公开(公告)号：AU2003258958A1

公开(公告)日：2004-02-02

申请号：AU2003258958

申请日：2003-06-26

Applicant: MOTOROLA INC

Inventor： SKIPOR ANDREW ,  SCHEIFER STEVE ,  OLSON BILL

IPC: B01J13/02 ,  H01L21/58 ,  H01L23/14 ,  H01L23/29

Abstract: A self-healing polymer composition 10 contains a polymer media 12 and a plurality of microcapsules of flowable polymerizable material 16 dispersed in the polymer media 12 , where the microcapsules of flowable polymerizable material 16 contain a flowable polymerizable material 15 and have an outer surface 142 upon which at least one polymerization agent 13 is chemically attached. The microcapsules 16 are effective for rupturing with a failure of the polymeric media 12 , and the flowable polymerizable material 15 reacts with the polymerization agent 13 when the polymerizable material 15 makes contact with the polymerization agent 13 upon rupture of the microcapsules 14 . There is also provided a method of using the self-healing polymeric composition 10 to repair fractures in polymers, as well as articles of manufacture including the self-healing system, and the microencapsulated polymerizable particles 16 themselves.

公开(公告)号：AU2003258958A8

公开(公告)日：2004-02-02

申请号：AU2003258958

申请日：2003-06-26

Applicant: MOTOROLA INC

Inventor： SCHEIFER STEVE ,  SKIPOR ANDREW ,  OLSON BILL

IPC: B01J13/02 ,  H01L21/58 ,  H01L23/14 ,  H01L23/29 ,  H01L21/44 ,  G02B26/00

Abstract: A self-healing polymer composition 10 contains a polymer media 12 and a plurality of microcapsules of flowable polymerizable material 16 dispersed in the polymer media 12 , where the microcapsules of flowable polymerizable material 16 contain a flowable polymerizable material 15 and have an outer surface 142 upon which at least one polymerization agent 13 is chemically attached. The microcapsules 16 are effective for rupturing with a failure of the polymeric media 12 , and the flowable polymerizable material 15 reacts with the polymerization agent 13 when the polymerizable material 15 makes contact with the polymerization agent 13 upon rupture of the microcapsules 14 . There is also provided a method of using the self-healing polymeric composition 10 to repair fractures in polymers, as well as articles of manufacture including the self-healing system, and the microencapsulated polymerizable particles 16 themselves.

公开(公告)号：CA2483631A1

公开(公告)日：2003-11-27

申请号：CA2483631

申请日：2003-04-29

Applicant: MOTOROLA INC

Inventor： GRAJALES LILIANA ,  KRIZIK MARK ALLEN ,  OLSON BILL ,  SKIPOR ANDREW ,  ST PETER JOHN

IPC: A61B5/00 ,  A61B5/0205 ,  A61B5/021 ,  A61B5/024 ,  A61B5/0402 ,  G08B21/02 ,  G08B23/00

Abstract: One or more items of apparel have a plurality of sensors (10, 11, and 12) disposed therein (either permanently or temporarily). These sensors sense physical states of the individual wearing the items of apparel and/or of the local environment. In one embodiment, multiple sensors sense, in alternative ways, a parameter that corresponds to a physical state of interest. Information from these alternative sensing approaches is co-processed to yie ld a resultant parameter value that can be used in various ways. In one embodiment, the parameter value is locally or remotely displayed. In one embodiment, the parameter value is used in comparison against risk threshold s to ascertain a degree of risk to the individual.

公开(公告)号：CA2483631C

公开(公告)日：2009-11-17

申请号：CA2483631

申请日：2003-04-29

Applicant: MOTOROLA INC

Inventor： GRAJALES LILIANA ,  ST PETER JOHN ,  KRIZIK MARK ALLEN ,  OLSON BILL ,  SKIPOR ANDREW

IPC: G08B23/00 ,  A61B5/00 ,  A61B5/0205 ,  A61B5/021 ,  A61B5/024 ,  A61B5/0402 ,  G08B21/02

Abstract: One or more items of apparel have a plurality of sensors (10, 11, and 12) disposed therein (either permanently or temporarily). These sensors sense physical states of the individual wearing the items of apparel and/or of the local environment. In one embodiment, multiple sensors sense, in alternative ways, a parameter that corresponds to a physical state of interest. Information from these alternative sensing approaches is co-processed to yie ld a resultant parameter value that can be used in various ways. In one embodiment, the parameter value is locally or remotely displayed. In one embodiment, the parameter value is used in comparison against risk threshold s to ascertain a degree of risk to the individual.

