公开(公告)号：AU2002252682A1

公开(公告)日：2003-01-29

申请号：AU2002252682

申请日：2002-04-17

Applicant: MOTOROLA INC

Inventor： KLOSOWIAK TOMASZ L ,  TUNGARE AROON

IPC: C30B25/02 ,  C30B25/18 ,  H01L21/20 ,  H01L41/22 ,  H01L41/04 ,  C30B29/40 ,  C30B29/48 ,  C30B23/02 ,  C30B29/22

Abstract: High quality epitaxial layers of piezoelectric monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the piezoelectric monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying piezoelectric monocrystalline material layer.

公开(公告)号：AU2002356062A1

公开(公告)日：2003-03-03

申请号：AU2002356062

申请日：2002-07-13

Applicant: MOTOROLA INC

Inventor： TUNGARE AROON ,  GAMOTA DANIEL ,  SKIPOR ANDREW ,  GHAEM SANJAR ,  CHASON MARC

IPC: B81B3/00 ,  H01H59/00 ,  H05K3/40 ,  B81B7/00 ,  B81C1/00

Abstract: The organic MEMS according to the present invention comprises a polymeric substrate comprising a substrate surface including a first region and a second region. A polymer coating is applied to the first region to provide a coating surface that is spaced apart from the substrate surface. A terminal is disposed on the second region. A metallic trace is affixed to the coating surface such that the metallic trace forms a flexible extension over the second region. The extension has a rest position where the extension is spaced apart from the terminal, and a flexed position where the extension is disposed towards the terminal. An actuator is used to provide an electric field to deflect the extension from the rest position to the flexed position. By changing the spacing between the extension and the terminal, it is possible to change the electrical condition provided by the MEMS.

公开(公告)号：AU2003251297A8

公开(公告)日：2003-12-12

申请号：AU2003251297

申请日：2003-05-13

Applicant: MOTOROLA INC

Inventor： TUNGARE AROON ,  LIAN KE KERYN ,  ELIACIN MANES ,  CROSWELL ROBERT T

IPC: H01L21/316 ,  H01L25/04 ,  H01L27/28 ,  H01L51/05 ,  H05K1/18 ,  H01L29/76 ,  H01L31/062 ,  H01L29/94

Abstract: An organic semiconductor device ( 11 ) can be embedded within a printed wiring board ( 10 ). In various embodiments, the embedded device ( 11 ) can be accompanied by other organic semiconductor devices ( 31 ) and/or passive electrical components ( 26 ). When so embedded, conductive vias ( 41, 42, 43 ) can be used to facilitate electrical connection to the embedded device. In various embodiments, specific categories of materials and/or processing steps are used to facilitate the making of organic semiconductors and/or passive electrical components, embedded or otherwise.

公开(公告)号：AU2003297325A8

公开(公告)日：2004-07-29

申请号：AU2003297325

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： KINGON ANGUS IAN ,  TUNGARE AROON ,  SAVIC JOVICA ,  MARIA JON-PAUL ,  KIM TAEYUN ,  CROSWELL ROBERT

IPC: C23C26/00 ,  C23C28/00 ,  H01G4/018 ,  H01G4/12 ,  H05K1/16 ,  H05K3/38 ,  B05D5/12

Abstract: Thin film ceramic foil capacitors are mass-produced using inline reel-to-reel processing techniques by starting (100) with a length of copper foil which serves as one plate of the capacitor, then depositing (120) a layer of a ceramic precursor on a portion of one side of the copper foil at a first station. The foil is advanced (117, 127, 137, 147) to the next station where the ceramic precursor and the copper foil are heated (130) to remove any carrier solvents or vehicles, then pyrolyzed (140) to remove any residual organic materials. It is then sintered (150) at high temperatures to convert the ceramic to polycrystalline ceramic. A final top metal layer is then deposited (160) on the polycrystalline ceramic to form the other plate of the capacitor. The entire process or portions of the process is performed in-line such that one or more of the steps are simultaneously performed on different portions of the foil at the same time, or such that, after any one step, the foil is advanced and the step repeated at a new location on the foil.

