公开(公告)号：AU2002359885A1

公开(公告)日：2003-07-30

申请号：AU2002359885

申请日：2002-12-31

Applicant: MOTOROLA INC

Inventor： CHASON MARC ,  DANVIR JANICE ,  QI JING ,  YALA NADIA

IPC: H01L21/56 ,  H01L23/31 ,  H05K3/34

公开(公告)号：AU2002356062A1

公开(公告)日：2003-03-03

申请号：AU2002356062

申请日：2002-07-13

Applicant: MOTOROLA INC

Inventor： TUNGARE AROON ,  GAMOTA DANIEL ,  SKIPOR ANDREW ,  GHAEM SANJAR ,  CHASON MARC

IPC: B81B3/00 ,  H01H59/00 ,  H05K3/40 ,  B81B7/00 ,  B81C1/00

Abstract: The organic MEMS according to the present invention comprises a polymeric substrate comprising a substrate surface including a first region and a second region. A polymer coating is applied to the first region to provide a coating surface that is spaced apart from the substrate surface. A terminal is disposed on the second region. A metallic trace is affixed to the coating surface such that the metallic trace forms a flexible extension over the second region. The extension has a rest position where the extension is spaced apart from the terminal, and a flexed position where the extension is disposed towards the terminal. An actuator is used to provide an electric field to deflect the extension from the rest position to the flexed position. By changing the spacing between the extension and the terminal, it is possible to change the electrical condition provided by the MEMS.

公开(公告)号：AU2003268514A8

公开(公告)日：2004-03-29

申请号：AU2003268514

申请日：2003-09-05

Applicant: MOTOROLA INC

Inventor： KALYANASUNDARAM KRISHNA ,  BRAZIS PAUL ,  CHASON MARC ,  GAMOTA DANIEL

IPC: H01L21/78 ,  H01L20060101 ,  H01L21/301 ,  H01L21/58 ,  H01L21/68 ,  H01L21/76 ,  H01L23/538 ,  H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

Abstract: A wafer (10) having integrated circuit elements formed therein is thinned and a first carrier (41) is adhered thereto. The first carrier (41) facilitates handling of the thinned wafer (30). A second carrier (51) is then adhered as well and the various integrated circuits are singulated to yield a plurality of thinned die (81). Once the thinned die is mounted to a desired substrate (91), the first carrier (41) is readily removed. In one embodiment, the first carrier (41) has an adhesive that becomes less adherent when exposed to a predetermined stimulus (such as a given temperature range or a given frequency range of photonic energy). Such thinned die (or modules containing such die) are readily amenable to stacking in order to achieve significantly increased circuit densities.

公开(公告)号：AU2003268514A1

公开(公告)日：2004-03-29

申请号：AU2003268514

申请日：2003-09-05

Applicant: MOTOROLA INC

Inventor： BRAZIS PAUL ,  CHASON MARC ,  KALYANASUNDARAM KRISHNA ,  GAMOTA DANIEL

IPC: H01L20060101 ,  H01L21/301 ,  H01L21/58 ,  H01L21/68 ,  H01L21/76 ,  H01L21/78 ,  H01L23/538

Abstract: A wafer (10) having integrated circuit elements formed therein is thinned and a first carrier (41) is adhered thereto. The first carrier (41) facilitates handling of the thinned wafer (30). A second carrier (51) is then adhered as well and the various integrated circuits are singulated to yield a plurality of thinned die (81). Once the thinned die is mounted to a desired substrate (91), the first carrier (41) is readily removed. In one embodiment, the first carrier (41) has an adhesive that becomes less adherent when exposed to a predetermined stimulus (such as a given temperature range or a given frequency range of photonic energy). Such thinned die (or modules containing such die) are readily amenable to stacking in order to achieve significantly increased circuit densities.

