R3) y un tercer doblez (R2) en la región de doblado (16), en el que el tercer doblez (R2) está intermedio entre el primer doblez (R1) y el segundo doblez (R3) y doblado en dirección opuesta a los mismos.

公开(公告)号：MY136290A

公开(公告)日：2008-09-30

申请号：MYPI20041116

申请日：2004-03-29

Applicant: MOTOROLA INC

Inventor： QI JING ,  DANVIR JANICE M ,  KLOSOWIAK TOMASZ L ,  KULKARNI JING ,  NADIA YALA

IPC: H01L21/56

Abstract: THE INVENTION PROVIDES A METHOD FOR ATTACHING A FLIP CHIP (210) TO AN ELECTRICAL SUBSTRATE (240) SUCH AS A PRINTED WIRING BOARD. A BUMPED FLIP CHIP IS PROVIDED, THE FLIP CHIP INCLUDING AN ACTIVE SURFACE AND A PLURALITY OF CONNECTIVE BUMPS (220) EXTENDING FROM THE ACTIVE SURFACE, EACH CONNECTIVE BUMP INCLUDING A SIDE REGION. A THIN LAYER OF AN UNDERFILL MATERIAL (230) IS APPLIED TO THE ACTIVE SURFACE OF THE FLIP CHIP AND TO A PORTION OF THE SIDE REGIONS OF THE CONNECTIVE BUMPS. THE FLIP CHIP IS POSITIONED ON THE ELECTRICAL SUBSTRATE, THE ELECTRICAL SUBSTRATE INCLUDING A THICK LAYER OF A SOLDER MASK (250) DISPOSED ON THE ELECTRICAL SUBSTRATE. THE FLIP CHIP IS HEATED TO ELECTRICALLY CONNECT THE FLIP CHIP TO THE ELECTRICAL SUBSTRATE, WHEREIN THE UNDERFILL MATERIAL AND THE SOLDER MASK COMBINE TO FORM A STRESS-RELIEF LAYER WHEN THE FLIP CHIP IS ELECTRICALLY CONNECTED TO THE ELECTRICAL SUBSTRATE.

公开(公告)号：AU2002239704A1

公开(公告)日：2003-01-08

申请号：AU2002239704

申请日：2001-12-20

Applicant: MOTOROLA INC

Inventor： KLOSOWIAK TOMASZ L

IPC: H01L21/20 ,  H01L21/48 ,  H01L23/538

公开(公告)号：WO2005114916A3

公开(公告)日：2006-03-30

申请号：PCT/US2005016658

申请日：2005-05-12

Applicant: MOTOROLA INC ,  CHASON MARC K ,  DANVIR JANICE M ,  DEVANIE KATHERINE M ,  HUME DAVID A ,  KLOSOWIAK TOMASZ L ,  MCDUNN KEVIN J

Inventor： CHASON MARC K ,  DANVIR JANICE M ,  DEVANIE KATHERINE M ,  HUME DAVID A ,  KLOSOWIAK TOMASZ L ,  MCDUNN KEVIN J

IPC: H04L12/28 ,  H04L12/56 ,  G08C17/00

CPC classification number: H04W52/0296 ,  H04W84/18 ,  H04W88/02 ,  Y02D70/00 ,  Y02D70/144 ,  Y02D70/162

Abstract: An alternating current (AC) powered self organizing wireless node (100, 400, 600) includes a self organizing wireless receiver-transmitter (115), an AC branch connection (105), an AC to direct current (DC) converter (110), a secondary power function (120), and a housing (150). The self organizing wireless receiver-transmitter can communicate information throughout a network of compatible self organizing nodes solely using radio transmission to and reception from nearby self-organizing nodes. The secondary power function can couple power to the AC to DC converter for powering the self organizing wireless receiver-transmitter when AC power is not provided. The AC powered self organizing wireless node is designed and fabricated for agency certification. The AC powered self organizing wireless node may include one or more sensors (125), sensor inputs (135), transducers (130), or control outputs (155).

Abstract translation: 交流（AC）供电的自组织无线节点（100,400,600）包括自组织无线接收器 - 发射器（115），AC分支连接（105），AC至直流（DC）转换器（110） ，辅助电力功能（120）和壳体（150）。 自组织无线接收机 - 发射机可以通过使用到附近的自组织节点的无线电传输和从其接收的相容自组织节点的网络来传送信息。 辅助电源功能可以连接AC到DC转换器的电源，以便在不提供交流电源时为自组织无线接收器 - 发射器供电。 交流供电的自组织无线节点是为代理认证设计和制造的。 交流供电的自组织无线节点可以包括一个或多个传感器（125），传感器输入（135），换能器（130）或控制输出（155）。