公开(公告)号：AU2003297325A1

公开(公告)日：2004-07-29

申请号：AU2003297325

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： CROSWELL ROBERT ,  SAVIC JOVICA ,  TUNGARE AROON ,  KIM TAEYUN ,  KINGON ANGUS IAN ,  MARIA JON-PAUL

IPC: C23C26/00 ,  C23C28/00 ,  H01G4/018 ,  H01G4/12 ,  H05K1/16 ,  H05K3/38

Abstract: Thin film ceramic foil capacitors are mass-produced using inline reel-to-reel processing techniques by starting (100) with a length of copper foil which serves as one plate of the capacitor, then depositing (120) a layer of a ceramic precursor on a portion of one side of the copper foil at a first station. The foil is advanced (117, 127, 137, 147) to the next station where the ceramic precursor and the copper foil are heated (130) to remove any carrier solvents or vehicles, then pyrolyzed (140) to remove any residual organic materials. It is then sintered (150) at high temperatures to convert the ceramic to polycrystalline ceramic. A final top metal layer is then deposited (160) on the polycrystalline ceramic to form the other plate of the capacitor. The entire process or portions of the process is performed in-line such that one or more of the steps are simultaneously performed on different portions of the foil at the same time, or such that, after any one step, the foil is advanced and the step repeated at a new location on the foil.

公开(公告)号：AU2003251297A1

公开(公告)日：2003-12-12

申请号：AU2003251297

申请日：2003-05-13

Applicant: MOTOROLA INC

Inventor： ELIACIN MANES ,  LIAN KE KERYN ,  CROSWELL ROBERT T ,  TUNGARE AROON

IPC: H01L21/316 ,  H01L25/04 ,  H01L27/28 ,  H01L51/05 ,  H05K1/18

Abstract: An organic semiconductor device ( 11 ) can be embedded within a printed wiring board ( 10 ). In various embodiments, the embedded device ( 11 ) can be accompanied by other organic semiconductor devices ( 31 ) and/or passive electrical components ( 26 ). When so embedded, conductive vias ( 41, 42, 43 ) can be used to facilitate electrical connection to the embedded device. In various embodiments, specific categories of materials and/or processing steps are used to facilitate the making of organic semiconductors and/or passive electrical components, embedded or otherwise.

公开(公告)号：WO03100827A2

公开(公告)日：2003-12-04

申请号：PCT/US0315089

申请日：2003-05-13

Applicant: MOTOROLA INC

Inventor： LIAN KE KERYN ,  CROSWELL ROBERT T ,  TUNGARE AROON ,  ELIACIN MANES

IPC: H01L21/316 ,  H01L25/04 ,  H01L27/28 ,  H01L51/05 ,  H05K1/18 ,  H01L

CPC classification number: H05K1/185 ,  H01L21/31691 ,  H01L25/046 ,  H01L27/28 ,  H01L51/0512 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

Abstract: An organic semiconductor device (11) can be embedded within a printed wiring board (10). In various embodiments, the embedded device (11) can be accompanied by other organic semiconductor devices (31) and/or passive electrical components (26). When so embedded, conductive vias (41, 42, 43) can be used to facilitate electrical connection to the embedded device. In various embodiments, specific categories of materials and/or processing steps are used to facilitate the making of organic semiconductors and/or passive electrical components, embedded or otherwise.

Abstract translation: 有机半导体器件（11）可以嵌入印刷线路板（10）内。 在各种实施例中，嵌入式设备（11）可以伴随有其他有机半导体器件（31）和/或无源电子部件（26）。 当嵌入时，可以使用导电通孔（41,42,43）来促进与嵌入式装置的电连接。 在各种实施例中，使用特定类别的材料和/或处理步骤来促进嵌入式或其它方式制造有机半导体和/或无源电气部件。

公开(公告)号：WO03007393A3

公开(公告)日：2003-09-04

申请号：PCT/US0212103

申请日：2002-04-17

Applicant: MOTOROLA INC

Inventor： TUNGARE AROON ,  KLOSOWIAK TOMASZ L

IPC: C30B25/02 ,  C30B25/18 ,  H01L21/20 ,  H01L41/22 ,  H01L41/04 ,  C30B23/02 ,  C30B29/22 ,  C30B29/40 ,  C30B29/48

CPC classification number: C30B25/02 ,  C30B25/18 ,  C30B29/40 ,  C30B29/403 ,  C30B29/406 ,  C30B29/48 ,  H01L21/02381 ,  H01L21/02488 ,  H01L21/02505 ,  H01L21/02513 ,  H01L21/02521 ,  H01L41/0815 ,  H01L41/319

Abstract: High quality epitaxial layers of piezoelectric monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers (243) by forming a compliant substrate for growing the piezoelectric monocrystalline layers. An accommodating buffer layer (272) comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer (260) of silicon oxide. The amorphous interface layer permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying piezoelectric monocrystalline material layer (290) made of e.g. a III-V semiconductor compound such as AlGaAs.