公开(公告)号：AU2002256530A1

公开(公告)日：2003-01-29

申请号：AU2002256530

申请日：2002-05-13

Applicant: MOTOROLA INC

Inventor： CHASON MARC

IPC: C30B25/18 ,  H01L21/20 ,  H01L21/822 ,  H01L21/8258 ,  H01L27/06 ,  H01S5/02 ,  H01S5/026 ,  G01N21/77 ,  H01L27/15

公开(公告)号：AU2003296497A1

公开(公告)日：2004-07-29

申请号：AU2003296497

申请日：2003-12-11

Applicant: MOTOROLA INC

Inventor： CHASON MARC ,  DANVIR JAN

IPC: B81B7/00 ,  H01L21/56 ,  H01L21/60 ,  H01L23/48 ,  H01L31/0203 ,  H01L33/62 ,  H01L23/31 ,  H01L33/00

Abstract: The invention provides a method for attaching a flip chip to a printed wiring board. A bumped opto-electronic or electromechanical flip chip is provided. An underfill material is applied to a first portion of the flip chip, wherein a second portion of the flip chip is free of the underfill material. The flip chip is positioned on a printed wiring board, and a bumped portion of the flip chip is heated to electrically connect the flip chip to the printed wiring board. The second portion of the flip chip remains free of the underfill material when the flip chip is electrically connected to the printed wiring board.

公开(公告)号：DE69019368T2

公开(公告)日：1996-01-04

申请号：DE69019368

申请日：1990-09-17

Applicant: MOTOROLA INC

Inventor： CHASON MARC

IPC: H01J1/304 ,  H01J9/02 ,  H01J29/04 ,  H01J31/12

Abstract: A field emitting device having a plurality of preformed emitter objects. The emitter objects include sharp geometric discontinuities, and a significant number of these geometric discontinuities are oriented in a way that supports desired field emission activity. Field emission devices built with such emitters can be utilized to provide a flat display screen.

公开(公告)号：DE69019368D1

公开(公告)日：1995-06-14

申请号：DE69019368

申请日：1990-09-17

Applicant: MOTOROLA INC

Inventor： CHASON MARC

IPC: H01J1/304 ,  H01J9/02 ,  H01J29/04 ,  H01J31/12

Abstract: A field emitting device having a plurality of preformed emitter objects. The emitter objects include sharp geometric discontinuities, and a significant number of these geometric discontinuities are oriented in a way that supports desired field emission activity. Field emission devices built with such emitters can be utilized to provide a flat display screen.

公开(公告)号：WO2004023528A3

公开(公告)日：2006-11-02

申请号：PCT/US0327966

申请日：2003-09-05

Applicant: MOTOROLA INC

Inventor： BRAZIS PAUL ,  CHASON MARC ,  KALYANASUNDARAM KRISHNA ,  GAMOTA DANIEL

IPC: H01L21/78 ,  H01L20060101 ,  H01L21/301 ,  H01L21/58 ,  H01L21/68 ,  H01L21/76 ,  H01L23/538 ,  H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

CPC classification number: H01L21/6836 ,  H01L21/78 ,  H01L23/5387 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wafer (10) having integrated circuit elements formed therein is thinned and a first carrier (41) is adhered thereto. The first carrier (41) facilitates handling of the thinned wafer (30). A second carrier (51) is then adhered as well and the various integrated circuits are singulated to yield a plurality of thinned die (81). Once the thinned die is mounted to a desired substrate (91), the first carrier (41) is readily removed. In one embodiment, the first carrier (41) has an adhesive that becomes less adherent when exposed to a predetermined stimulus (such as a given temperature range or a given frequency range of photonic energy). Such thinned die (or modules containing such die) are readily amenable to stacking in order to achieve significantly increased circuit densities.

Abstract translation: 其中形成有集成电路元件的晶片（10）变薄，并且第一载体（41）粘附到其上。 第一载体（41）便于处理薄的晶片（30）。 然后粘合第二载体（51），并且将各种集成电路分离以产生多个薄的模具（81）。 一旦将薄的模具安装到期望的基板（91）上，则容易地移除第一载体（41）。 在一个实施例中，第一载体（41）具有当暴露于预定刺激（例如给定温度范围或给定的光子能量的给定频率范围）时变得较不粘附的粘合剂。 这种薄的模具（或包含这种模具的模块）易于堆叠以便实现显着增加的电路密度。