公开(公告)号：JP2000183364A

公开(公告)日：2000-06-30

申请号：JP35025099

申请日：1999-12-09

Applicant: MOTOROLA INC

Inventor： KOCH DANIEL J ,  HAMMOND JONATHAN H ,  KOURY JR DANIEL N ,  GORELL JONATHAN F

IPC: G01P15/08 ,  G01P15/125 ,  H01L29/84

Abstract: PROBLEM TO BE SOLVED: To provide a reliable acceleration sensor that can endure strong impacts in all directions. SOLUTION: A sensor is made movable on a support substrate and the surface of the support substrate, is located on an electrode 110 constituted of a first material and a part of the electrode 110, limits the movement of the electrode 110, lies outside the periphery of a structure 160 composed of a second material that is different from the first one and the electrode 110, and has a bonding pad 170 which is made of the second material.

公开(公告)号：JPH1168122A

公开(公告)日：1999-03-09

申请号：JP20723598

申请日：1998-07-06

Applicant: MOTOROLA INC

Inventor： GUTTERIDGE RONALD J ,  KOURY JR DANIEL N ,  KOCH DANIEL J ,  HAMMOND JONATHON H

IPC: B81B3/00 ,  B81B7/00 ,  G01P15/08 ,  G01P15/125 ,  G03F7/26 ,  H01L29/84

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor element with a structure that prevents damages with respect to a movable mass in an accelerometer without enlarging the size thereof. SOLUTION: A sensor 11 has a movable plate 16 which moves according to external acceleration. The movable plate 16 has a finger 17 which is joined capacitively with fingers 13 and 14 mounted on a substrate 12. The movable plate 16 is stopped by using a movement stopping part 19, before the finger 17 on the movable plate 16 collides with the fingers 13 and 14 on the substrate 12.

公开(公告)号：DE19830476A1

公开(公告)日：1999-02-04

申请号：DE19830476

申请日：1998-07-08

Applicant: MOTOROLA INC

Inventor： GUTTERIDGE RONALD J ,  KOURY JUN DANIEL N ,  KOCH DANIEL J ,  HAMMOND JONATHON H

IPC: B81B3/00 ,  B81B7/00 ,  G01P15/08 ,  G01P15/125 ,  G03F7/26 ,  H01L29/84 ,  H01L49/00 ,  H01L23/50

Abstract: The semiconductor device (10) includes a substrate (12) above which a movable plate (16) with an opening (18) is arranged. A movement stopper (19) contacts the substrate and extends through at least part of the opening in the plate. The movable plate defines a plane which is parallel to the surface (35) of the substrate. The plate comprises single crystal silicon, polysilicon, amorphous silicon, metal or metal silicide. A sensor included in the semiconductor device is also claimed.

公开(公告)号：DE19959135A1

公开(公告)日：2000-06-15

申请号：DE19959135

申请日：1999-12-08

Applicant: MOTOROLA INC

Inventor： KOCH DANIEL J ,  HAMMOND JONATHAN H ,  KOURY JUN DANIEL N ,  GORELL JONATHAN F

IPC: G01P15/08 ,  G01P15/125 ,  H01L29/84 ,  B81C1/00 ,  B81B3/00

Abstract: Sensor production comprises forming a structure which limits movement of a mobile electrode made of different material. Sensor production process comprises: (a) using a first material to form a mobile electrode (110) joined to the surface of a carrier substrate (200); and (b) using a second different material to form at least a section of a structure (160) which is joined to the substrate and which limits the mobility of the electrode. An Independent claim is also included for a sensor produced by the above process. Preferred Features: The first material consists of doped polysilicon and the second material consists of aluminum and silicon.