公开(公告)号：WO2009017928A3

公开(公告)日：2009-05-22

申请号：PCT/US2008069003

申请日：2008-07-02

Applicant: MOTOROLA INC ,  WIEGLUS JERZY ,  GAMOTA DANIEL R ,  KLOSOWIAK TOMASZ L ,  SZCZECH JOHN B ,  TSUI KIN P

Inventor： WIEGLUS JERZY ,  GAMOTA DANIEL R ,  KLOSOWIAK TOMASZ L ,  SZCZECH JOHN B ,  TSUI KIN P

IPC: H05K3/04

CPC classification number: H05K3/04 ,  H01L21/4846 ,  H01L23/145 ,  H01L23/49838 ,  H01L23/49866 ,  H01L29/78603 ,  H01L2924/0002 ,  H05K1/0293 ,  H05K3/22 ,  H05K2201/068 ,  H05K2201/09727 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/175 ,  Y10T29/49117 ,  H01L2924/00

Abstract: A method and apparatus for forming controlled stress fractures in metal produces electrically isolated, closely spaced circuit sub-entities for use on a metallized printed wiring board. A polymeric substrate (10) has a layer of metal (11) adhered to the surface, and the metal layer is formed into entities (12). Each entity (12) has a fracture initiating feature (14, 54) formed into it, which serves to initiate and/or direct a stress crack that is induced in the metal. The entities (12) are fractured in a controlled manner by subjecting the substrate (10) and the entities to mechanical stress by a rapid thermal excursion, creating a stress fracture in the entity extending from the fracture initiating feature. The stress fracture divides each entity (12) into two or more sub-entities (42) that are electrically isolated from each other by the stress fracture.

Abstract translation: 用于在金属中形成受控应力断裂的方法和装置产生用于金属化印刷线路板的电隔离，紧密间隔的电路子实体。 聚合物基材（10）具有粘附到表面的金属层（11），金属层形成为实体（12）。 每个实体（12）具有形成在其中的断裂起始特征（14,54），其用于启动和/或引导在金属中诱发的应力裂纹。 实体（12）以受控的方式通过使基板（10）和实体通过快速热偏移进行机械应力而断裂，在从断裂起始特征延伸的实体中产生应力断裂。 应力断裂将每个实体（12）划分为通过应力断裂彼此电隔离的两个或多个子实体（42）。

公开(公告)号：EP1224847A4

公开(公告)日：2004-12-08

申请号：EP00950932

申请日：2000-08-02

Applicant: MOTOROLA INC

Inventor： ANDERSON DAVID J ,  KLOSOWIAK TOMASZ L

IPC: H05K1/00 ,  H05K1/03 ,  H05K1/18 ,  H05K3/00 ,  H05K1/02

CPC classification number: H05K1/028 ,  H05K1/0366 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/0014 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A flexible circuit board and a method for making a flexible circuit board. The flexible circuit board (10) is formed from a substantially rigid material and includes a first portion (12) and a second portion (14) coupled by a bend region (16). The bend region (16) includes at least one bend (40, 52) having a radius less than 120 mils.

公开(公告)号：WO2007021362A3

公开(公告)日：2009-04-23

申请号：PCT/US2006023702

申请日：2006-06-19

Applicant: MOTOROLA INC ,  JONNALAGADDA KRISHNA D ,  GAMOTA DANIEL R ,  GYORFI JULIUS S ,  KALYANASUNDARAM KRISHNA ,  MOK SWEE M ,  TOLOO MANSOUR ,  COLLINS TIMOTHY J ,  ZHANG JIE ,  KLOSOWIAK TOMASZ L

Inventor： JONNALAGADDA KRISHNA D ,  GAMOTA DANIEL R ,  GYORFI JULIUS S ,  KALYANASUNDARAM KRISHNA ,  MOK SWEE M ,  TOLOO MANSOUR ,  COLLINS TIMOTHY J ,  ZHANG JIE ,  KLOSOWIAK TOMASZ L

IPC: B41B19/00 ,  B41B17/00

CPC classification number: B41F17/00 ,  G09F13/22

Abstract: An energizable design image portion (203) of a provided design pattern is printed on a provided substrate (201) using a functional ink comprised of at least one energy emissive material. A passive design image portion (202) of that design pattern is then also printed on that substrate using at least one graphic arts ink. In a preferred embodiment this apparatus may further comprise electrically conductive electrodes (204) on the substrate to permit selective energization of the energy emissive material to thereby induce illumination of the energizable design image portion of the design pattern.

Abstract translation: 使用由至少一种能量发射材料构成的功能油墨，将所提供的设计图案的可激励设计图像部分（203）印刷在所提供的基板（201）上。 然后使用至少一个图形油墨将该设计图案的被动设计图像部分（202）印刷在该基板上。 在优选实施例中，该装置还可以包括在基板上的导电电极（204），以允许能量发射材料的选择性激励，从而引起设计图案的可激励设计图像部分的照明。