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    SENSOR STRUCTURE AND METHOD OF MUTUALLY CONNECTING SEPARATED STRUCTURES
    1.
    发明专利
    SENSOR STRUCTURE AND METHOD OF MUTUALLY CONNECTING SEPARATED STRUCTURES 失效

    公开(公告)号：JP2000031503A

    公开(公告)日：2000-01-28

    申请号：JP17621799

    申请日：1999-06-23

    Applicant: MOTOROLA INC

    Inventor： ZHANG Z LISA ,  LI GUANG X ,  BERGSTROM PAUL L ,  FOERSTNER JUERGEN A ,  GER MUH-LING ,  SCHMIESING JOHN E ,  SHEMANSKY JR FRANK A

    IPC: H01L23/522 ,  G01P15/08 ,  G01P15/125 ,  H01L21/768 ,  H01L29/84

    Abstract: PROBLEM TO BE SOLVED: To provide a sensor structure which permits required electric separation and connection without forming an oxide separation layer. SOLUTION: For a sensor 10, a bridge is built over an open trench 22, using conductive bridges 30-34, and electric connection is given between structures 24, 26 within an integrated circuit. The conductive bridge is useful in a sensor where the measurement of electric properties such as the capacity difference between the structures separated electrically. By forming an open trench around the flank, the structure is electrically separated. The bottom of the structure is electrically separated by an oxide layer. To form a conductive bridge, at first, the trench is filled with sacrificed glass to make firm foundation, and thereon a polysilicon conductor is arranged, and next the sacrificed glass is removed, and a conductive bride is made on the open trench. The open trench gives required separation, and the conductive bridge gives required electric connection.

    2.
    发明专利
    未知

    公开(公告)号：DE69524539T2

    公开(公告)日：2002-07-04

    申请号：DE69524539

    申请日：1995-10-23

    Applicant: MOTOROLA INC

    Inventor： RISTIC LJUBISA ,  KOURY DANIEL ,  SCHMIESING JOHN E ,  GUTTERIDGE RONALD J ,  HUGHES HENRY G

    IPC: G01D5/24 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  H01L23/06 ,  G01D3/028

    Abstract: An enclosure (8) for an electronic device (26) such as, for example, an accelerometer. The enclosure (8) includes a conductive semiconductor substrate (12) underlying the electronic device (26), a conductive cap (16) overlying the electronic device (26), and a power supply (25) having one or more outputs (27,29) each with a substantially fixed potential wherein one output is electrically coupled to the conductive semiconductor substrate (12) and another output to the conductive cap (16). In a preferred embodiment, substrate (12) and cap (16) are coupled to the same power supply output (27). This coupling substantially eliminates the adverse effects of parasitic capacitances of the substrate (12) and cap (16) to reduce measurement error and EMI when a capacitive accelerometer is used as the electronic device (26).

    4.
    发明专利
    未知

    公开(公告)号：DE69524539D1

    公开(公告)日：2002-01-24

    申请号：DE69524539

    申请日：1995-10-23

    Applicant: MOTOROLA INC

    Inventor： RISTIC LJUBISA ,  KOURY DANIEL ,  SCHMIESING JOHN E ,  GUTTERIDGE RONALD J ,  HUGHES HENRY G

    IPC: G01D5/24 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  H01L23/06 ,  G01D3/028

    Abstract: An enclosure (8) for an electronic device (26) such as, for example, an accelerometer. The enclosure (8) includes a conductive semiconductor substrate (12) underlying the electronic device (26), a conductive cap (16) overlying the electronic device (26), and a power supply (25) having one or more outputs (27,29) each with a substantially fixed potential wherein one output is electrically coupled to the conductive semiconductor substrate (12) and another output to the conductive cap (16). In a preferred embodiment, substrate (12) and cap (16) are coupled to the same power supply output (27). This coupling substantially eliminates the adverse effects of parasitic capacitances of the substrate (12) and cap (16) to reduce measurement error and EMI when a capacitive accelerometer is used as the electronic device (26).

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