公开(公告)号：AU2002356062A1

公开(公告)日：2003-03-03

申请号：AU2002356062

申请日：2002-07-13

Applicant: MOTOROLA INC

Inventor： TUNGARE AROON ,  GAMOTA DANIEL ,  SKIPOR ANDREW ,  GHAEM SANJAR ,  CHASON MARC

IPC: B81B3/00 ,  H01H59/00 ,  H05K3/40 ,  B81B7/00 ,  B81C1/00

Abstract: The organic MEMS according to the present invention comprises a polymeric substrate comprising a substrate surface including a first region and a second region. A polymer coating is applied to the first region to provide a coating surface that is spaced apart from the substrate surface. A terminal is disposed on the second region. A metallic trace is affixed to the coating surface such that the metallic trace forms a flexible extension over the second region. The extension has a rest position where the extension is spaced apart from the terminal, and a flexed position where the extension is disposed towards the terminal. An actuator is used to provide an electric field to deflect the extension from the rest position to the flexed position. By changing the spacing between the extension and the terminal, it is possible to change the electrical condition provided by the MEMS.

公开(公告)号：AU2003220371A8

公开(公告)日：2003-10-20

申请号：AU2003220371

申请日：2003-03-12

Applicant: MOTOROLA INC

Inventor： SCHEIFERS STEVEN ,  SKIPOR ANDREW ,  KALYANASUNDARAM KRISHNA ,  GAMOTA DANIEL

IPC: H01L51/05 ,  H01L51/52 ,  H01L23/48

公开(公告)号：AU2003220371A1

公开(公告)日：2003-10-20

申请号：AU2003220371

申请日：2003-03-12

Applicant: MOTOROLA INC

Inventor： SCHEIFERS STEVEN ,  GAMOTA DANIEL ,  SKIPOR ANDREW ,  KALYANASUNDARAM KRISHNA

IPC: H01L51/05 ,  H01L51/52

公开(公告)号：WO02080229A3

公开(公告)日：2003-04-17

申请号：PCT/US0205431

申请日：2002-02-22

Applicant: MOTOROLA INC

Inventor： SCHEIFERS STEVEN M ,  SKIPOR ANDREW ,  GAMOTA DANIEL

IPC: H01L21/60 ,  H01L21/56 ,  H01L23/31 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/06 ,  H01L23/28 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/97 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3157 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A microelectronic assembly (6) includes a substrate (22) having a plurality of bond pads disposed on a substantially planar die attach surface and an integrated circuit die (12) having a die face and a plurality of bond pads of the die (12) face. The die is provided with a polymeric bead (32) about the outer edges of the die. Die face bond pads are aligned with corresponding substrate bond pads and electrically interconnected by heating to a reflow temperature. Exposure of the polymeric bead (32) to the reflow temperature causes the bead to form a peripheral bond between the die and the substrate (22).

Abstract translation: 微电子组件（6）包括：衬底（22），其具有设置在基本上平坦的管芯附接表面上的多个接合焊盘;以及集成电路管芯（12），其具有管芯面和管芯（12）的多个接合焊盘， 面对。 模具设置有围绕模具的外边缘的聚合物珠粒（32）。 模面接合焊盘与相应的衬底接合焊盘对准，并通过加热电连接到回流温度。 聚合物珠粒（32）暴露于回流温度导致珠粒在模头和基底（22）之间形成周边粘结。

公开(公告)号：WO2004007608A2

公开(公告)日：2004-01-22

申请号：PCT/US0320191

申请日：2003-06-26

Applicant: MOTOROLA INC

Inventor： SKIPOR ANDREW ,  SCHEIFER STEVE ,  OLSON BILL

IPC: B01J13/02 ,  H01L21/58 ,  H01L23/14 ,  H01L23/29 ,  C08L

CPC classification number: B29C73/163 ,  B01J13/02 ,  B29C73/22 ,  B82Y30/00 ,  H01L23/145 ,  H01L23/293 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/45611 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01041 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19042 ,  Y10T428/249995 ,  Y10T428/2985 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512

Abstract: A self-healing polymer composition 10 containing a polymer media 12 and a plurality of microcapsules of flowable polymerizable material 16 dispersed in the polymer media 12, where the microcapsules of flowable polymerizable material 16 contain a flowable polymerizable material 15 and have an outer surface 142 upon which at least one polymerization agent 13 is attached. The microcapsules 16 are effective for rupturing with a failure of the polymeric media 12, and the flowable polymerizable material 15 reacts with the polymerization agent 13 when the polymerizable material 15 makes contact with the polymerization agent 13 upon rupture of the microcapsules 14. There is also provided a method of using the self-healing polymeric composition 10 to repair fractures in polymers, as well as articles of manufacture including the self-healing system, and the microencapsulated polymerizable particles 16 themselves.

Abstract translation: 一种自修复聚合物组合物10，其含有分散在聚合物介质12中的聚合物介质12和可流动的可聚合材料16的多个微胶囊，其中可流动的可聚合材料16的微胶囊包含可流动的可聚合材料15并具有外表面142 其中连接有至少一种聚合剂13。 当聚合物15在微胶囊14破裂时与聚合剂13接触时，微胶囊16对于聚合物介质12的破坏是有效的，并且可流动的可聚合材料15与聚合剂13反应。还有 提供了使用自修复聚合物组合物10来修复聚合物中的裂缝的方法，以及包括自愈系统的制品和微囊化的可聚合颗粒16本身。