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公开(公告)号：JPH1168122A
公开(公告)日：1999-03-09
申请号：JP20723598
申请日：1998-07-06
Applicant: MOTOROLA INC
Inventor： GUTTERIDGE RONALD J , KOURY JR DANIEL N , KOCH DANIEL J , HAMMOND JONATHON H
Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor element with a structure that prevents damages with respect to a movable mass in an accelerometer without enlarging the size thereof. SOLUTION: A sensor 11 has a movable plate 16 which moves according to external acceleration. The movable plate 16 has a finger 17 which is joined capacitively with fingers 13 and 14 mounted on a substrate 12. The movable plate 16 is stopped by using a movement stopping part 19, before the finger 17 on the movable plate 16 collides with the fingers 13 and 14 on the substrate 12.
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公开(公告)号：US3506887A
公开(公告)日：1970-04-14
申请号：US3506887D
申请日：1966-02-23
Applicant: MOTOROLA INC
Inventor： GUTTERIDGE RONALD J
IPC: H01L21/00 , H01L21/316 , C23B5/48 , H01L3/00
CPC classification number: H01L21/31675 , H01L21/00 , H01L21/02238 , H01L21/02258
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公开(公告)号：DE69206770D1
公开(公告)日：1996-01-25
申请号：DE69206770
申请日：1992-09-28
Applicant: MOTOROLA INC
Inventor： RISTIC LJUBISA , CALAWAY MICHAEL F , GUTTERIDGE RONALD J , DUNN WILLIAM C , KOUCHENG WU
IPC: B81B3/00 , G01P15/125 , G01P15/18
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公开(公告)号：DE69313031D1
公开(公告)日：1997-09-18
申请号：DE69313031
申请日：1993-05-10
Applicant: MOTOROLA INC
Inventor： ADDIE DAVID L , GUTTERIDGE RONALD J , RISTIC LJUBISA
Abstract: A double pinned micromachined sensor (11) which utilizes a laminated film (27) having overall tensile strength formed on top of a silicon substrate (16). The laminated film (27) comprises a layer of silicon nitride (18) encapsulated by two layers of polysilicon (19,21), the silicon nitride (18) providing overall tension for the laminated film. The laminated film (27) is supported above the silicon substrate by support posts (17) and is selectively etched to form a sensor (11,13).
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公开(公告)号：DE69524539D1
公开(公告)日：2002-01-24
申请号：DE69524539
申请日：1995-10-23
Applicant: MOTOROLA INC
Inventor： RISTIC LJUBISA , KOURY DANIEL , SCHMIESING JOHN E , GUTTERIDGE RONALD J , HUGHES HENRY G
Abstract: An enclosure (8) for an electronic device (26) such as, for example, an accelerometer. The enclosure (8) includes a conductive semiconductor substrate (12) underlying the electronic device (26), a conductive cap (16) overlying the electronic device (26), and a power supply (25) having one or more outputs (27,29) each with a substantially fixed potential wherein one output is electrically coupled to the conductive semiconductor substrate (12) and another output to the conductive cap (16). In a preferred embodiment, substrate (12) and cap (16) are coupled to the same power supply output (27). This coupling substantially eliminates the adverse effects of parasitic capacitances of the substrate (12) and cap (16) to reduce measurement error and EMI when a capacitive accelerometer is used as the electronic device (26).
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Patent Agency Ranking
公开(公告)号：DE19830476A1
公开(公告)日：1999-02-04
申请号：DE19830476
申请日：1998-07-08
Applicant: MOTOROLA INC
Inventor： GUTTERIDGE RONALD J , KOURY JUN DANIEL N , KOCH DANIEL J , HAMMOND JONATHON H
Abstract: The semiconductor device (10) includes a substrate (12) above which a movable plate (16) with an opening (18) is arranged. A movement stopper (19) contacts the substrate and extends through at least part of the opening in the plate. The movable plate defines a plane which is parallel to the surface (35) of the substrate. The plate comprises single crystal silicon, polysilicon, amorphous silicon, metal or metal silicide. A sensor included in the semiconductor device is also claimed.
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公开(公告)号：DE69313031T2
公开(公告)日：1998-02-05
申请号：DE69313031
申请日：1993-05-10
Applicant: MOTOROLA INC
Inventor： ADDIE DAVID L , GUTTERIDGE RONALD J , RISTIC LJUBISA
Abstract: A double pinned micromachined sensor (11) which utilizes a laminated film (27) having overall tensile strength formed on top of a silicon substrate (16). The laminated film (27) comprises a layer of silicon nitride (18) encapsulated by two layers of polysilicon (19,21), the silicon nitride (18) providing overall tension for the laminated film. The laminated film (27) is supported above the silicon substrate by support posts (17) and is selectively etched to form a sensor (11,13).
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公开(公告)号：DE69306687T2
公开(公告)日：1997-06-12
申请号：DE69306687
申请日：1993-06-01
Applicant: MOTOROLA INC
Inventor： BENNET PAUL T , MIETUS DAVID F , GUTTERIDGE RONALD J , RISTIC LJUBISA , KOURY DANIEL N
IPC: G01P15/08 , G01P15/125 , H01L29/84
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公开(公告)号：DE69524539T2
公开(公告)日：2002-07-04
申请号：DE69524539
申请日：1995-10-23
Applicant: MOTOROLA INC
Inventor： RISTIC LJUBISA , KOURY DANIEL , SCHMIESING JOHN E , GUTTERIDGE RONALD J , HUGHES HENRY G
Abstract: An enclosure (8) for an electronic device (26) such as, for example, an accelerometer. The enclosure (8) includes a conductive semiconductor substrate (12) underlying the electronic device (26), a conductive cap (16) overlying the electronic device (26), and a power supply (25) having one or more outputs (27,29) each with a substantially fixed potential wherein one output is electrically coupled to the conductive semiconductor substrate (12) and another output to the conductive cap (16). In a preferred embodiment, substrate (12) and cap (16) are coupled to the same power supply output (27). This coupling substantially eliminates the adverse effects of parasitic capacitances of the substrate (12) and cap (16) to reduce measurement error and EMI when a capacitive accelerometer is used as the electronic device (26).
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公开(公告)号：HK1004293A1
公开(公告)日：1998-11-20
申请号：HK98102985
申请日：1998-04-09
Applicant: MOTOROLA INC
Inventor： BENNET PAUL T , MIETUS DAVID F , GUTTERIDGE RONALD J , RISTIC LJUBISA , KOURY DANIEL N
IPC: G01P15/08 , G01P15/125 , H01L29/84 , G01P
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