Abstract translation: 通过形成用于生长压电单晶层的柔性衬底，可以将压电单晶材料的高质量外延层生长成覆盖在单晶衬底例如大硅晶片（243）上。 容纳缓冲层（272）包括通过硅氧化物的非晶界面层（260）与硅晶片间隔开的单晶氧化物层。 非晶界面层允许生长高质量的单晶氧化物容纳缓冲层。 容纳缓冲层与下面的硅晶片和由例如硅晶片制成的上覆压电单晶材料层（290）晶格匹配。 诸如AlGaAs的III-V半导体化合物。

公开(公告)号：WO2004061905A2

公开(公告)日：2004-07-22

申请号：PCT/US0340351

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： CROSWELL ROBERT ,  SAVIC JOVICA ,  TUNGARE AROON ,  KIM TAEYUN ,  KINGON ANGUS IAN ,  MARIA JON-PAUL

IPC: C23C26/00 ,  C23C28/00 ,  H01G4/018 ,  H01G4/12 ,  H05K1/16 ,  H05K3/38 ,  H01L

CPC classification number: H01G4/018 ,  C23C26/00 ,  C23C28/321 ,  C23C28/322 ,  C23C28/345 ,  C23C28/3455 ,  H01G4/12 ,  H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2203/1545

Abstract: Thin film ceramic foil capacitors are produced using inline reel-to-reel processing techniques by starting (100) with a length of copper foil which serves as one plate of the capacitor, then depositing (120) a layer of a ceramic precursor on a portion of one side of the copper foil at a first station. The foil is advanced (117, 127, 137, 147) to the next station where the ceramic precursor and the copper foil are heated (130) to remove any carrier solvents or vehicles, then pyrolyzed (140) to remove any residual organic materials. It is then sintered (150) at high temperatures to convert the ceramic to polycrystalline ceramic. A final top metal layer is then deposited (160) on the polycrystalline ceramic to form the other plate of the capacitor

Abstract translation: 薄膜陶瓷箔电容器使用在线卷轴到卷轴处理技术制造，通过以一定长度的铜箔起始（100），该铜箔用作电容器的一个板，然后在陶瓷前体的一部分上沉积（120）一层陶瓷前体 在第一站的铜箔的一侧。 箔片先进（117,127,137,147）到陶瓷前体和铜箔被加热（130）的下一个工位，以除去任何载体溶剂或载体，然后热解（140）以除去任何残留的有机材料。 然后在高温下烧结（150）以将陶瓷转化为多晶陶瓷。 然后将最终的顶部金属层沉积（160）在多晶陶瓷上以形成电容器的另一个板

公开(公告)号：EP1578543A4

公开(公告)日：2008-10-01

申请号：EP03814859

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： CROSWELL ROBERT ,  SAVIC JOVICA ,  TUNGARE AROON ,  KIM TAEYUN ,  KINGON ANGUS IAN ,  MARIA JON-PAUL

IPC: H05K1/16 ,  C23C26/00 ,  C23C28/00 ,  H01G4/018 ,  H01G4/12 ,  H05K3/38

CPC classification number: H01G4/018 ,  C23C26/00 ,  C23C28/321 ,  C23C28/322 ,  C23C28/345 ,  C23C28/3455 ,  H01G4/12 ,  H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2203/1545

Abstract: Thin film ceramic foil capacitors are produced using inline reel-to-reel processing techniques by starting (100) with a length of copper foil which serves as one plate of the capacitor, then depositing (120) a layer of a ceramic precursor on a portion of one side of the copper foil at a first station. The foil is advanced (117, 127, 137, 147) to the next station where the ceramic precursor and the copper foil are heated (130) to remove any carrier solvents or vehicles, then pyrolyzed (140) to remove any residual organic materials. It is then sintered (150) at high temperatures to convert the ceramic to polycrystalline ceramic. A final top metal layer is then deposited (160) on the polycrystalline ceramic to form the other plate of the capacitor